JPS59225882A - ハンダ槽 - Google Patents
ハンダ槽Info
- Publication number
- JPS59225882A JPS59225882A JP10125883A JP10125883A JPS59225882A JP S59225882 A JPS59225882 A JP S59225882A JP 10125883 A JP10125883 A JP 10125883A JP 10125883 A JP10125883 A JP 10125883A JP S59225882 A JPS59225882 A JP S59225882A
- Authority
- JP
- Japan
- Prior art keywords
- molten solder
- chamber
- solder
- tank
- outlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 62
- 239000007788 liquid Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 10
- 230000003068 static effect Effects 0.000 abstract description 3
- 230000004888 barrier function Effects 0.000 abstract 1
- 238000007664 blowing Methods 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 239000002253 acid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000474 nursing effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10125883A JPS59225882A (ja) | 1983-06-07 | 1983-06-07 | ハンダ槽 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10125883A JPS59225882A (ja) | 1983-06-07 | 1983-06-07 | ハンダ槽 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59225882A true JPS59225882A (ja) | 1984-12-18 |
| JPH0134713B2 JPH0134713B2 (enExample) | 1989-07-20 |
Family
ID=14295884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10125883A Granted JPS59225882A (ja) | 1983-06-07 | 1983-06-07 | ハンダ槽 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59225882A (enExample) |
-
1983
- 1983-06-07 JP JP10125883A patent/JPS59225882A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0134713B2 (enExample) | 1989-07-20 |
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