JPS59230281A - Method of connecting lead - Google Patents
Method of connecting leadInfo
- Publication number
- JPS59230281A JPS59230281A JP10325083A JP10325083A JPS59230281A JP S59230281 A JPS59230281 A JP S59230281A JP 10325083 A JP10325083 A JP 10325083A JP 10325083 A JP10325083 A JP 10325083A JP S59230281 A JPS59230281 A JP S59230281A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- leads
- lead
- heating
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は一基板上のリードをフレキシブルワイヤケー
プＶＶＣ＃ｐ続する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for connecting leads on one substrate to a flexible wire cape VVC#p.
たとえば第１図に示すようにアルミナのようなセラミッ
クかちなる基板１の表面にバターニングされた複数のＩ
Ｊ −ｙ ２を外部に導出するために、フレキシブルワ
イヤケーブル（以下ＩＫＦＷＣと言う。）３を使用する
こと値！ある。ＦＷＣ’８は樹脂製のシート４とこの表
面にバターニングされたリード５と九ち構成されている
うそして画リード２．５の接続にあたってはリード２．
５の表面にハンダを付着させてお央、両Ｑ ＋ Ｆが互
ＬｎｌＣ接触し合うように重ね合わせ−これを加圧加熱
してハンダ付けするよりにしてｂる。For example, as shown in FIG. 1, a plurality of I
Use a flexible wire cable (hereinafter referred to as IKFWC) 3 to lead J-y 2 to the outside. be. The FWC'8 is composed of a resin sheet 4 and a lead 5 patterned on the surface thereof.The lead 2.5 is used to connect the image lead 2.5.
After applying solder to the surface of 5, the two Q+Fs are placed one on top of the other so that they are in contact with each other, and then soldered by applying heat and pressure.
し７５ニジ従来では第２図に示すように加圧具６自体を
発熱させ、加圧具６で重ね合わせた部分を加圧するとと
もに、加圧具６赤氏の熱でその重ね合わせ部分を加熱す
るようにしてｂた。７は受台である。これによれば所要
のハンダ付行は可能であるとして木々のよりな問題ガあ
った、すなわちＦＷＣｓは前記のよりに樹脂製のシート
４０表面にリード５雀バターニングされて構成されてい
乙。Conventionally, as shown in Fig. 2, the pressurizing tool 6 itself generates heat, pressurizes the overlapping part with the pressurizing tool 6, and heats the overlapping part with the heat of the pressurizing tool 6. I tried to do so. 7 is a pedestal. According to this, although the necessary soldering was possible, there was a further problem with the trees, that is, the FWCs were constructed by patterning the resin sheet 40 on the surface of the resin sheet 40.
今第２図のよりに基板１に対してＦＷＣ８を重ねると負
−リード２．５同志−ｈｆ向か１合つよりに重ねるので
、上面けり一ト４の裏面側となる。ことで加圧具６によ
り加熱すふと−これかちの熱はシート４をその厚さ方向
に横切ってリード５に到達する。シート４は極めて薄す
ので−このように熱−ｂＸｔｆＩｔ切って伝導されると
き一溶解等のような熱破損を起こしゃすｈ欠点がある。Now, if the FWC 8 is stacked on the substrate 1 as shown in FIG. 2, the negative leads 2.5 and 5 and hf will be stacked one against the other, so that they will be on the back side of the upper surface cutout 4. As a result, the heat heated by the pressing tool 6 reaches the leads 5 across the sheet 4 in its thickness direction. Since the sheet 4 is extremely thin, it has the disadvantage that it can suffer thermal damage, such as melting, when heat is conducted.
との発明はＩＪ −）’同志の半田付けに際し、一方の
り−Ｆを有す石樹脂シートの熱破損を防ぐことを目的と
する。The purpose of the invention is to prevent heat damage to a stone resin sheet having one glue-F when soldering IJ-)'.
この発明は両リードを重ね合わせた状態でＦＷＣａｂら
は加圧のみを行な−、加熱は基板側赤ち行なうようにし
たことを特徴とする。The present invention is characterized in that the FWCab and the like are only applied with pressure in a state where both leads are overlapped, and heating is performed on the substrate side.
この発明の実施例をｔＪＣ８図により齢明すると。Examples of this invention will be explained in detail using the tJC8 diagram.
基板１とＦＷＣ３とをその各リード２．５同志が向赤−
合りよう＃Ｃ重ね合わせ、その菫ね合わせ部分を加熱加
圧して、ＩＪ ｍ ％’表面のハンダを溶赤してハンダ
付けしよりとする趣旨は従来と同じである。しかしこの
発明では重ね合わせ部分を加圧す乙のに加圧具１１を使
用するが、この加圧具は第２図のように加熱には何の役
目を果さ々ｂ０加熱は、ヒーＪ１２を用意し、前記重ね
合わせ部分をに−Ｊ１１２の上にのせる。そしてとのＥ
−夕１２によって重ね合わせ部分を加熱する。すなわち
ヒータ１２赤ちの熱は基板ｌを経てリード２．５に伝導
されることになる。この場合一基板１５ｆＦＷＣ８より
Ｋｍけれど本材質がセラミックであるため熱伝導性零よ
りし、又熱応力に対して本強すので、基板１の裏面赤ち
の加熱が可能である。この熱によってリード表面のハン
ダ水溶は−とのとき加圧具１１によってリード２．５同
志例加圧されてｂるので、リーＰｉ ５はハンダ付けさ
れること＜１ふ。このときと−タかちの熱をシート４を
槓切ってリー）６に伝導させる必要はな帆ので一シート
４の熱破損はこれを本って確実に防止できるようになる
。Each lead 2.5 of board 1 and FWC 3 is facing red.
The purpose of overlapping #C and applying heat and pressure to the overlapped portion to melt red the solder on the surface of IJ m %' and tighten the solder is the same as in the conventional method. However, in this invention, a pressurizing tool 11 is used to pressurize the overlapping portion, but this pressurizing tool plays no role in heating as shown in Figure 2. Prepare and place the overlapping portion on Ni-J112. And with E
- Heating the overlap by 12 minutes. That is, the red heat of the heater 12 is conducted to the leads 2.5 via the substrate 1. In this case, one substrate 15fFWC8 is more Km, but since the material is ceramic, its thermal conductivity is less than zero, and it is highly resistant to thermal stress, so it is possible to heat the back surface of the substrate 1 to red. Due to this heat, the water-soluble solder on the lead surface is pressurized by the pressurizing tool 11, so that the lead Pi 5 is soldered. At this time, there is no need to cut the sheet 4 and conduct the heat to the lee 6, so thermal damage to the sheet 4 can be reliably prevented.
以上のよちにこの発明によれば、ＦＷＣのり−Ｆを基板
のリードにハンダ付けするにあたり、ＦＷＣを構成して
偽る樹脂シートを横切って熱を伝導させることがな−の
で、樹脂シートの熱破損を確実に防止で会ふとと１へ前
記樹ｍｖ−トとして耐熱性の低Ｌ−ｈＦＷｃを使用する
ことができるといった効果を奏する。As described above, according to the present invention, when soldering the FWC glue-F to the leads of the board, heat is not conducted across the resin sheet that constitutes the FWC, so the heat of the resin sheet is reduced. The effect is that a low heat resistant L-hFWc can be used as the wood for the footwear 1 while reliably preventing damage.
第１図はリードの接続綿様を示す斜視図、第２図は従来
方法の実施工程を示す正面図、第８図はとの発明方法の
実施工程を示す正面図である。
１一基板、！−・・リーＶ、 ８ ＝−ＦＷＣ％４−・
−・シート−Ｓ ・−・−・リ−）−１１・・−・・加
圧具、１ ｇ −・−と−タ
代理人中沢謹之助・。
１ ′
１、−FIG. 1 is a perspective view showing the connecting thread of the lead, FIG. 2 is a front view showing the implementation steps of the conventional method, and FIG. 8 is a front view showing the implementation steps of the invention method. 11 board! −・・Lee V, 8 =−FWC%4−・
-・Sheet-S・−・−・Lee−)−11・・・・Pressure tool, 1 g−・− and -ta agent Kinnosuke Nakazawa・. 1 ′ 1, -
Claims (1)
ルワイヤケーブルのリードとを互いニ重ね合わせ一前記
基板側からその基板の鷹さ方向を横切って前記重ね合わ
せ部分のリードにヒータかちの加熱用の熱を伝導させて
前肥り−Ｆの表面のハンダを溶かすとともに一前肥フレ
キシブルワイヤケーブル側ｆｒｈ Ｇ、前記重ね合わせ
部分を加圧し、前記加圧と加熱とによって両Ｕ −１’
をハンダ付けして接続してなるリード接続方法。The leads on the surface of the ceramic substrate and the leads of the flexible wire cable are overlapped with each other. Heat for heating from a heater die is applied from the board side across the vertical direction of the board to the leads of the overlapped portion. The conduction is conducted to melt the solder on the surface of the first pre-fertilizing wire cable side frh G, and the overlapping portion is pressurized, and by the pressurization and heating, both U-1'
The lead connection method consists of soldering and connecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10325083A JPS59230281A (en) | 1983-06-09 | 1983-06-09 | Method of connecting lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10325083A JPS59230281A (en) | 1983-06-09 | 1983-06-09 | Method of connecting lead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59230281A true JPS59230281A (en) | 1984-12-24 |
| JPH0335784B2 JPH0335784B2 (en) | 1991-05-29 |
Family
ID=14349194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10325083A Granted JPS59230281A (en) | 1983-06-09 | 1983-06-09 | Method of connecting lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59230281A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442988U (en) * | 1977-08-29 | 1979-03-23 | ||
| JPS54158665A (en) * | 1978-05-24 | 1979-12-14 | Hitachi Chemical Co Ltd | Circuit board and method of producing same |
| JPS55145395A (en) * | 1979-04-27 | 1980-11-12 | Matsushita Electric Ind Co Ltd | Method of connecting printed circuit board |
| JPS57118389A (en) * | 1981-01-14 | 1982-07-23 | Hitachi Ltd | Method of soldering taped wire |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442988B2 (en) * | 1972-03-11 | 1979-12-17 |
-
1983
- 1983-06-09 JP JP10325083A patent/JPS59230281A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5442988U (en) * | 1977-08-29 | 1979-03-23 | ||
| JPS54158665A (en) * | 1978-05-24 | 1979-12-14 | Hitachi Chemical Co Ltd | Circuit board and method of producing same |
| JPS55145395A (en) * | 1979-04-27 | 1980-11-12 | Matsushita Electric Ind Co Ltd | Method of connecting printed circuit board |
| JPS57118389A (en) * | 1981-01-14 | 1982-07-23 | Hitachi Ltd | Method of soldering taped wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0335784B2 (en) | 1991-05-29 |
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