JPS59223282A - セラミツクスの加工方法 - Google Patents
セラミツクスの加工方法Info
- Publication number
- JPS59223282A JPS59223282A JP58096727A JP9672783A JPS59223282A JP S59223282 A JPS59223282 A JP S59223282A JP 58096727 A JP58096727 A JP 58096727A JP 9672783 A JP9672783 A JP 9672783A JP S59223282 A JPS59223282 A JP S59223282A
- Authority
- JP
- Japan
- Prior art keywords
- processing
- machining
- energy
- surface area
- ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 48
- 238000000034 method Methods 0.000 title claims description 25
- 238000003754 machining Methods 0.000 claims description 53
- 239000012530 fluid Substances 0.000 claims description 25
- 239000002253 acid Substances 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- 238000005868 electrolysis reaction Methods 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000006061 abrasive grain Substances 0.000 claims description 5
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- 235000011118 potassium hydroxide Nutrition 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000003672 processing method Methods 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000003513 alkali Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 150000007513 acids Chemical class 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004814 ceramic processing Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000001247 metal acetylides Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001784 detoxification Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58096727A JPS59223282A (ja) | 1983-05-30 | 1983-05-30 | セラミツクスの加工方法 |
| US06/615,416 US4559115A (en) | 1983-05-30 | 1984-05-30 | Method of and apparatus for machining ceramic materials |
| EP84303619A EP0131367B1 (en) | 1983-05-30 | 1984-05-30 | Method of and apparatus for machining ceramic materials |
| DE198484303619T DE131367T1 (de) | 1983-05-30 | 1984-05-30 | Verfahren und einrichtung zum bearbeiten von keramischen werkstoffen. |
| DE8484303619T DE3477590D1 (en) | 1983-05-30 | 1984-05-30 | Method of and apparatus for machining ceramic materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58096727A JPS59223282A (ja) | 1983-05-30 | 1983-05-30 | セラミツクスの加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59223282A true JPS59223282A (ja) | 1984-12-15 |
| JPS6234715B2 JPS6234715B2 (enrdf_load_stackoverflow) | 1987-07-28 |
Family
ID=14172760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58096727A Granted JPS59223282A (ja) | 1983-05-30 | 1983-05-30 | セラミツクスの加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59223282A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104519A (ja) * | 1991-10-18 | 1993-04-27 | Kansai Electric Power Co Inc:The | 石材の電気的破壊方法 |
| JP2000109385A (ja) * | 1998-10-02 | 2000-04-18 | Japan Fine Ceramics Center | セラミックスの加工方法および加工用工具 |
| JP2013236018A (ja) * | 2012-05-10 | 2013-11-21 | Tokyo Seimitsu Co Ltd | ダイシング装置及びダイシング方法 |
| CN106113291A (zh) * | 2016-06-27 | 2016-11-16 | 哈尔滨工业大学 | 一种微波切割装置 |
| JP2016209998A (ja) * | 2016-09-16 | 2016-12-15 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62294463A (ja) * | 1986-06-12 | 1987-12-21 | Hokkai Koki Kk | 金属材の連続粉体塗装装置 |
-
1983
- 1983-05-30 JP JP58096727A patent/JPS59223282A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05104519A (ja) * | 1991-10-18 | 1993-04-27 | Kansai Electric Power Co Inc:The | 石材の電気的破壊方法 |
| JP2000109385A (ja) * | 1998-10-02 | 2000-04-18 | Japan Fine Ceramics Center | セラミックスの加工方法および加工用工具 |
| JP2013236018A (ja) * | 2012-05-10 | 2013-11-21 | Tokyo Seimitsu Co Ltd | ダイシング装置及びダイシング方法 |
| CN106113291A (zh) * | 2016-06-27 | 2016-11-16 | 哈尔滨工业大学 | 一种微波切割装置 |
| JP2016209998A (ja) * | 2016-09-16 | 2016-12-15 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6234715B2 (enrdf_load_stackoverflow) | 1987-07-28 |
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