JPS59222351A - Method of impregnating base material for laminated board with varnish - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Non-technical ￥f'] The present invention provides a laminated 4 used for substrates such as printed wiring boards.
The present invention relates to a manufacturing method of No. 1i, and particularly relates to a method of impregnating a base material for an M-layer board with varnish.

[Background technology]

Conventionally, for laminates), (what is impregnated with varnish and dried to produce prepreg! The required number of sheets are stacked together or laminated with varnish and coated with metal on the top or bottom surface as necessary. When heating and curing a laminate made of stacked foils, the resin-impregnated base material and the varnish flowing out from both ends of the laminate in the width direction flow down and scatter to the surrounding area, degrading the working environment and adhering to the prepreg or laminate, resulting in foreign matter defects. was generated.

[Purpose of the invention]

The purpose of the present invention is to improve the working environment and to suppress defects caused by foreign substances.

[Disclosure of the invention]

The present invention involves dipping a laminate base material in varnish, stacking the required number of sheets, and then placing the A-layer body, in which metal foil is layered on the top or bottom surface, on a mold release base material that is wider than the laminate. 1 Usui type base material “
The present invention will be described in detail below with reference to a method of impregnating a laminate substrate with varnish, which is characterized in that the varnish flowing out at both ends in one direction is moved while being absorbed and removed under reduced pressure. The base material for the laminate used in the present invention is a woven fabric, a non-woven fabric made of inorganic fibers such as glass and asbestos, polyester, polyamide, polyvinyl alcohol, organic synthetic fibers such as acrylic, and natural fibers such as cotton. General substrates for laminates, such as cloaks, paper, or combinations thereof. For varnishing, use phenolic resin, epoxy resin; 1) Unsaturated polyester 7L' resin, melamine resin, polyimide resin, polysulfone, polyester resin.
If necessary, add water, methyl acetate, etc. to tadiene, fluorinated resin, polybutylene terephthalate, polyether ether ketone, etc. alone or in modified form or mixture. This is a varnish containing a YS medium such as Recole, acetone, cyclohexanone, or styrene. Metal foils include Usushi, Sake, Shinreiku, and A! Reminium foil, stainless steel (A4 ``l'3s nickel ψ city, etc. gold It is possible to use the foil rem and the previous pattern paper in general.As for the fabric absorption, the necessary vacuum absorption tubes and vacuum suction ports are installed at both ends in the width direction of the fabric and the mold base material to remove faL varnish. The varnish removed by absorption under reduced pressure can also be used for dipping, and is also effective in preventing γ This will be explained based on the first embodiment.
The figure is a simplified process diagram showing one embodiment of the method of the present invention.
The figure is a simplified enlarged view of the vacuum absorption section of the present invention.

[Practice ν'11] A hardening agent-containing solvent-free varnish 4 (unsaturated polynisdel 4 oil varnish 2) was applied to a kraft paper 1 with a thickness of 0.1'14 and a width of 1050 tqyg at a coating weight of 50 weight - 4. (J)1.
After dipping, 6 sheets were soaked so that the bottom surface was 35 microns in contact with the bottom surface.
1;・19+'i 3 with the metal side facing the outside A rule, respectively I
Place the F-shaped laminate 4 on a release paper 5 with a width of 11 (10 mm);
The varnish 6 to be dispensed is absorbed and removed by a vacuum suction port 8 connected to an IC empty pump 7, and then moved and cured by heating in a heating curing furnace 9, resulting in a double-sided A-layer board with a thickness of 1.6 gates! I got 0.

〔Effect of the invention〕

According to the method of impregnating varnish into a laminated plate material of the present invention, the working environment is significantly improved, resulting in beautification, and the incidence of defects due to foreign matter can be reduced to 1/3 of the conventional rate. 4jM recognized that the varnish impregnation method for +i=j, W for laminates was superior.

4, fl￥I and tD 1ui-tunna explanation Q'r
11'J is -! of the method of the present invention. *: A schematic process diagram showing an example; 2nd page 1 is an enlarged schematic sectional view of the reduced pressure absorption section of the present invention.

1 is the laminate plate 111 base material, 2 is 4.5 is the fat varnish, 3 is ゛, il'z'i'i4 is the cypress layer, 5 is the release paper, 6 is the draining varnish, 7 is the vacuum pump, 8 is the It is a decompression pupil opening.

l Samurai Kyoudej (10 people (Public lower electric Ei Sung style + ?-shidai 4Q1 person speaking skill Toshimaru Takemoto ((F or 2 people) Fig. 1 Fig. 2

Claims (1)

[Claims] (1) For laminates, after soaking in varnish, place the laminate in a mold release base paulownia with a wider radius of R [by stacking the required number of sheets and leaving metal foil on the upper or lower surfaces of the laminate]. A method for impregnating a seed layer and a temporary base material with varnish, which comprises moving the varnish flowing out at both ends in the width direction of a release base material by absorbing it under reduced pressure.