JPS5929037U - 熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置 - Google Patents

熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置

Info

Publication number
JPS5929037U
JPS5929037U JP1982124645U JP12464582U JPS5929037U JP S5929037 U JPS5929037 U JP S5929037U JP 1982124645 U JP1982124645 U JP 1982124645U JP 12464582 U JP12464582 U JP 12464582U JP S5929037 U JPS5929037 U JP S5929037U
Authority
JP
Japan
Prior art keywords
bonding
heating device
bonding tool
tool heating
thermocompression wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982124645U
Other languages
English (en)
Inventor
藤井　義通
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1982124645U priority Critical patent/JPS5929037U/ja
Publication of JPS5929037U publication Critical patent/JPS5929037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の熱圧着ワイヤボンディング装置における
ボンディング用具加熱装置を示す構成説明図、第２図は
本考案に係る熱圧着ワイヤボンディング装置におけるボ
ンディング用具加熱装置の一実施例を示す構成説明図で
ある。 １０・・・ボンディングアーム、１１・・・ボンディン
グ用具、１２・・・電気的抵抗体、１３・・・電源。

Claims (1)

    【実用新案登録請求の範囲】
  1. ボンディングアームの先端部に取り付けられ中央孔にホ
    ンディング用ワイヤを貫通させるボンディング用具の外
    周壁土を電気的抵抗体により被覆し、この抵抗体に電力
    を供給して発熱させることによってボンディング用具を
    加熱するようにしてなることを特徴とする熱圧着ワイヤ
    ボンディング装置におけるボンディング用具加熱装置。
JP1982124645U 1982-08-18 1982-08-18 熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置 Pending JPS5929037U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982124645U JPS5929037U (ja) 1982-08-18 1982-08-18 熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982124645U JPS5929037U (ja) 1982-08-18 1982-08-18 熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置

Publications (1)

Publication Number Publication Date
JPS5929037U true JPS5929037U (ja) 1984-02-23

Family

ID=30284063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982124645U Pending JPS5929037U (ja) 1982-08-18 1982-08-18 熱圧着ワイヤボンデイング装置におけるボンデイング用具加熱装置

Country Status (1)

Country Link
JP (1) JPS5929037U (ja)

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