JPS59231887A - Method for etching picture line on irregular surface or flatsurface of printed board or the like using uv ink - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to printed circuit boards (coated with a metal film such as copper foil), various metal products, and various metal plated products, such as various plate-like products thereof, tableware, decorative items, etc. Electrical component,
Conventionally, for glass products such as tableware, decorative items, and architectural supplies, etching methods, cutting or polishing methods, etc. ) Curved surfaces such as metal surfaces and glass surfaces that cannot be
A special 114-form concave tK on an uneven surface such as a spherical surface or a mo surface.
A thick layer of UV ink (ultraviolet photosensitive resin ink) is printed using an intaglio transfer printing method, the printed IJV ink is cured (hardened), and the printed image is used as a protective film for etching. L is applied to the uneven surface or flat surface of the printed circuit board and other various articles,
A printer using all UV inks that enables easy and precise etching and allows the desired drawing lines to be drawn freely and smoothly 1 - A method for etching drawing lines on an uneven surface or a flat surface of a substrate, etc. It is.

The features of the present invention are as follows: 1) Among the various printing methods currently in use, intaglio transfer printing is capable of printing not only on flat surfaces but also on uneven surfaces such as curved and spherical surfaces. (Octopus mark #31 Also called N pad press or tambo press), this intaglio transfer printing method can be used to print UV ink on uneven or flat surfaces of printed circuit boards, etc. .

2) The above-mentioned intaglio transfer printing (the intaglio plate used here has a special structure, so that the production of the intaglio plate can be easily performed using etching processing heat, and 11) the UV ink layer thickness printing required by the present invention can be achieved. An intaglio plate with deep concave portions suitable for this purpose was provided.

Namely 1. Conventionally, intaglio transfer printing (the intaglio used in this process is produced by etching), but this requires a lot of work for the etching process, and it is difficult to obtain deep edges in the intaglio C plate. Therefore, since it is not possible to easily and precisely manufacture I'Fj suitable for the 7-layer thickness of υV ink (for example, about 6μ) required by the present invention, the present invention uses the method described later to easily and precisely manufacture the indentation. This is an intaglio plate with a deep (plate) section.

3), and the present invention uses the above intaglio plate and prints a thick layer of UV ink on the uneven surface or lower surface of the metal surface or glass surface portion of a printed circuit board etc. by the intaglio transfer printing method. This method is characterized by etching the UV ink printed lines as a protective film by quenching (curing).

As a result, with the conventional method, it would be extremely difficult to perform precise printing lines on a metal or glass surface with an uneven surface. This makes it possible to perform this process very easily and precisely.

4) In particular, JV inks with extremely diverse properties have now been developed, and after printing, they harden within a few seconds after being exposed to ultraviolet rays, making them strong and having excellent chemical resistance. If a thick film is formed and printed with a thick layer as in the present invention, it will be enough for etching processing. Since it is removable, it is most suitable and essential for carrying out the present invention.

Hereinafter, the method of the present invention will be explained with reference to examples. 2),
A silicone film (3) (a film with a desired layer thickness, e.g., 6 μm) is formed on the silicone film (3), and the negative dimension of the drug/this is the positive θ.
0), and through exposure, baking and development (washing) processes, the silicone film (3) corresponding to the photocured portion of the photosensitive film (2) is removed, forming a concave (plate) portion (4). An intaglio A having been formed thereon is provided. (Fig. 1)" Two words intaglio used to be one
) As mentioned in IJ, it may be a 7-inch piece formed by etching, or in this investigation, the concave/3rd edition part (1) is a silicon film (
3) is formed by removing I12.Therefore, by adjusting the layer thickness of the silicon film (3), the depth of the recessed portion (4) can be freely obtained from 1 to 1. However, from the purpose of the present invention, It is necessary to print a thick layer, and the thickness for normal printing is also deep (e.g.,
The intaglio for 111 is 3 /
is the rank. )Form.

Next, using the intaglio A prepared above,
Using ink (7) 1. Using the intaglio transfer marking method, the various target articles mentioned above, such as the uneven surface of the glint substrate (5), the metal or glass plate (6), or the "F"
Apply the desired drawing line (Print I/Circuit, the design to its confidence 7, etc.) on a metal surface or glass surface with a layer thickness of U.
V Ingi mark tjil Ii example, thickness about 6μ) I2 (second
Figures, (A), (B)), Mark 11 The printed IJ V ink is cured by passing the printed pudding 1 to the substrate (5), plate (6), etc., through an appropriate ultraviolet irradiation device. A protective film (!'/V) of UV ink is formed (Fig. 2, 0→).

Then, the printed circuit board (7) on which the protective film (7)' was formed
5), plate (6) etc?・Appropriate etching processing (etching liquid immersion d→washing treatment) is performed 1~, and the protective film (η' is dissolved and removed with an appropriate remover 1~2).The desired marking line (9)
That is, depending on the purpose, the image line represented by the part covered by the protective film (η' or, conversely, the part not covered by it) may be printed flush with the printed circuit board (5), plate (6), or other various products. (Part 2 a).

In the drawings, (Ill represents an ink roll, ([ri represents an octopus used for concave plate transfer printing, and (+3) represents an ultraviolet lamp.

Since the present invention is based on the following method, for example, various circuits are formed on a printed circuit board by thick U
Formation of a V-ink protective film can be done precisely, easily, and freely by etching, and it can also be formed on curved, spherical, or other uneven surfaces or flat parts of all kinds of metal products, metal plated products, glass products, etc. Flexible printing lines can be drawn by etching, and etching can be applied to various products in industry, architecture, daily necessities, and other fields, which would have been completely impossible or difficult using conventional methods. It has such excellent features that it can be done in an extremely simple and precise manner.

[Brief explanation of the drawing]

(-f), (b), and (c) in Fig. 1 are explanatory diagrams showing the production order of intaglio plates used in the present invention; (f), (0) in Fig. 2;
(c), ni),)y++ is applied to a printed circuit board and book as an example using the intaglio plate and UV ink produced in Fig. 1.
FIG. 7 is an explanatory diagram showing the order of the method of the present invention. Amount A: Intaglio plate used in the method of the present invention, (I)... plate removal, (2) photoresist film, (3)... silicon film,
(4)...Concave (plate) part, (5)-...Printed circuit board,
(6)--metal or glass plate, (7)...UV
Ink, (7)'...protective film, (8)...etching, (9)...line, 00)...negative' or positive,
01)-- Ink roll, zero... Octopus for intaglio transfer printing, 03)-- Ultraviolet lamp. Applicant 1” Honbunka Seiji Co., Ltd. Figure 1 (A) Figure 2

Claims (1)

[Claims] - Form a sensitive round film and a silicon film of a desired thickness on the plate material in the inner chamber, and then form a negative film on the silicon film. ! : After the 6-dimensional positive is abutted 12 times, exposed to light, baked, and developed (washed), a portion of the silicone film corresponding to the photosensitive hardened portion of the photosensitive film is removed and the concave (plate) portion is formed. Next, using the -h intaglio plate and UV ink, an intaglio transfer printing method was used to form the uneven surface of the printed circuit board, etc.
7. Thick layer printing of zero-grain lines on flat metal surfaces, etc. , Complete protective film formation 17. Appropriately etching the protective film/r formation 1~, etching the parts other than the protective film, and dissolving and removing the entire protective film after etching with an appropriate remover. Take it, take it,
Print 1 - A method of etching the uneven surface or flat surface of a printed circuit board, etc. using UV ink, in which a desired drawing line can be freely drawn on the uneven surface or flat surface of a printed circuit board, etc.