JPS5921416Y2 - display device - Google Patents
display deviceInfo
- Publication number
- JPS5921416Y2 JPS5921416Y2 JP1978048625U JP4862578U JPS5921416Y2 JP S5921416 Y2 JPS5921416 Y2 JP S5921416Y2 JP 1978048625 U JP1978048625 U JP 1978048625U JP 4862578 U JP4862578 U JP 4862578U JP S5921416 Y2 JPS5921416 Y2 JP S5921416Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light
- light emitting
- frame plate
- emitting diodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【考案の詳細な説明】 本案は発光ダイオードを用いた表示装置に関する。[Detailed explanation of the idea] The present invention relates to a display device using light emitting diodes.
多くの発光ダイオードを行列状に配列して画像などを表
示する装置にあってた、発光ダイオードの光が横に拡が
って像がぼやけるので個々の発光ダイオードの放出光を
前方に互いに平行に導くべく、発光ダイオードの各々に
光反射鏡を設けることが有意義で′ある。This device is used in devices that display images by arranging many light emitting diodes in a matrix.Since the light from the light emitting diodes spreads laterally and the image becomes blurry, the light emitted from the individual light emitting diodes is guided forward in parallel to each other. It is significant to provide a light reflecting mirror for each of the light emitting diodes.
然るに良質の画像を表示すべく発光ダイオードの配列密
度を高めると、反射鏡を個別に設けることが困難になる
。However, if the arrangement density of light emitting diodes is increased in order to display high-quality images, it becomes difficult to provide individual reflecting mirrors.
従って本案目的は発光ダイオードの配列密度が高くなっ
ても精度良く反射鏡の個別配置を可能にした表示装置を
提供するものである。Therefore, an object of the present invention is to provide a display device that allows reflective mirrors to be individually arranged with high precision even when the arrangement density of light emitting diodes becomes high.
図は本実施例の画像表示装置を示し、１はセラミンクな
どからなる平坦な絶縁性基板、２，２・・・・・・は該
基板面に行列状に配列された例えばＧａＰ緑色発光ダイ
オード、３，３・・・・・・は上記行列配置の各列に沿
って延び、基板１の表面に被着された金などからなる列
電極、４，４・・・・・・は発光ダイオード２の各々と
列電極３の各々とを電気的機械的に固着する銀ペースト
などの導電性接着剤である。The figure shows an image display device of this embodiment, in which 1 is a flat insulating substrate made of ceramic or the like, 2, 2... are, for example, GaP green light emitting diodes arranged in a matrix on the substrate surface; 3, 3... are column electrodes extending along each column of the matrix arrangement and made of gold or the like deposited on the surface of the substrate 1; 4, 4... are light emitting diodes 2; and each of the column electrodes 3 is a conductive adhesive such as a silver paste.
５は基板１の表面に配置され、発光ダイオード２を個々
に囲み上方に向って径大となる複数のエツチング孔６，
６を有する金属枠板で、該枠板は燐青銅などからなり、
平坦な金属板の表面よりフォトエツチング手法によりエ
ツチングすることにより各エツチング孔６が形成される
。5 is arranged on the surface of the substrate 1, and includes a plurality of etched holes 6, which individually surround the light emitting diodes 2 and whose diameter increases upwardly.
6, the frame plate is made of phosphor bronze or the like,
Each etching hole 6 is formed by etching the surface of a flat metal plate using a photoetching method.
ここに基孔６はエツチングにより形成されるものである
から、孔６の配列密度力吠になっても精度良く形成され
、かつその内側面は傾斜させるものとなる。Since the base holes 6 are formed by etching, they can be formed with high accuracy even if the arrangement density of the holes 6 is high, and the inner surface thereof can be inclined.
７，７・・・・・・は基孔６の内側面に被着された金な
どからなる光反射性金属膜である。7, 7, . . . are light-reflective metal films made of gold or the like deposited on the inner surface of the base hole 6.
８は金属枠板の底面自身を絶縁処理してなる絶縁層で、
酸化銅から構成されており、列電極３との間の絶縁をな
すものである。8 is an insulating layer formed by insulating the bottom surface of the metal frame plate itself.
It is made of copper oxide and provides insulation from the column electrodes 3.
９．９・・・・・・は金属枠板５の表面と基板１面との
間に介在する光吸収層で、該層は例えば黒色エポキシ樹
脂からなり金属枠板５を基板１に固着する作用もなす。9.9... is a light absorption layer interposed between the surface of the metal frame plate 5 and the surface of the substrate 1, and this layer is made of, for example, black epoxy resin and fixes the metal frame plate 5 to the substrate 1. It also acts.
１０．１０・・・・・・は同一行に属する各発変ダイオ
ード２の頂部電極どうしを電気的に連ねる金属細線から
なる行電極である。10.10... are row electrodes made of thin metal wires that electrically connect the top electrodes of the diodes 2 belonging to the same row.
上記装置において、列及び行電極３，１０に選択的に電
位を与えると選択された電極交点に位置する発光ダイオ
ードが発光する。In the above device, when a potential is selectively applied to the column and row electrodes 3, 10, the light emitting diode located at the selected electrode intersection emits light.
このとき放出光は孔６内面の金属膜７で反射されて基板
１面にほぼ垂直に進み、従って横に拡がり難く又、金属
枠板５と基板１との間に進入した光は、光吸収層９の存
在により金属枠板５底面と基板１表面との間で反射する
ことなく吸収される。At this time, the emitted light is reflected by the metal film 7 on the inner surface of the hole 6 and travels almost perpendicularly to the surface of the substrate 1, so it is difficult to spread laterally, and the light that enters between the metal frame plate 5 and the substrate 1 is absorbed Due to the presence of the layer 9, the light is absorbed without being reflected between the bottom surface of the metal frame plate 5 and the surface of the substrate 1.
尚、上記実施例では光吸収層９を金属枠板５と基板１と
の間に介在させたが、基板１として黒色系のものを用い
、該基板表面自体で光吸収層を構威させてもよい。In the above embodiment, the light absorption layer 9 was interposed between the metal frame plate 5 and the substrate 1, but a black material was used as the substrate 1, and the light absorption layer was formed on the surface of the substrate itself. Good too.
かくして本案によれば、行列状に配列された発光ダイオ
ードに対して個々に設置される反射枠は金属板にエツチ
ング孔を設けた金属枠板で構成されるものであるから、
発光ダイオードの配列密度わ高くなっても精度良く反射
鏡を設けることができ、かつ絶縁層の存在により金属製
の板枠を使用するにも拘らず基板上の配線極間の絶縁が
図れ更には光吸収層の存在により金属枠板と基板との間
に光が進入して隣接する孔内に光が漏れるといったこと
もなくなる。Thus, according to the present invention, the reflective frames installed individually for the light emitting diodes arranged in rows and columns are composed of metal frame plates with etched holes in the metal plate.
Even when the arrangement density of light emitting diodes increases, it is possible to provide a reflective mirror with high accuracy, and the presence of an insulating layer allows for insulation between wiring electrodes on the board even though a metal plate frame is used. The presence of the light absorption layer prevents light from entering between the metal frame plate and the substrate and leaking into adjacent holes.
第１図は本案実施例の要部平面図、第２図は同断面図で
あり、１は基板、５は金属枠板、９は光吸収層で゛ある
。FIG. 1 is a plan view of a main part of the embodiment of the present invention, and FIG. 2 is a sectional view thereof, in which 1 is a substrate, 5 is a metal frame plate, and 9 is a light absorption layer.
Claims (1)
光ダイオード、上記基板表面に配置され、上記発光ダイ
オードを個々に囲み上方に向って径大となる複数のエツ
チング孔を有する金属枠板、上記エツチング孔の内側面
に被着された光反射性金属膜、上記枠板の底面を絶縁処
理してなる絶縁層、上記枠板の底面と上記基板表面との
間に介在するか、又は上記基板表面自体で構成される光
吸収層を具備せる表示装置。A flat substrate, a plurality of light emitting diodes arranged in a matrix on the surface of the substrate, and a metal frame plate having a plurality of etched holes arranged on the surface of the substrate, each surrounding the light emitting diodes and increasing in diameter toward the top. , a light-reflecting metal film deposited on the inner surface of the etching hole, an insulating layer formed by insulating the bottom surface of the frame plate, interposed between the bottom surface of the frame plate and the surface of the substrate, or A display device comprising a light absorption layer formed from the surface of the substrate itself.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978048625U JPS5921416Y2 (en) | 1978-04-10 | 1978-04-10 | display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1978048625U JPS5921416Y2 (en) | 1978-04-10 | 1978-04-10 | display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54150480U JPS54150480U (en) | 1979-10-19 |
| JPS5921416Y2 true JPS5921416Y2 (en) | 1984-06-23 |
Family
ID=28932696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1978048625U Expired JPS5921416Y2 (en) | 1978-04-10 | 1978-04-10 | display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921416Y2 (en) |
-
1978
- 1978-04-10 JP JP1978048625U patent/JPS5921416Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS54150480U (en) | 1979-10-19 |
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