JPS59226831A - Pyroelectric type infrared sensor - Google Patents

Pyroelectric type infrared sensor

Info

Publication number
JPS59226831A
JPS59226831A JP58102115A JP10211583A JPS59226831A JP S59226831 A JPS59226831 A JP S59226831A JP 58102115 A JP58102115 A JP 58102115A JP 10211583 A JP10211583 A JP 10211583A JP S59226831 A JPS59226831 A JP S59226831A
Authority
JP
Japan
Prior art keywords
electrode
pyroelectric
type semiconductor
joined
cooled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58102115A
Other languages
Japanese (ja)
Inventor
Naoki Uruma
閏間 直樹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP58102115A priority Critical patent/JPS59226831A/en
Publication of JPS59226831A publication Critical patent/JPS59226831A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02Constructional details
    • G01J5/06Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G01J5/061Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats

Abstract

PURPOSE:To obtain a small-sized, lightweight sensor with high reliability by arranging the cooling surface of a thermoelectric cooling element on a surface of a pyroelectric element other than an infrared-ray photodetection surface with an electrode between. CONSTITUTION:The thermoelectric cooling element 15 is composed of an N type semiconductor 4 and a P type semiconductor 5; the side of an electrode 3 is the cooling surface and the sides of electrodes 6 and 7 are a heating surface. The heating surface is joined to a radiation plate 9 and prevent an abnormal temperature rise by natural radiation. The cooling surface is joined to the electrode and joined to the pyroelectric element 1, which is cooled. When infrared rays are made incident through a photodetection window 14, the temperature of the pyroelectric element 1 rises and is cooled intermittently at this time. Namely, an impulsive voltage is impressed to the thermoelectric cooling element 15, which is cooled and heated intermittently and repeatedly to develop the impulsive voltage.

Description

【発明の詳細な説明】 本発明は、赤外線を受けて温度変化したときに電圧を発
生する焦電型赤外線センサの改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a pyroelectric infrared sensor that generates a voltage when the temperature changes upon receiving infrared rays.

九゛ 焦電型赤外線センサは、センサ自身の温度変化がなけれ
ば電圧を発生しないものであるため、赤外線受光面を外
部より断続的に遮光して強制的に温度変化を与えなけれ
ばならない。一般的な遮光方法としては、モータに遮光
板を取り付は回転させるか、チョッパにより断続的に遮
光する方法がとられる。しかし、これらは機械的なもの
であるため、形状が大きくなり、信頼性も劣るという問
題があった。
Since a pyroelectric infrared sensor does not generate voltage unless there is a temperature change in the sensor itself, the infrared receiving surface must be intermittently shielded from light from the outside to force a temperature change. As a general light shielding method, a light shielding plate is attached to a motor and rotated, or a chopper is used to intermittently shield light. However, since these are mechanical, there are problems in that they are large in size and have poor reliability.

本発明は上記点に鑑み、焦電型赤外線センサの温度を強
制的に変化させる構成として、焦電素子と熱電冷却素子
を一体化する構造により行い、生形化、高信頼性を得る
ことができる焦電型赤外線センサを提供することを目的
とする。
In view of the above points, the present invention employs a structure that integrates a pyroelectric element and a thermoelectric cooling element as a configuration for forcibly changing the temperature of a pyroelectric infrared sensor, thereby achieving bioformation and high reliability. The purpose is to provide a pyroelectric infrared sensor that can

以下本発明を図に示す一実施例により説明する。The present invention will be explained below with reference to an embodiment shown in the drawings.

図において、■はLiTaO3,LiNbO3゜PZT
等の材料から成る焦電素子で、片面に電極2を設け、他
の片面に導電性接着剤等で電極3が設けられている。4
はBi2Se2.Bi2Te3等の材料から成るN形半
導体、5はBi2Te3゜S b 2 T e 3等の
材料から成るP形半導体である。
In the figure, ■ indicates LiTaO3, LiNbO3゜PZT
It is a pyroelectric element made of materials such as, and has an electrode 2 on one side and an electrode 3 on the other side with a conductive adhesive or the like. 4
is Bi2Se2. 5 is an N-type semiconductor made of a material such as Bi2Te3, and 5 is a P-type semiconductor made of a material such as Bi2Te3°S b 2 Te 3.

N形半導体4の片端とP形半導体5の片端は、導電性接
着剤等で電極3の片面に接着される。またN形半導体4
とP形半導体5の他片面は、それぞれ電極6.7が接着
される。これら電極6,7は絶縁l!8を介して放熱板
9に接合される。10はFET等の電気回路素子、11
は電気回路素子10の支持台、12はセラミック、樹脂
等で形成される固定土台、13はケース、14は透明状
基板からなる受光窓である。
One end of the N-type semiconductor 4 and one end of the P-type semiconductor 5 are adhered to one side of the electrode 3 with a conductive adhesive or the like. Also, N-type semiconductor 4
An electrode 6.7 is bonded to the other side of the P-type semiconductor 5 and the other side of the P-type semiconductor 5, respectively. These electrodes 6, 7 are insulated! It is joined to a heat sink 9 via 8. 10 is an electric circuit element such as FET, 11
12 is a support base for the electric circuit element 10, 12 is a fixed base made of ceramic, resin, etc., 13 is a case, and 14 is a light receiving window made of a transparent substrate.

そこで、N形半導体4とP形半導体5とでもって熱電冷
却素子15を形成し、電極3側が冷却面、電極6,7側
が加熱面となる。加熱面は放熱板9に接合されているた
め自然放熱を行ない異常温度上昇を防止している。また
、冷却面は電極3に接合され、焦電素子1に接合される
ため、焦電素子1は冷却されることになる。受光窓14
より赤外線が入光すると焦電素子1の温度が上昇する。
Therefore, a thermoelectric cooling element 15 is formed by the N-type semiconductor 4 and the P-type semiconductor 5, with the electrode 3 side serving as a cooling surface and the electrodes 6 and 7 sides serving as a heating surface. Since the heating surface is joined to the heat radiating plate 9, natural heat radiation is performed and abnormal temperature rise is prevented. Moreover, since the cooling surface is joined to the electrode 3 and to the pyroelectric element 1, the pyroelectric element 1 is cooled. Light receiving window 14
As more infrared rays enter, the temperature of the pyroelectric element 1 increases.

この時に断続的に焦電素子1を冷却する。すなわち熱電
冷却素子15にパルス状の電圧を印加すれば、焦電素子
1が断続的に冷却・加熱を繰り返すことになるので、焦
電素子1はパルス状の電圧が発生ずることになる。第2
図は、第1図の焦電型赤外線センサの等価回路図であり
、A−0間に熱電冷却素子15へのパルス状電圧を印加
する。焦電素子1の出力はS−0間に現れる。
At this time, the pyroelectric element 1 is intermittently cooled. That is, if a pulsed voltage is applied to the thermoelectric cooling element 15, the pyroelectric element 1 will intermittently repeat cooling and heating, and thus a pulsed voltage will be generated in the pyroelectric element 1. Second
The figure is an equivalent circuit diagram of the pyroelectric infrared sensor shown in FIG. 1, in which a pulsed voltage is applied to the thermoelectric cooling element 15 between A-0. The output of the pyroelectric element 1 appears between S-0.

以上述べたように本発明に成る焦電型赤外線センサは、
機械的チョッパを使用することなく焦電素子の加熱・冷
却が行なえるので信頼性が高く小形軽量なものを提供す
ることができる。
As described above, the pyroelectric infrared sensor according to the present invention is
Since the pyroelectric element can be heated and cooled without using a mechanical chopper, it is possible to provide a highly reliable, small and lightweight device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及びm2図は本発明の一実施例を示1−断面図及
び等価回路図である。 1・・・焦電素子、2,3,6.7・・・電極、4・・
・N型半導体、5・・・P型半導体、8・・・絶縁膜、
9・・・方’1熱板、10・・・電子回路素子、11・
・・支(青白、12・・・固定土台、13・・・ケース
、14・・・受光窓、15・・・熱電冷却素子。 代理人弁理士 岡 部   隆
FIGS. 1 and 2 are a sectional view and an equivalent circuit diagram showing an embodiment of the present invention. 1... Pyroelectric element, 2, 3, 6.7... Electrode, 4...
・N-type semiconductor, 5...P-type semiconductor, 8...insulating film,
9...way'1 hot plate, 10...electronic circuit element, 11...
... Support (blue and white, 12... Fixed base, 13... Case, 14... Light receiving window, 15... Thermoelectric cooling element. Patent attorney Takashi Okabe

Claims (1)

【特許請求の範囲】[Claims] 焦電素子の赤外線受光面以外の面に電極を介して熱電冷
却素子の冷却面を配置したことを特徴とする焦電型赤外
線センサ。
A pyroelectric infrared sensor characterized in that a cooling surface of a thermoelectric cooling element is arranged on a surface other than the infrared receiving surface of the pyroelectric element via an electrode.
JP58102115A 1983-06-07 1983-06-07 Pyroelectric type infrared sensor Pending JPS59226831A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58102115A JPS59226831A (en) 1983-06-07 1983-06-07 Pyroelectric type infrared sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58102115A JPS59226831A (en) 1983-06-07 1983-06-07 Pyroelectric type infrared sensor

Publications (1)

Publication Number Publication Date
JPS59226831A true JPS59226831A (en) 1984-12-20

Family

ID=14318797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58102115A Pending JPS59226831A (en) 1983-06-07 1983-06-07 Pyroelectric type infrared sensor

Country Status (1)

Country Link
JP (1) JPS59226831A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2365209A (en) * 2000-07-22 2002-02-13 Bae Sys Electronics Ltd Thermal sensing apparatus with reset means involving intermittently providing thermal path between a detector and a thermal sink

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2365209A (en) * 2000-07-22 2002-02-13 Bae Sys Electronics Ltd Thermal sensing apparatus with reset means involving intermittently providing thermal path between a detector and a thermal sink

Similar Documents

Publication Publication Date Title
CA1225721A (en) Infra-red radiation detector
US4110616A (en) Pyroelectric detectors
JPS6196690A (en) Radiation source for infrared irradiation
JPWO2003006939A1 (en) Infrared array detector
JPH01295449A (en) Cooling type solid-state image sensing device
JPS59226831A (en) Pyroelectric type infrared sensor
JPH0821767A (en) Infrared detector and preparation thereof
JP2004279103A (en) Pyroelectric infrared sensor and infrared imaging device using it
JPS6021781Y2 (en) infrared detector
JPS59189619A (en) Pyroelectric element
JPH0532917B2 (en)
GB2133615A (en) Pyroelectric infra-red radiation detector
US3802925A (en) Temperature compensating differential radiometer
JPS6159884A (en) Solar battery module
GB2283362A (en) Pyroelectric infrared array sensor
JPH02206733A (en) Infrared ray sensor
JPH06326831A (en) Picture device
JPH11153490A (en) Semiconductor infrared ray detector
JP2603384Y2 (en) Pyroelectric infrared detector
JP3657701B2 (en) Photodetector
JP2725494B2 (en) Infrared detector
JPS6140523A (en) Thermocouple type infrared detection element
JPH0718984Y2 (en) High sensitivity temperature detector
JPH1183633A (en) Thermal infrared detector
JPS61222359A (en) Semiconductor device