JPS592197B2 - Film peeling method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for peeling a flexible film from a substrate that is adhered to the surface of a rigid substrate.

As a method for peeling a flexible film-like body from the surface of a rigid substrate, for example, Japanese Patent Application Laid-Open No. 1983-35-
The method shown in No. 16538 is known.

This method is particularly suitable for peeling off a flexible peeling film layer bonded to a substrate together with a resist forming layer from a substrate during the manufacture of printed circuits.

However, in the manufacture of printed circuits with particularly fine wiring, there are problems in which the printed circuit image is partially destroyed or the circuit lines become thinner when the film layer is peeled off.

The present invention does not cause the above-mentioned destruction of printed images. It is an object of the present invention to provide a method and apparatus for peeling off a film-like body that realizes smooth and complete peeling.

The peeling method and device of the present invention are as follows. This is not limited to film peeling during the manufacture of printed circuits as mentioned above. It is suitable for cleanly peeling off a flexible film adhered to a broadly rigid substrate without damaging it.

The peeling method of the present invention is as follows. When peeling a flexible film-like material from a rigid substrate, the angle between the film-like material and the substrate, that is, the peeling angle, should be made larger than the predetermined angle. This is a film-like material that is pressed along the substrate by peeling off the part K. The peeling device of the present invention is characterized in that it includes a peeling guide plate for this purpose.

In other words. In the peeling method of the present invention, the peeling angle when peeling the film-like body from the substrate is about 60 degrees (not greater than 180 degrees). This prevents the film from being damaged. Furthermore, when manufacturing printed circuits, it is possible to peel off the film without breaking the printed wiring.

Also. In the device 2 of the present invention. The K. A peeling guide plate is provided that moves along the substrate in conjunction with the movement of the substrate.

Peeling guide plate. For example, a tape formed of a rigid body that can be moved along the front and back surfaces of the board, is attached to a film-like body that is adhered to the board, and is provided so as to protrude forward from the front edge of the board, and is peeled off. When the tape is wound onto a drum, the angle between the tape and the substrate is small, so it separates from the peeled part of the tape. After the tape is wrapped around the drum, it advances to the peeling part of the film so as to increase the peeling angle between the seven films connected to the tape and the substrate. 9 below. Embodiments of the present invention will be described with reference to the drawings.

In Figure 1. A rigid substrate 1 is shown. This board 1
A film-like body 2 is releasably adhered to both sides of the body. Moreover, on the edge of this film-like body 2. One end of the tape 3 is adhered by an adhesive layer 4i1C. As illustrated. The position of adhesive layer 4 is. V) on the edge of the film-like body 2. Tape 3 protruding from this film-like body 2
It is important that the area has no adhesive properties for purposes explained later. Name: The film-like material explained above.
Please refer to Japanese Unexamined Patent Publication No. 16538/1984 for a detailed explanation of the table and the like. Figure 2 A and 3
The diagram is. FIG. 1 is a side view showing an embodiment of the device of the present invention. Figure 2 shows the state in which the tip of the tape adhered to the film material is wound onto the peeling drum. FIG. 3 shows the state in which the film-like body is peeled off from the substrate.

The film-like body peeling device 10 is. A rigid substrate 1, on which a film-like body 2 having a tape 3 at its tip as shown in FIG. Transfer roller 1 for
1.

The transfer roller 11 & (the peeling rotary drum 12 which pulls the tape 3 provided at the tip of the film-like body 2 on the substrate 1 transferred by suction and holding it in the direction of peeling it from the substrate 1. The rotary drum 12 includes a hollow rotating shaft 13 and a peripheral wall 14 supported at intervals around the rotating shaft 13.
It is made up of On the surrounding wall 14. A large number of suction holes 15 are provided. Inside of the rotating shaft 13. A suction hole 15 is opened by an external suction pump (not shown) or the like through a suction chamber 16 between the rotary shaft 13 and the peripheral wall 14, and objects outside the rotary drum 12 are suctioned. This rotating drum 12. Board 1
When is below it. It is placed at a position slightly apart from the surface of the substrate (more precisely, the film-like body on this substrate). A rotating nip roller 17 is arranged parallel to and substantially in contact with the rotating drum 12.

This nip roller 17 cooperates with the rotating drum 12 to nip the tape 3A and the film-like body 2 following it. This is for continuously peeling off this film-like body from the substrate 1. Substrate transport means 18 for transporting the substrate 1 from which the film-like body has been peeled off. Film conveying means 19 and 20 for conveying the film 2 are disposed at the rear of the apparatus.

In front of the drum of the device, there is a film-like material 2 on the substrate 1.
along the surface of. Peeling guide plates 21 and 22, which are characteristic parts of the apparatus of the present invention, are arranged.

These peeling guide plates 21 and 22. When inactive, the second
It is arranged at a first position in front of the drum shown in the figure. on the other hand. These peeling guide members 21 and 22. When activated, it moves from the first position to the second position shown in FIG. These peeling guide plates 21 and 22. When in the second position, the point where the tape 3 or film-like body 2 is held between the drum 12 and the nip roller 17K and the guide plate 21
, 22, the line connecting the tips 23 and 24 of the substrate 1 forms an angle of approximately 60 degrees above the surface of the substrate 1 (referred to as the lower separation angle) as measured from the rear surface of the separation section. There is. The rear ends 25, 26 of these guide plates 21, 22 are. So that the board 1 sent to us can be easily guided between these guide plates 21 and 22. It is desirable that it be bent in a direction away from the path of the substrate 1. Li bottom. A peeling method according to the present invention using the above-described peeling device will be explained. In the figure, the substrate 1 is transported from the right side with the tape 3 at the beginning, and the light emitting section 27
Intrusion into the device is detected by a position detector consisting of a light receiving section 28 and a light receiving section 28.

Based on the detection signal from the light receiving section 28. Detection means (not shown) for directly or indirectly detecting that the leading edge of the tape 3 has reached the vicinity of the drum 12; for example, a timer or counting the number of rotations of a disk rotating in synchronization with the transfer roller 11; Activate the counter. This detection means.
When it is detected that the leading edge of the tape 3 has reached the vicinity of the drum 12, the drum 12 is rotated in the direction of each arrow by an appropriate means, and at the same time, a vacuum pump (not shown) is activated to move the suction chamber 16. External air is sucked through the suction hole 15. The tape 3 that has moved below the drum 12 is strongly attracted to the surface of the drum 12. Drum 12Y@. Rotate while holding the table 3 under suction. - Transport the tape 3 to a position where it is held between the nip rollers 17. The tip of tape 3 is the drum 12
and a detection means for detecting that it is pinched by the nip roller 17K. For example, by the timer 29K activated by the detection signal of the light receiving section 28. ``When this pinching is detected. Guide plate moving rollers 30 and 31 are rotated once in the direction of the arrow by guide plate control means 32 and 33, respectively.

The moving rollers 30, 31 move the guide plates 30, 31 from the first position shown in FIG. 2 to the second position shown in FIG. 3 by the rotation of the guide plates 32, 33. move to position. The guide boards 21 and 22 are. At this second position, the peeling angle when peeling the film-like body 2 from the substrate 1 is controlled. The following table summarizes the peeling state when various peeling angles are used, taking the peeling phenomenon as an example.

As is clear from this table. It is desirable that the peeling angle is 60 degrees or above. Particularly preferably, the angle is within 150 degrees.
Considering actual mechanical design, approximately 90 degrees is most desirable.

In Figure 3. The case where the distance angle is 90 degrees is shown. The guide boards 21 and 22 are. The film-like body 2 is fixed at this second position, and in this state, the film-like body 2 is peeled off from the substrate 1.

This peeling is performed while feeding the rigid substrate 1. This is carried out by holding the tape 3 and the subsequent film 2 between the drum 12 and nip roller 17 and pulling it. In the case of the device shown in the figure. Because the film-like body 2 is stretched above and below the substrate 1. Although the position of board 1 is stable. When the film-like body 2 is on only one side of the substrate 1, since the substrate is pulled to one side, a holding means (not shown) may be provided to stabilize the position of the substrate. When the film-like body 2 is peeled off from the substrate 1. The substrate 1 is used as the conveying member 1
Sent by 8. The film-like body 2 is a conveying member 19
, 20K. In the figure. Each roller}
and each belt. It rotates or moves in the direction of the arrow attached to each. After the position detectors 27 and 28K detect the rear end of the board 1. After sufficient time has elapsed for the film-like material 2 to be peeled off from the substrate 1, the drum 12 is rotated. It is desirable that a timer or counter as described above is provided to stop this drum suction.

Also, when this drum 12 stops. roller 30,3
1 is rotated in the opposite direction to the arrow shown in the figure. This moves the guide plate from the second position in Figure 3 to the first position in Figure 2. Finish the peeling process. Above. I explained the case where a film-like body is peeled off from a rigid substrate.6
The method of the present invention can also be used when peeling a film-like body from a flexible substrate.

According to the present invention as explained above. When peeling the film from the substrate, the peeling angle can be freely set to a 60 degree angle. For example, smooth and complete peeling can be performed without causing damage to printed lines.

[Brief explanation of the drawing]

Figure 1 is. FIG. 2 is a side view showing a substrate from which a film-like body is peeled off by the film-like body peeling method and apparatus of the present invention. 2 and 3 are side views showing a film-like object peeling device according to an embodiment of the present invention. Figure 2 shows the state in which the tip of the tape adhered to the film material is wound onto a peeling drum. FIG. 3 is a diagram showing a state in which the film-like body is peeled off from the substrate. 1... Board. 2...Film-like body. 3... Tape 610... Film-like body peeling device. 11...Transfer roller. 12...Rotating drum for peeling. 17...Nitsupora. 21, 22... Peeling guide plate. 30, 31...Moving roller. 32, 33...
Guide plate control means.

Claims (1)

[Claims] 1. A tape is adhered to the front end of a removable film-like body that is adhered to the surface of a rigid substrate so that a part of the tape protrudes forward from the front end, and then this protrusion is removed. In the method of peeling the film-like body connected to the tape from the substrate by pulling it in a direction away from the surface of the substrate, the difference between the film-like body and the substrate when peeling the film-like body from the substrate is The peeling angle to be made is 60
1. A method for peeling a film-like material, characterized in that the peeling method is performed at a temperature higher than 100%. 2. The method for peeling a film-like body according to claim 1, wherein the peeling angle is in a range of 60 degrees to 150 degrees. 3. The method for peeling a film-like body according to claim 2, wherein the peeling angle is approximately 90 degrees. 4. Transfer means for transporting a rigid substrate on which a film-like body with a tape at its tip is releasably adhered to the surface from the front to the rear into a predetermined passage, a tape provided at the tip of the film-like body; A peeling rotary drum that pulls the tape in the direction of peeling it from the substrate while suctioning and holding the tape, and works with this peeling drum to sandwich the tape and the film-like body that follows it, and continuously peels the film-like body from the substrate. In a film-like body peeling device comprising a rotating nip roller for peeling from a substrate, a peeling guide plate is provided along the surface of the film-like body on the substrate, and the peeling guide plate is positioned at a first position forward of the drum. and a line connecting the point where the tape or film material is held between the drum and the nip roller and the tip of the guide plate is at an angle of approximately 60 degrees or more with respect to the surface of the substrate as measured from the surface behind the peeling part. The guide plate is positioned at the first position until the tape is suctioned and held by the drum, and the tape is moved between the nip roller and the drum. 1. A film-like object guiding device, comprising a guide plate control means for moving the guide plate to the second position after being clamped. 5. The guide plate control device is connected to a tip detector provided in front of the rotating drum and detects the tip of the substrate, and the tip detector detects the tip of the substrate. 5. The film-like object peeling apparatus according to claim 4, further comprising a timer for moving the peeling guide plate from the first position to the second position after a predetermined period of time has elapsed.