JPS5928597A - 炭素電極棒の電気メッキ方法及びそのメッキ装置 - Google Patents
炭素電極棒の電気メッキ方法及びそのメッキ装置Info
- Publication number
- JPS5928597A JPS5928597A JP13653982A JP13653982A JPS5928597A JP S5928597 A JPS5928597 A JP S5928597A JP 13653982 A JP13653982 A JP 13653982A JP 13653982 A JP13653982 A JP 13653982A JP S5928597 A JPS5928597 A JP S5928597A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- carbon
- rod
- plated
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 131
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 130
- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000009713 electroplating Methods 0.000 title claims description 13
- 238000007747 plating Methods 0.000 claims abstract description 305
- 239000000243 solution Substances 0.000 claims description 88
- 230000002093 peripheral effect Effects 0.000 claims description 26
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 241000270666 Testudines Species 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 13
- 238000007796 conventional method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003575 carbonaceous material Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 244000269722 Thea sinensis Species 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- 241000124033 Salix Species 0.000 description 1
- 241000270708 Testudinidae Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- CSRZQMIRAZTJOY-UHFFFAOYSA-N trimethylsilyl iodide Substances C[Si](C)(C)I CSRZQMIRAZTJOY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13653982A JPS5928597A (ja) | 1982-08-05 | 1982-08-05 | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13653982A JPS5928597A (ja) | 1982-08-05 | 1982-08-05 | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5928597A true JPS5928597A (ja) | 1984-02-15 |
| JPH0241598B2 JPH0241598B2 (cg-RX-API-DMAC7.html) | 1990-09-18 |
Family
ID=15177551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13653982A Granted JPS5928597A (ja) | 1982-08-05 | 1982-08-05 | 炭素電極棒の電気メッキ方法及びそのメッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5928597A (cg-RX-API-DMAC7.html) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316489A (ja) * | 1988-06-14 | 1989-12-21 | Yamaha Corp | 高速メッキ装置 |
| JPH0238473U (cg-RX-API-DMAC7.html) * | 1988-08-31 | 1990-03-14 | ||
| WO1999010563A3 (de) * | 1997-08-21 | 1999-08-19 | Atotech Deutschland Gmbh | Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken |
| US6652657B2 (en) | 2000-07-31 | 2003-11-25 | United Technologies Corporation | Method for electrochemically treating articles and apparatus and method for cleaning articles |
| WO2009127037A1 (en) * | 2008-04-18 | 2009-10-22 | Integran Technologies Inc. | Electroplating method and apparatus |
| US8734624B2 (en) | 2011-05-30 | 2014-05-27 | Ebara Corporation | Plating apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513034U (cg-RX-API-DMAC7.html) * | 1978-07-13 | 1980-01-28 |
-
1982
- 1982-08-05 JP JP13653982A patent/JPS5928597A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5513034U (cg-RX-API-DMAC7.html) * | 1978-07-13 | 1980-01-28 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01316489A (ja) * | 1988-06-14 | 1989-12-21 | Yamaha Corp | 高速メッキ装置 |
| JPH0238473U (cg-RX-API-DMAC7.html) * | 1988-08-31 | 1990-03-14 | ||
| WO1999010563A3 (de) * | 1997-08-21 | 1999-08-19 | Atotech Deutschland Gmbh | Verfahren und vorrichtung zum energiesparenden gleichzeitigen elektrolytischen behandeln von mehreren werkstücken |
| US6652657B2 (en) | 2000-07-31 | 2003-11-25 | United Technologies Corporation | Method for electrochemically treating articles and apparatus and method for cleaning articles |
| WO2009127037A1 (en) * | 2008-04-18 | 2009-10-22 | Integran Technologies Inc. | Electroplating method and apparatus |
| US8734624B2 (en) | 2011-05-30 | 2014-05-27 | Ebara Corporation | Plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0241598B2 (cg-RX-API-DMAC7.html) | 1990-09-18 |
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