JPS5928080B2 - Die for manufacturing circuit pattern and its manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a die for manufacturing a circuit pattern of a printed circuit, which is manufactured by punching out a circuit pattern from a thin conductive foil with adhesive placed on an insulating substrate using a die, and a method for manufacturing the same. Regarding.

Conventionally, when using a die to punch out a circuit pattern from a thin conductive foil with adhesive that is placed on an insulating substrate, only a die with a sharp cutting blade was used, which resulted in defects such as peeling and wrinkles of the circuit. In order to reduce these defects, a flat die for heating and pressing the conductive foil to adhere it to the insulating substrate and a cutting die for shearing it into circuit patterns are each made into separate dies. A method has been developed in which a conductive foil with an insulating substrate and an adhesive layer is sequentially fed into a flat die and a cutting die at a constant pitch to perform stamping. Because each die has to be prepared, the number of steps required to manufacture each die is long, and the time required for manufacturing is very long, making the mold cost expensive, which in turn affects the circuit cost. Since the molding die and the cutting die are separate, it is necessary to adjust the centering of the die in the press so that the pattern to be heated and pressed precisely overlaps the pattern to be cut during stamping.

Furthermore, in order to organically operate these two types of dies, many mechanical devices and skilled skills were required. In order to resolve the above-mentioned difficulties, the applicant
We have developed a circuit pattern manufacturing die in which a low-height flat die and a high-height cutting die are arranged at a constant pitch d and formed on a single steel substrate. Instead of manufacturing the flat die and cutting die separately as in the past, it can be manufactured with approximately half the man-hours required to manufacture the cutting die. Since there is no need to adjust the pattern of the cutting die, it is possible to improve circuit manufacturing efficiency without requiring skill or complicated equipment.

The die of the present invention is an improvement on the above-mentioned die, and includes a flat die with a low height and a cutting die with a high height arranged at a constant pitch d. To provide a die which can prevent the blade from digging in too much when cutting a circuit pattern by providing a stopping die with a low cutting edge.

This invention further includes a plurality of dies having a low height (flat dies), and one die arranged so that the pitch between the flat dies is d1 and the pitch of the adjacent flat die is d. To provide a die that further exhibits the effect of the die.

This invention consists of drawing lines of uniform width for forming the flat die and cutting die arranged at a fixed pitch d in order to manufacture a single die in which a flat die and a cutting die as described above are installed together. An artwork diagram of the circuit pattern is created on a light-transmitting film so that the part on the drawing line forming the cutting die and the part within the drawing line forming the flat die is transparent, and the other part is opaque.

Then, this artwork drawing or its photographic negative is brought into contact with the steel surface coated with a photoresist material to form a photoresist film, and the first etching (main etching) is performed.
The part without the photoresist film is made into a recess, and the part with the photoresist film is used to form the original shape of the die.Then, the photoresist film is removed and the height of the flat die is lowered by polishing. To provide a method for easily manufacturing a flat die and a cutting die in a parallel state at the same time by performing etching or first performing a second etching and then polishing the flat die to reduce its height. do.

Next, this invention will be explained with reference to the drawings.

FIG. 1 is a cross-sectional view showing an example of a conventional improved die, in which a flat die is placed on one steel base 1 with a pitch d between the center of the cutting die 2 and the center of the flat die 3. 3 forms one die 4 whose height is lower than that of the cutting die 2. FIG. 2 is a cross-sectional view showing the state in which a circuit pattern is manufactured using the die shown in FIG. 1. As shown in FIG. An insulating substrate 8 is placed on the lower mold 7 of the die set on the opposite side.
A metal foil 10 coated with an adhesive 9 on the surface facing the substrate 8 is advanced in the direction of the arrow and stopped, and the upper die 4 is lowered. Since the die is of course heated by the heat of the tubular heater 5, the metal foil 1 is heated with a flat die as shown in the figure.
0 is firmly adhered to the substrate 8 while being slightly deformed, and a circuit pattern is cut by the cutting die 2 located to the right of the center of the flat die 3 by a pitch d. At this time, the pressurization of the flat die 3 is effective in completely eliminating air between the metal foil 10 forming the circuit pattern and the substrate 8. After this is done, the die is opened upwards as shown in Figure C.
The substrate 8 and the metal foil 10 with the adhesive 9 are placed on the right side of the pitch d length (
Proceed in the direction of the arrow).

By this operation, except for the first stage, both sides of the part completely bonded by heating and pressure with the flat die 3 are attached to the cutting die 3.
The metal foil 10 is peeled off and removed from the substrate 8 by cutting in the portions where the flat die 3 does not act, and a circuit pattern can be manufactured continuously and precisely. However, these are not those provided with a stopping die or those provided with a plurality of flat dies 3 at a pitch d. An example of the die of this invention is shown in the cross-sectional view of FIG.
The point that a cutting die 2 and a flat die 3 are provided on a steel base 1 with a pitch d is the same as in the case of FIG. 3
A stopping die 3S having the same height as that is provided.

This stopping die is formed in an area smaller than the space area between the flat die 3 and the cutting die 2, and when the substrate 8, which is fed at a constant pitch, reaches the final position as shown in the figure, It is possible to prevent the blade of the cutting die from biting into the substrate 8 too much.

FIG. 4 is a cross-sectional view of a die according to the present invention in which a plurality of flat dies 3 are provided at a pitch d.

In other words, in order to adhesively fix metal foil to a substrate, the temperature and pressing time of the flat die must be sufficient to melt the adhesive.
. Heat is absorbed by the metal foil, and the temperature of the flat die decreases, and when the pressure is released, the temperature returns to normal. As the stamping speed of the die is gradually increased, the temperature equilibrium is broken, and the next pressing is performed before the temperature of the flat die, which has lost heat, has recovered, so the temperature gradually decreases and the metal foil is heated during stamping. Adhesive fixation may be insufficient. By providing a plurality (n) of flat dies, a large heat capacity can be provided, and the stamping speed (number of strokes) can be increased by about n times compared to a die provided with only one flat die. In this way, a die with multiple flat dies can be made using the same manufacturing process as a die with one flat die, and one die can have two functions: pressing and cutting. It is.

If the circuit patterns are arranged at regular pitches during artwork, there will be no need to make centering adjustments to determine the installation positions of the flat die for heating and pressing and the cutting die for pattern punching during stamping. First, the die itself is relatively easy to manufacture, the mold cost is low, and circuit patterns can be provided at low cost.

Next, the manufacturing method of the present invention will be explained with reference to FIG. 5. As shown in FIG. A cutter attached to an automatic drawing machine draws seven putter patterns.
On the left side, the transparent film within the image line is left and the light-shielding film is removed, and on the right side, the light-shielding film is removed in a portion corresponding to the width of the image line, leaving the transparent film.

(The light shielding area is indicated by diagonal lines) Next, as shown in figure b, a photoresist film is formed on the surface of the steel material using the artwork diagram shown in figure a or a photographic negative obtained from it. do. Figure c is A of figure b.
In the enlarged view of the 1N cross section, numeral 11 is a photoresist film. If main etching (side etching) is performed on this, a concave part without the photoresist film will be formed as shown in Figure d, and the original shape of the flat die on the left and the cutting die on the right will be created in the area where the photoresist film 11 is located. It will be done. Then e
After peeling off the photoresist film as shown in the figure and polishing the height of the part that will become the flat die on the left by t1 to lower it, finish etching is performed as shown in figure f to form the cutting die into a pointed shape. At the same time, the flat die is subjected to final etching to obtain a completed die of the present invention as shown in Fig. g.

The difference in height between the cutting die and the flat die in the completed die is T2. In addition, after removing the resist film as shown in figure e, immediately perform etching to finish the cutting die, and then polish the top of the flat die to make the height of the flat die t1 lower than the height of the cutting die. You can also make it shorter. The height difference between the cutting die and the flat die must be large enough to shear the foil and adhesive on the substrate. When the difference in height between the force-bearing die and the flat die in the completed die is T2, t1≧T2
There is a relationship between It is preferable to perform the polishing before the final etching because the edge of the flat die can be rounded and there is no risk of scratches caused by the flat die on the foil on which the circuit pattern is manufactured.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a die that is a combination of a conventional flat die and a cutting die, Figure 2 is a cross-sectional view showing how such a die is used to manufacture a circuit pattern, and Figure 3 is a cross-sectional view of a die that is a combination of a conventional flat die and a cutting die. A cross-sectional view when the stopping die of the invention is added and a cross-sectional view showing its functional state, FIG. 4 is a cross-sectional view when the number of flat dies is n, and FIGS. In the explanatory diagram of the manufacturing method, a is an artwork diagram, b is a front view when a photoresist film is set on steel material, c is an enlarged cross-sectional view taken along the A-N line in diagram b, and d is the main liquid from the direction of the arrow. sectional view after etching; e is a sectional view after resist removal; f is a sectional view after polishing the flat die surface and finishing etching with liquid from the direction of the arrow; g is a sectional view of the completed die. be. 1... Steel base, 2... Cutting die, 3... S... Stopping die, 8...
...Base tone agent, 10...Metal foil, 11...
...Photoresist film.

Claims (1)

[Claims] 1. A low-height flat die and a high-height cutting die arranged at a constant pitch d on one steel base, and a low-height stock die in the outer cavity area of the cutting die. A die for producing a circuit pattern, characterized by being provided with a pin die. 2 A plurality of low-height flat dies (n pieces) are provided on one steel base with a pitch d between the flat dies, and one high-height cutting die is connected to the adjacent flat die. A die for manufacturing circuit patterns provided with pitch d. 3. A cutting die is formed by forming a circuit pattern on a light-transmissive film, which is arranged at a constant pitch d, with one edge serving as a cutting die and the other edges forming lines of uniform width to form a flat die. Create an artwork diagram so that the area above the drawing line and the part within the drawing line that forms the flat die is transparent, and the rest is opaque, and then apply the artwork diagram or its photo to the surface of the steel material coated with photoresist material in advance. A negative is brought into contact and exposed to light to form a photoresist film corresponding to the transparent part, and the first etching (main etching) is performed to make the part without the photoresist film into a recess, and the part with the photoresist film to form a die. After that, the photoresist film is removed, the height of the flat die is lowered by polishing, and the entire die is finished by a second etching process to create a completed die having a flat die and a cutting die. A method for manufacturing a die for manufacturing a circuit pattern.