JPS5927119Y2 - Cooling structure for electronic equipment - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a cooling structure for an electronic device equipped with a large number of printed wiring boards.

Generally, large electronic devices are provided with an air cooling device for forcibly cooling components that generate heat.

FIG. 1 is a partially cutaway perspective view of a conventional cooling structure for an electronic device.

In the figure, 1 is a mounting body, 2 is an upper plate provided on the upper surface of the mounting body 1 with a gap, 3 is a front door of the mounting body 1, 4 is a vent provided at the bottom of the front door 3, and 5 6 is a mounting frame installed in the upper body 1, and 6 is a plurality of rack cases fixed by screws 7 that are mounted on the mounting frame 5 in multiple stages above and below.
Reference numeral 8 indicates a plurality of printed wiring boards arranged perpendicularly to each rack case 6 in the horizontal direction, 9a indicates a fan assembly provided at the top of the mounting frame 1, and 9b indicates a rack case 6.
In between, for example, one fan assembly is installed in every few rack cases 6.

Although not shown, the rack case 6 has vents formed on the top, bottom, rear, etc. for air to flow through.

Here, when the fan assemblies 9 a and 9 b operate and the fans rotate, the cooling air entering from the vent 4 is
It flows through the rack case 6 to cool the printed wiring board 8 and the heat-generating electronic components mounted on the rack case 6, and then rises further and flows out from the gap between the stand 1 and the upper plate 2.

However, in such a conventional cooling structure,
Cooling air is heated as it rises from the bottom to the top, so the temperature of cooling air that enters a rack case from below increases because it is heated by the lower rack case.

For this reason, the cooling effect becomes smaller as the rack case is located on the upper stage.

Therefore, even if printed wiring boards are standardized and standardized, the intake air temperature inside the rack case in which they are installed differs, so the rate of thermal stress applied to each printed wiring board must be considered individually to calculate failure rates and maintain maintenance. It is necessary to set a period, which makes electrical design extremely troublesome.

In addition, since the space for the fan assembly is located in the same device as the rack case, the effective space of the rack case is taken up, which results in a lack of flexibility in setting the mounting position and number of the rack case. Since the fan motor is close to the printed wiring board, there is a problem that it picks up noise.

This idea was conceived with these points in mind.
The purpose is to provide a cooling structure for electronic devices that can uniformly cool each rack case without taking up much space.

In order to achieve this purpose, this invention forms the inside of the mounting frame and rack case base hollow,
Cooling air is allowed to flow through this.

This invention will be explained in detail below based on the drawings.

FIG. 2 is a perspective view of an embodiment of the cooling structure for an electronic device according to this invention.

In the figure, the mounting body 1. Top plate 2. The front door 3 and the vent 4 are the same as the conventional one shown in FIG.

Reference numeral 15 indicates a mounting frame that is hollow inside and extends vertically and is provided in pairs on the left and right; 16 is a mounting frame 1;
For example, six rack cases are installed in a vertical multi-tiered structure between the frame 15 and the rack case 17.
Screws 18 are installed in the rack case 16 so as to be arranged horizontally and vertically, and 19 is a screw with a dustproof net provided at the lower end of the mounting frame 15 and communicating with the hollow interior. It is a fan assembly.

Note that the front door 3 is shown in an open state. Here, when the fan assembly 19 operates and the fan rotates, the cooling air entering the giant body 1 from the vent 4 is transferred to the mounting frame 15.
Enter the hollow interior of and rise inside.

Since the upper end of the mounting frame 15 is formed closed,
The cooling air that has entered the mounting frame 15 rises and enters the base of each rack case 16 in parallel, cooling the inside of the rack case 16.

Next, the detailed structure of each part will be explained.

FIG. 3 is a partial perspective view of the mounting frame 15.

15a is the hollow part of the mounting frame 15, 15b is the screw 17
A tapped hole formed on the front end surface for screwing the 15C,
Reference numeral 15d- denotes a support protrusion formed on the inner side surface of the mounting frame 15 with a curved front portion and elongated in the front-rear direction, and 15e and 15f are openings of the support protrusion 15C515d that communicate with the hollow portion 15a.

The support protrusions 15C and 15d are provided at opposing positions on the inner side surface of each mounting frame 15, respectively.

In FIG. 3, each of the support protrusions 15C and 15d is placed on one side, but a plurality of these are provided at predetermined distances apart, and the separate support protrusions 15C and 15d form one rack case 16. A set of supporting protrusions is configured to support the.

FIG. 4 is a perspective view of the rack case 16.

21 is a mounting bracket for fixing the rack case 16 to the front end surface of the mounting frame 15; 21a is a mounting hole formed in the mounting bracket 21 through which the screw 17 passes; 22 is a lower base having a hollow interior. 22 a is a support groove that is open at the rear and is formed on both side surfaces of the lower base 22 through the inside; 23 is a main base that is hollow inside; 23 a is a support groove that is open on both sides of the main base 23; 24 is a support groove that is open at the rear and is connected to the inside of the lower base 2.
For example, seven board connectors are arranged in parallel in the horizontal direction on 2.

Although not shown in FIG. 4, board connectors 25 are also arranged on the main base 23 at positions facing the base connectors 24.

Note that 18a is a board main body of the printed wiring board 18, and 18b is a board panel.

Connect the board main body 18a to the board connector 24.2 as shown by the arrow.
5 and insert the printed wiring board 18 into the rack case 1.
Install it on 6.

Here, the support grooves 22a and the support grooves 23a and 23a of FIG.

Note that the front end surfaces of the support convex portions 15C and 15d shown in FIG. 3 are curved because of the support grooves 22a and 2
This is to facilitate the insertion of 3a.

FIG. 5 is a sectional view taken along the line V--■ in FIG. 4 with the rack case 16 attached to the mounting frame 15.

22b is a hollow portion formed inside the lower base 22;
C is a vent hole formed between the board connectors 24 on the top surface of the lower base 22, 23b is a hollow part formed inside the base 23, and 23C is a board connector 2 on the bottom surface of the main base 23.
The ventilation hole formed between 5 and 26 is the rack case 1.
The rear plate 26a of 6 is a plurality of ventilation holes formed in the upper part of the rear plate 26.

Note that FIG. 5 shows a state in which the printed wiring board 18 is not mounted.

Also, although not shown, on the rack case 16. Another rack case 16 is attached below in exactly the same manner.

Here, the cooling air that has flowed through the hollow part 15a of the mounting frame 15 enters the hollow part 22b of the lower base 22 through the opening 15e of the support convex part 15C, and then enters the hollow part 22b of the lower base 22.
It flows into the rack case 16 from below.

Similarly, the cooling air flows through the opening 15 f of the support convex portion 15 d.
It passes through the hollow part 23b of the main base 23, and further flows into the rack case 16 from above through the ventilation hole 23C.

FIG. 6 is a sectional view taken along line VI-VI in FIG.

Note that the mounting frame 15 is omitted in FIG. 6.

Vent holes 22C, 23 from hollow parts 22b, 23b
The cooling air that flows into the rack case 16 through C cools the heat-generating components, and then passes through the ventilation holes 26 formed in the rear plate 26.
It flows backward from a.

The outflowing air rises inside the giant body 1 and flows out from the upper end.

In this embodiment, the hollow passage through which cooling air flows is formed in the necessary parts, such as the mounting frame, lower board, and upper board, so there is no need to provide a separate dedicated cooling passage, and no extra space is taken up. .

Furthermore, since the cooling air flows into each rack case in parallel from the mounting frame, air of the same temperature flows into all the rack cases, and the cooling effect is uniform.

Therefore, failure rate calculations and maintenance periods for electronic components on printed wiring boards in each rack case can be set under the same conditions, making electrical design work easier.

Furthermore, since the cooling air that enters through the vents flows along the entire surface of the printed wiring board, electronic components mounted thereon are efficiently cooled and heat dissipation characteristics are improved.

Further, since there is no need to provide fan assemblies between rack cases or above and below rack cases, flexibility in mounting each rack case is improved and arrangement layout is facilitated.

Furthermore, since the fan assembly is placed apart from the rack case, noise from the fan motor is reduced, and malfunctions do not occur even when handling minute level signals.

As described above, according to the cooling structure for an electronic device according to the present invention, it is possible to reduce the size without taking up much space, and since each rack case can be cooled evenly, it has the effect of greatly simplifying both the mechanical design and the electrical design.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a conventional cooling structure for an electronic device, FIG. 2 is a perspective view of an embodiment of the cooling structure for an electronic device according to this invention, FIG. 3 is a partial perspective view of a mounting frame, and FIG. 4 is a perspective view of the rack case, Fig. 5 is a sectional view taken along the line ■-■ of Fig. 4 with the rack case attached to the mounting frame, and Fig. 6 is a cross-sectional view of the rack case attached to the mounting frame.
It is a VI-VI sectional view of a figure. 15... Mounting frame, 15 C, 15d...
...Support convex portion, 16...Rack case, 1
8...Printed wiring board, 19...Fan assembly, 22...Lower base, 23...
... Upper base, 22 a, 23 a --- Support groove, 22 C, 23 C, 26 a --- Ventilation port,
24, 25... Board connector, 26...
・Rear plate.

Claims (1)

[Scope of utility model registration request] A supporting convex portion having an opening through the inside is provided at opposing positions on the sides of a pair of mounting frames each having a hollow inside, and the inside of the base of the rack case on which the printed wiring board is vertically mounted is formed hollow. At the same time, a support groove communicating with the interior is provided on the side end surface of the base, and the rack case is attached to the mounting frame so that the support protrusion fits into the support groove, and the cooling air flowing inside the mounting frame is A cooling structure for an electronic device, in which cooling flows into the base through a support convex portion and a support groove.