JPS59225532A - Method for carrying and positioning lead frame - Google Patents

Method for carrying and positioning lead frame

Info

Publication number
JPS59225532A
JPS59225532A JP10199683A JP10199683A JPS59225532A JP S59225532 A JPS59225532 A JP S59225532A JP 10199683 A JP10199683 A JP 10199683A JP 10199683 A JP10199683 A JP 10199683A JP S59225532 A JPS59225532 A JP S59225532A
Authority
JP
Japan
Prior art keywords
lead frame
roller means
positioning
raised
feeding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10199683A
Other languages
Japanese (ja)
Inventor
Makoto Shimanuki
嶋貫　誠
Yukio Yamauchi
山内　幸雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10199683A priority Critical patent/JPS59225532A/en
Publication of JPS59225532A publication Critical patent/JPS59225532A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To enable to carry and position the lead frame at a high speed and thus contrive to speed up the assembly of the semiconductor device by a method wherein the lead frame is carried by being pinched with an upper and lower pair of feeding roller means. CONSTITUTION:Said roller means 6 and 7 are separated above and below the lead frame 1. Next, the feeding roller means 6 is lowered, and the feeding roller means 7 is raised, thus both coming into contact with the lead frame 1, which frame is then pinched under some pressure from above and below. Successively, when the roller means 7 is driven by rotation, the lead frame is carried as an arrow to the longitudinal direction by frictional force. On feeding the lead frame 1 to a fixed distance, the rotational drive of the roller means 7 is stopped, the roller means 6 and 7 being raised and lowered to feedback, and at the same time a positioning pin 4 thus being raised, resulting in positioning by insertion to a positioning hole 2.

Description

【発明の詳細な説明】 〔発明のｉ術分野〕 この発明は、半導体装置の組立工程において、半導体素
子を装着するなどのためのリードフレームの搬送及び位
置決め方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for transporting and positioning a lead frame for mounting a semiconductor element in a semiconductor device assembly process.

〔従来技術〕[Prior art]

ダーイボンディング、ワイヤポンディングなどにおける
従来のリードフレームの搬送及び位置決め方法は、第１
図（ａ）〜（ｄ）に工程順に示すリードフレーム部の斜
視図で示すようにしていた。第１図（ａ）において、（
１）はダイポンディング前のリードフレームであり、何
も取付けられていないが、例えばワイヤポンディング前
の状態では、半導体素子（。The conventional lead frame transportation and positioning method in die bonding, wire bonding, etc.
Figures (a) to (d) are perspective views of the lead frame portion shown in the order of steps. In Figure 1(a), (
1) is a lead frame before die bonding, and nothing is attached to it, but for example, before wire bonding, a semiconductor element (.

図示は略す）が取付けられている。（２）はリードフレ
ーム（１）の位置決め穴、（３）はリードフレーム（１
）の送り穴、（４）はり−ド７レーム（１）の下方に固
定側の所定位置に配設されていて、上下動される位置決
メヒン、（５）は送シ爪具である。(not shown) is attached. (2) is the positioning hole of the lead frame (1), and (3) is the positioning hole of the lead frame (1).
) a feed hole, (4) a positioning mechanism which is disposed at a predetermined position on the fixed side below the beam door frame (1) and is moved up and down, and (5) a feed claw tool.

まず、第１図（ｂ）に示すように、送り爪具（５）を下
降し送り穴（３）に挿入する。つづいて、（Ｃ）図のよ
うに、送シ爪具（５）を矢印Ａ方向に移動することにょ
シ、リードフレーム（１）を長手方向に所定距離搬送す
る。次に、（ｄ）図に示すように、位置決めビン（４）
を上昇し、位置決め大（２）に差込みリードフレーム（
１）の位置決めをする。同時に送シ爪具（５）を上昇し
反対方向に矢印Ｂのように移動復帰させる。First, as shown in FIG. 1(b), the feed claw (5) is lowered and inserted into the feed hole (3). Subsequently, as shown in FIG. 3C, the feed claw (5) is moved in the direction of arrow A, and the lead frame (1) is conveyed a predetermined distance in the longitudinal direction. Next, as shown in (d), the positioning bin (4)
, and insert it into the positioning large (2) lead frame (
1) Position. At the same time, the feed claw (5) is raised and returned by moving in the opposite direction as indicated by arrow B.

このように一連の動作を繰返すことにより、リードフレ
ーム（１）を送り穴（３）の１ピツチ宛搬送し位置決め
をしていく０ 上記従来のリードフレームの搬送及び位置決め方法では
、送り爪具（５）は四角形状の運動をし外ければならず
、１回の搬送に要する時間は０．５秒以上になり、これ
よシ短縮することは困難であり、実用的には１秒程度で
行われることが多かった。By repeating this series of operations, the lead frame (1) is conveyed to one pitch of the feed hole (3) and positioned. 5) requires a rectangular movement, and the time required for one transfer is more than 0.5 seconds, which is difficult to shorten; in practical terms, it is about 1 second. It was often done.

しかしながら、近来、生産性向上のため半導体装置の組
立装置も高速化が図られ、ダイボンディング、ワイヤポ
ンディングにおけるリードフレームの搬送及び位置決め
方法の高速化への要求が大きくなってきたが、従来の方
法では対処できなく阻害となっていたＯ 〔発明の概要〕 この発明は、上下１対の送′シローラ手段によシリード
フレームを挾んで搬送するようにし、リードフレームを
高速で搬送及び位置決めができ、半導体装置の組立てが
高速化され生産性が向上される、リードフレームの搬送
及び位置決め方法を提供することを目的としている。However, in recent years, semiconductor device assembly equipment has become faster in order to improve productivity, and there has been a growing demand for faster lead frame transport and positioning methods in die bonding and wire bonding. [Summary of the Invention] In this invention, the lead frame is pinched and transported by a pair of upper and lower feed rollers, and the lead frame can be transported and positioned at high speed. It is an object of the present invention to provide a method for transporting and positioning a lead frame, which speeds up the assembly of semiconductor devices and improves productivity.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明９一実施例によるリードフレームの搬送
及び位置決め方法を、第２図（ａ）〜（ｄ、）に工程順
に示すリードフレーム部の斜視図により説明する。第２
図（ａ）において、（６）　、　（７）は上下１対の送
ジロー２手段であり、リードフレーム（１）の上方及び
下方に離されている。次に、（ｂ）図に示すように、送
シローラ手段（６）を下降するとともに、送りローラ手
段（力を上昇し共にリードフレーム（１）に接し、上下
から若干加圧して挾付けるようにするＯつづいて、（Ｃ
）図のように、ローラ手段（７）を回転駆動すると、リ
ードフレーム（１）は摩擦力によυ長手方向に矢印人の
ように搬送される。リードフレーム（１）を所定距離送
ると、（ｄ）図に示すように、ロー２手段（７）の回転
駆動を停止し、送りローラ手段（６）及び（７）を上昇
及び下降復帰させると同時に、位置決めピン（４）を上
昇し位置決め穴（２）に差込み位置決めする０ このように一連の動作を繰返すことによりζ　リードフ
レーム（１）を位置決め穴（２）の１ピツチ宛搬送し位
置決めをしていく０ 上記一実施例による方法の実績結果では、１回の搬送及
び位置決めに要する時間が０．１秒までも実現できた。Hereinafter, a method for conveying and positioning a lead frame according to a ninth embodiment of the present invention will be explained with reference to perspective views of the lead frame section shown in the order of steps in FIGS. 2(a) to 2(d). Second
In Figure (a), (6) and (7) are a pair of upper and lower feeding gills, which are separated above and below the lead frame (1). Next, as shown in figure (b), the feed roller means (6) is lowered, and the force of the feed roller means (6) is increased so that both contact the lead frame (1) and clamp it by applying slight pressure from above and below. Then, (C
) As shown in the figure, when the roller means (7) is driven to rotate, the lead frame (1) is conveyed in the longitudinal direction υ as indicated by the arrow due to frictional force. When the lead frame (1) is fed a predetermined distance, the rotational drive of the row 2 means (7) is stopped and the feed roller means (6) and (7) are raised and returned to a lower position, as shown in figure (d). At the same time, raise the positioning pin (4) and insert it into the positioning hole (2) for positioning. By repeating this series of operations, the ζ lead frame (1) is conveyed to one pitch of the positioning hole (2) and positioned. According to the actual results of the method according to the above-mentioned example, the time required for one time of conveyance and positioning could be achieved up to 0.1 seconds.

しかし、実用的には０．２秒程度が最も安定して処理で
きる時間であるｏしかも、搬送及び位置決めの確実さに
おいても、上記従来方法と変らないことが確認された０ なお、上記実施例では、リードフレーム（１）は長さが
比較的短い場合を示したが、数メートル以上の長尺のリ
ードフレームの場合にも適用できるものである。However, in practical terms, approximately 0.2 seconds is the most stable processing time.Moreover, it was confirmed that the reliability of transport and positioning is no different from the conventional method described above. Although the case where the lead frame (1) is relatively short has been shown, the present invention can also be applied to a lead frame having a length of several meters or more.

また、上記実施例では、１対の送りローラ手段（６）、
（７）のうち、下方のローラ手段（力を回転駆動するよ
うにしたが、上方のローラ手段（６）を回転駆動するよ
うにしてもよい。Further, in the above embodiment, a pair of feed roller means (6),
In (7), although the lower roller means (force is rotationally driven), the upper roller means (6) may be rotationally driven.

さらに、上記実施例では、リードフレーム（１）の搬送
停止時は、上、下方のローラ手段を共に上昇。Furthermore, in the above embodiment, when the lead frame (1) is stopped being conveyed, both the upper and lower roller means are raised.

下降させ、リードフレーム（１）から離した位置にした
が、いづれか一方のローラ手段はリードフレーム（１）
に接する位置のままにしておくようにしてもよい。The roller means is lowered and placed at a position away from the lead frame (1), but one of the roller means is connected to the lead frame (1).
It is also possible to leave it in a position where it is in contact with .

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明の方法によれば、上下１対の送
シローラ手段によシリードフレームを挾付は搬送するよ
うにしだので、リードフレームを高速で搬送及び位置決
めができ、半導体装置の組立てが高速化でき生産性が向
上される。As described above, according to the method of the present invention, the lead frame is clamped and transported by a pair of upper and lower feed roller means, so that the lead frame can be transported and positioned at high speed, and the semiconductor device can be transported and positioned at high speed. Assembly speed is increased and productivity is improved.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（ａ）〜（ｄ）は従来のリードフレームの搬送及
び位置決め方法を工程順に承すリードフレーム部の斜視
図、第２図（ａ）〜（ｄ）はこの発明の一実施例による
リードフレームの搬送及び位置決め方法を工程順に示す
リードフレーム部の斜視図である。 １・・・リードフレーム、２・・・位置決め穴、４・・
・位置決めビン、６．′７・・・送シローラ手段なお、
図中同一符号は同−又は相当部分を示す。 代理人　大岩増雄FIGS. 1(a) to (d) are perspective views of a lead frame section that undergoes a conventional lead frame conveyance and positioning method in the order of steps, and FIGS. 2(a) to (d) are according to an embodiment of the present invention. FIG. 3 is a perspective view of a lead frame portion showing a method for conveying and positioning a lead frame in the order of steps. 1...Lead frame, 2...Positioning hole, 4...
・Positioning bin, 6. '7...Feeding roller means,
The same reference numerals in the figures indicate the same or corresponding parts. Agent Masuo Oiwa

Claims (1)

【特許請求の範囲】[Claims] 水平状態に配置１７たリードフレームを上、下１対のロ
ーラ手段で挾付け、これらのローラ手段のうちいづれか
一方を回転駆動し、上記リードフレームを長手方向に所
定距離搬送してローラ手段の回転駆動を停止し、双方の
ロー２手段のうち少なくともいづれか一方をリードフレ
ームから引離すとともに、固定側の位置決めピンをリー
ドフレームの位置挑め穴に差込みリードフレームの位置
決めをす号ことを特徴とするリードフレームの搬送及び
位置決め方法。A lead frame arranged horizontally is held between a pair of upper and lower roller means, one of these roller means is driven to rotate, the lead frame is conveyed a predetermined distance in the longitudinal direction, and the roller means are rotated. A lead characterized in that the drive is stopped, at least one of the two low means is pulled away from the lead frame, and the positioning pin on the fixed side is inserted into the position challenge hole of the lead frame to position the lead frame. How to transport and position the frame.
JP10199683A 1983-06-06 1983-06-06 Method for carrying and positioning lead frame Pending JPS59225532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10199683A JPS59225532A (en) 1983-06-06 1983-06-06 Method for carrying and positioning lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10199683A JPS59225532A (en) 1983-06-06 1983-06-06 Method for carrying and positioning lead frame

Publications (1)

Publication Number Publication Date
JPS59225532A true JPS59225532A (en) 1984-12-18

Family

ID=14315432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10199683A Pending JPS59225532A (en) 1983-06-06 1983-06-06 Method for carrying and positioning lead frame

Country Status (1)

Country Link
JP (1) JPS59225532A (en)

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