JPS5927408A - Method of forming electrode for display - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] The invention is inspired by a method of forming display electrodes.

Generally, display cells are provided with display electrodes for controlling display. For example, in a liquid crystal display cell that displays dots, the inner surface of one glass substrate 1 of a pair of glass substrates 1 . A strip-shaped electrode 3 extending in the horizontal direction is formed of a transparent conductive material, and a transparent glass substrate 2
As shown in FIG. 1(b), a plurality of dot electrodes 4 are formed of a transparent conductive material and are commonly connected in the vertical direction. In the glass substrate 2, in order to improve electrical conductivity,
As shown in FIG. 2, a metal lead 5 made of metal such as chromium (CR) or nickel (N1) is also formed on the pole 4 and its lead 4.

When forming display electrodes without metal leads 5, conventionally, a transparent conductive film such as indium oxide (InzOs) is formed on the surface of the substrate 2, and a resist film is formed on this conductive film. After that, the resist film is exposed to light in a manner that corresponds to the electrode pattern, and then unnecessary portions of the resist film are removed by development, and the conductive film is etched in a manner that corresponds to the electrode pattern, and then the remaining resist is removed. The dot electrode 4 and its leads were formed by peeling off the film.

Furthermore, when forming a front paw electrode having a metal lead 5, conventionally, a transparent conductive film is formed on the surface of the substrate 2, a metal film such as chromium or nickel is deposited on the transparent conductive film, and then After this, a resist film is applied and formed, and then exposed to light corresponding to the resist mtt lead pattern,
By removing the resist film in areas that do not correspond to the lead portions by development, and removing only the metal film corresponding to the removed portions by etching, 1, first, a metal lead 5 made of a metal film is formed, and then the resist film is etched again. , metal lead 5
Then, a resist film is formed on the transparent conductive film, exposed to light in correspondence with the electrode pattern, and unnecessary portions of the resist film that do not correspond to the electrode pattern are removed by development, followed by etching.
Furthermore, by removing unnecessary parts of the film, the pole 4 and its leads were formed.

However, when forming an electrode with a fine dot display pattern, there is a risk that dust, clouds, etc. may cause etching failure in the fine MS (insulating part) between the dot electrode 4 and the lead 4a, resulting in a short circuit. It was extremely expensive.

Therefore, as a means of removing this short-circuited part, it may be possible to cut it with a loser beam, but this requires special equipment and is expensive, and it is difficult to search and find the short-circuited part. It requires a lot of effort.

The present invention was made against the background of the above-mentioned circumstances, and its purpose is to provide a method for forming display electrodes that does not require special equipment and allows short-circuited portions to be easily and reliably removed. It's about doing.

Hereinafter, the method for forming display electrodes according to the present invention will be explained with the third concave and the 40th concave being intersected. Note that FIG. 3 shows the manufacturing process of a display electrode without metal leads, and the fourth figure shows the manufacturing process of a display electrode with metal leads. First, as shown in Figure 3 (a) to explain the manufacturing process of the third step, a transparent conductive film 1 is placed on the surface of a transparent glass substrate 10.
1 is formed [7, After this, the conductive film 11 is cleaned and a photoresist @12 is formed thereon.

Then, the photoresist film 12 is exposed using an exposure mask corresponding to the pattern of the display electrodes and their leads, and developed (this removes unnecessary portions of the photoresist film 12 (portions that do not correspond to the electrode pattern pattern). Figure 93 (・
The photoresist 11g12 is negative. After the unnecessary portions of the photoresist 1I415-2 are removed in this way, the photoresist film 12 is hardened.
Photoresist film 1 is etched with an etching solution.
The conductive film 11 in the cylindrical portion where No. 2 was removed is removed. FIG. 3(c) shows this state, in which the conductive film 11 on the front surface of the glass substrate 10 remains in a portion corresponding to the electrode pattern.

After this, the remaining photoresist film 12 is removed as shown in FIG.
Peel and clean as shown. In this case, Figure 3 (d)
shows a case in which no short circuit occurs in the insulating parts A and H between the conductive films 11, but if the insulating part ANB is minute, etching failure may occur due to dust or the like, and a short circuit may occur. Therefore, after that, a photoresist film 13 is again uniformly coated and formed on the conductive film 11 as shown in FIG. 3(E), and the same process as described above is repeated.

In other words, Figures 3(E) to 3(H) are similar to the above-mentioned Figure 3(E) to (H).
Processes similar to those in the manufacturing steps (a) to (d) are performed, and FIG. 3 (e) shows a case where a short circuit C occurs. Then, as shown in FIG. 3(e), the photoresist film 13
After the photoresist (6) was formed on the conductive wX11, this photoresist (13) was superimposed on the previously formed electrode pattern using the same mask used for the first exposure, and then exposed for the second time. do the
Thereafter, unnecessary portions of the photoresist film 13 are removed by development.

FIG. 3(f) shows this state. Thereafter, as shown in FIG. 3(G), the conductive film 11 is etched to remove the short circuit portion C. Subsequently, the remaining photoresist film 13 is peeled off and washed as shown in FIG. 3(H), thereby forming a transparent electrode 14 without any short-circuited portions.

In this way, according to the above method for forming display electrodes, patterning is performed twice using the same exposure mask, so that the short-circuited parts in the first patterning are removed in the second patterning. As a result, the transparent electrode 14 is formed with high precision.

Therefore, there is no need for troublesome checking work to search for and find short circuits, and no special equipment is required.
Short-circuited portions can be reliably removed using an easy and inexpensive method.

This method is different from the manufacturing process shown in FIG. 3 described above in that only the point 1 and the gold film are etched to form metal leads. Fourth
Figure (A) shows the process corresponding to Figure 3 (E) which is carried out after the first buttering process corresponding to Figures 3 (A) to (D), but in this case, Glass substrate 2
A transparent conductive film 21 is formed on the surface of □, then a metal film 22 is formed on the conductive film 21, and a photoresist film (not shown) is further formed on this metal film 22. ) After coating and forming, the exposure and development process is carried out in the same way as in the above case.
The etching process and peeling process are performed sequentially, and the metal M
7 Otregis) Jli23t-m cloth was formed on 22. Note that D indicates a short circuit portion that was not etched in the first buttering. After that, using the same mask as that used for the first exposure of photoresist $23, a second exposure is performed by superimposing it on the previously formed electrode pattern, and then, by development, unnecessary parts of the photoresist film 23 are removed. is removed, resulting in the state shown in FIG. 4 (b). After that, as shown in Figure 4 (c), lead 1! When the film 21 and the metal film 22 are etched with an etching solution, the short circuit portion is removed.

Subsequently, the photoresist film 23 is peeled off and washed as shown in the fourth step (d), and the transparent electrode 24 without any short-circuited portions is formed.
is formed. In this way, by performing buttering twice using the same exposure mask, the parts shorted in the first buttering are removed in the second buttering, resulting in the rope shape shown in Figure 3. The same effect can be obtained.

FIGS. 4(E) to 4(H) show the manufacturing process of the metal lead. That is, the metal film 22 is cleaned), and this gold film 22 is cleaned.
A photoresist film 25 is again coated and formed on lj[22 as shown in FIG. By development, as shown in FIG. 4(f), unnecessary portions of the photoresist film 25 (portions 9-) not corresponding to the lead pattern are removed. Thereafter, the photoresist film 1925 that was not removed is etched using an etching solution, and only the metal film 22 at the location where the photoresist film 25 was removed is removed. Thereafter, when the photoresist 25 is peeled off and washed, the metal leads 26 of the metal film 22 are formed on the lead portions on the transparent electrode 24#, as shown in FIG. 4(H).

Note that the present invention is not limited to the above-mentioned embodiments, and can be modified and applied in various ways without departing from the scope of the present invention.

As explained above, according to the method for forming display electrodes according to the present invention, resist is applied again to the electrodes that have been patterned, and then exposed and developed again using the same mask used for the first exposure. By performing the etching process, etching process, and peeling process, the parts that were shorted in the first buttering are removed in the second buttering, and as a result, the troublesome checking work of searching for and finding shorted parts is eliminated. Since this is unnecessary and no special equipment is required, the short circuit can be reliably removed by an easy and inexpensive method.

[Brief explanation of the drawing]

Fig. 1 shows a liquid crystal cell, Fig. 1 (-) is a plan view of its strip electrode, Fig. 1 (b) is a plan view of a dot electrode, and Fig. 2
The figures are cross-sectional views of the main parts of Figures 1 (a) and (b), and Figure 3 (a).
-(+) and FIGS. 4(a) to (+) are manufacturing process diagrams in the method for forming display electrodes according to the present invention. 10.20...Glass substrate, 11.21...
...Transparent conductive film, 12.13.23.25...
- Photoresist film, 14.24...Transparent electrode, 22...Metal film, 26...Metal lead. Patent applicant Casio Computer Co., Ltd. 11- Figure 1 (a) Figure 3 (a)
σN)yu)
(to)su (d) (→
] Figure 4 (a) (
e) (+) 1111 −111

Claims (1)

[Claims] A conductive film that forms a conductive film on the surface of a substrate. Membrane A-shaped plum and
A first resist film forming step in which a resist group is formed as a brittle cloth on this guide I film, and after this resist film is exposed using a mask for ll1t corresponding to the electrode pattern, unnecessary portions of the resist film are removed. The first exposure and development process,
After this exposure and development process, the conductive film is etched, and the conductive film is removed in unnecessary parts that do not correspond to the electrode pattern.The resist film remaining after this etching process is peeled off. After crushing, a resist layer is applied to the surface of the substrate again from the conductive film to form a second resist film. a second exposure/electroconductive step in which unnecessary portions of the resist film are removed after exposure using a mask; and a 21st etching step in which the conductive film is re-etched after this exposure/development step. and a second peeling step of peeling off the resist film remaining after this etching step.