JPS59209804A - Manufacture of flitch - Google Patents

Manufacture of flitch

Info

Publication number
JPS59209804A
JPS59209804A JP58084820A JP8482083A JPS59209804A JP S59209804 A JPS59209804 A JP S59209804A JP 58084820 A JP58084820 A JP 58084820A JP 8482083 A JP8482083 A JP 8482083A JP S59209804 A JPS59209804 A JP S59209804A
Authority
JP
Japan
Prior art keywords
flitch
plate
mold
upper mold
book
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58084820A
Other languages
Japanese (ja)
Inventor
宏明 碓氷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP58084820A priority Critical patent/JPS59209804A/en
Publication of JPS59209804A publication Critical patent/JPS59209804A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Wood Veneers (AREA)
  • Laminated Bodies (AREA)
  • Finished Plywoods (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔技術分野〕 この発明はフリッチの製法に関するものである〔背景技
術〕 従来フリッチは、第1図に示すように、型面が凸状にわ
ん曲していて高周波誘電加熱の陽極ともなる上型1と、
この上型の型面に対応する型面を有し高周波誘電加熱の
陰極ともなる下型2との間に、複数枚の木質単板を接着
剤を介して積層した積層体3を入れ、上型1と下型2で
高周波誘電加熱を施しながら加圧(圧締)することによ
り製造されている。しかしながら、このようにしてフリ
ッチを製造する場合には、木質単板の積層枚数が多(な
ると被加熱物のインピーダンスが大きくなるため、高周
波発振装置の容量を大きくすることが必要となる。その
ため、小容量の高周波発振装置を用いる方法が考えられ
一部で実施されている。この方法は、木質単板を50〜
100枚重ねて小分は積層体(「ブック」と称される)
をつくり、このブックを順次積層して所定のフリッチを
つくるという方法である。この場合、ブックのフリツチ
化は、つぎのようにして行われる。すなわち、あるブッ
クを下型上に載せ、その上に別のブックを接着剤層を介
して重ね、高周波誘電加熱の陽極となる上型と単なる型
押し作用のみする下型とで圧締する際に、ブックの側面
部分に高周波誘電加熱の陰極板を当接し、圧締と同時に
陽極と陰極板との間に高周波をかけ接着剤層を誘電加熱
して硬化を促進させ、さらにその上に第2図に示すよう
に新たなブック4′を接着剤層6′を介して重ね陰極板
8の当接位置を上方に変え、上記と同様に7して硬化さ
せることにより、ブック4′を積層接着することが行わ
れている。第2図において、4はブック、5は下型、6
は積層剤層、7は上型である。すなわち、ブック4を順
次積層接着する際は、新たなブック4′を接着する接着
剤層6′に対して効果的に誘電加熱が行われるように、
陰極板8を側方に配置し、かつ上下に移動しろるように
構成しているのである。しかしながら、このように陰極
板8をブック4の側面に当接させて高周波をかける場合
は、電極間距離がブック積層体の端部と中央部とで異な
るため、電界強度が陰極板8の近傍で強くなり、それよ
りも遠くなると弱くなる。そのため新たなブック4′を
接着する接着剤層6′の中央部が目的温度(70〜90
℃)に達する前に端部の温度が100℃以上に昇温して
しまい、接着不良や形くずれ等の問題が生じていた。そ
のため、陰極板8を陽極7よりも遠くに(下方に)位置
させて電極間距離を、ブック積層体の端部と中央部との
差が小さくなるようにすることが考えられた。しかしな
がら、このように陰極板の位置を下方に下げるのにも限
界があり、またこのように陰極板を下方に下げると一つ
のブックが何回も加熱されることとなり、温度が高くな
りすぎるという問題が生じた。
[Detailed Description of the Invention] [Technical Field] The present invention relates to a method for manufacturing a flitch. [Background Art] As shown in Fig. 1, a conventional flitch has a mold surface that is curved in a convex shape, and is used for high-frequency dielectrics. An upper mold 1 which also serves as a heating anode,
A laminate 3 made of a plurality of wood veneers laminated with adhesive is inserted between the lower mold 2, which has a mold surface corresponding to the mold surface of the upper mold and also serves as a cathode for high-frequency dielectric heating. It is manufactured by pressurizing (pressing) the mold 1 and lower mold 2 while applying high-frequency dielectric heating. However, when manufacturing a flitch in this way, the number of laminated wooden veneers is large (as the impedance of the heated object increases, it is necessary to increase the capacity of the high frequency oscillator. Therefore, A method using a small-capacity high-frequency oscillator has been considered and is being implemented in some cases.
100 sheets are piled up and the small portion is a laminate (called a "book")
This method involves creating a predetermined flitch by sequentially stacking the books. In this case, the book is converted into a flitch as follows. In other words, when a book is placed on a lower mold, another book is placed on top of it with an adhesive layer interposed, and the upper mold serves as an anode for high-frequency dielectric heating, and the lower mold only performs a stamping effect. First, a high-frequency dielectrically heated cathode plate is brought into contact with the side surface of the book, and at the same time as pressing, a high frequency is applied between the anode and cathode plate to dielectrically heat the adhesive layer to accelerate curing. As shown in Figure 2, a new book 4' is stacked with the adhesive layer 6' interposed therebetween, and the abutment position of the cathode plate 8 is changed upward, and the book 4' is stacked by curing in the same manner as above. Gluing is done. In Fig. 2, 4 is a book, 5 is a lower mold, and 6 is a book.
is a laminating agent layer, and 7 is an upper mold. That is, when sequentially laminating and bonding books 4, dielectric heating is performed effectively on the adhesive layer 6' to which a new book 4' is bonded.
The cathode plate 8 is arranged laterally and is configured to be movable up and down. However, when high frequency is applied by bringing the cathode plate 8 into contact with the side surface of the book 4 in this way, the distance between the electrodes differs between the ends and the center of the book stack, so the electric field strength near the cathode plate 8 It becomes stronger at a distance, and becomes weaker at a distance farther than that. Therefore, the center part of the adhesive layer 6' to which the new book 4' is attached is at the target temperature (70 to 90°C).
The temperature of the end portion rises to 100° C. or more before reaching 100° C.), causing problems such as poor adhesion and deformation. Therefore, it has been considered to position the cathode plate 8 further away (lower) than the anode 7 so that the difference in distance between the electrodes between the ends and the center of the book stack becomes smaller. However, there is a limit to lowering the position of the cathode plate in this way, and if the cathode plate is lowered in this way, one book will be heated many times and the temperature will become too high. A problem arose.

〔発明の目的〕[Purpose of the invention]

この発明は、高周波発振装置の容量を大きくしたり、陰
極板を下方へ下げたりすることなく、上記のような接着
剤層の端部と中央部の温度差を低減することを目的とす
るものである。
The purpose of this invention is to reduce the temperature difference between the ends and the center of the adhesive layer as described above, without increasing the capacity of the high-frequency oscillator or lowering the cathode plate. It is.

〔発明の開示〕[Disclosure of the invention]

この発明は、高周波誘電加熱の一方の電極ともなる上型
と、この上型に対応する型面を有する下型と、上型と下
型の間に上下動自在に配置される左右一対の板状体であ
って高周波誘電加熱の他方の電極となる電極板を備えた
フリッチの製造装置を準備し、上型と下型の間に素材単
板積層体を入れてその素材単板積層体の相対向する側面
に、素材単板積層体の素材単板よりも誘電率の低む)板
状誘電体を介して電極板を当接し、高周波誘電加熱を施
しながら上型と下型とで素材単板積層体を圧締してフリ
ッチ化することをその特徴とするものである。
This invention consists of an upper mold that also serves as one electrode for high-frequency dielectric heating, a lower mold having a mold surface corresponding to the upper mold, and a pair of left and right plates arranged vertically movably between the upper mold and the lower mold. A flitch manufacturing device is prepared which is equipped with an electrode plate that serves as the other electrode for high-frequency dielectric heating, and a material veneer laminate is placed between the upper mold and the lower mold, and the material veneer laminate is Electrode plates are brought into contact with opposing sides via a plate-shaped dielectric material (which has a lower dielectric constant than the material veneer of the material veneer laminate), and the material is heated between the upper and lower molds while being subjected to high-frequency dielectric heating. The feature is that the veneer laminate is compressed to form a flitch.

すなわち、素材単板積層体の相対向する側面に上記のよ
うな誘電体を介して電極板を当接することにより、素材
単板積層体の接着剤層の端部と中央部との電界強度の差
が小さくなり、温度差力</11さくなるのである。
In other words, by bringing electrode plates into contact with opposing sides of the material veneer laminate via the dielectric as described above, the electric field strength between the ends and the center of the adhesive layer of the material veneer laminate can be reduced. The difference becomes smaller, and the temperature difference force becomes smaller by 11%.

つぎに、この発明を実施例にもとづし)で詳しく説明す
る。
Next, this invention will be explained in detail based on examples.

第3図はこの発明の一実施例の構成図である。FIG. 3 is a block diagram of one embodiment of the present invention.

すなわち、この実施例は、ブック4の相対向する側面に
高周波誘電加熱の陰極板8を、プ・νり4を構成する素
材単板よりも誘電率の低い材料(例えばシリコン樹脂)
からなる板状誘電体9を介して当接している。それ以外
は第2図と同じであり、同一部分に同一符号を付してい
る。
That is, in this embodiment, high-frequency dielectrically heated cathode plates 8 are placed on opposing sides of the book 4, and a material (for example, silicone resin) having a lower dielectric constant than the single plate of material constituting the plate 4 is used.
They are in contact with each other via a plate-shaped dielectric material 9 made of. The rest is the same as in FIG. 2, and the same parts are given the same reference numerals.

このように構成したため、電界強度の均一化が実現され
、新たなブック4′を接着する接着剤層6′の端部と中
央部との温度が小さくなり、接着不良や形くずれ等の問
題の発生が回避されるようになる。
With this configuration, the electric field strength is made uniform, and the temperature between the ends and center of the adhesive layer 6' to which the new book 4' is bonded is reduced, which prevents problems such as poor adhesion and deformation. Occurrence will be avoided.

この電界強度の均一化に関して下記の式にもとづいて説
明する。
This uniformization of the electric field strength will be explained based on the following equation.

まず、板状誘電体9を介在させない場合は、中央部(A
)では、E人’ −’J / d 1端部 (B)では
、Eg = V / d 2EA /EB =、d2 
/diとなる。
First, when the plate-shaped dielectric 9 is not interposed, the central part (A
), E person'−'J/d 1 end (B), Eg = V/d 2EA/EB =, d2
/di.

つぎに、板状誘電体9を介在させる場合は、中央部(A
)では、E^= ここで   d3/ε2〉〉d2/ε1d3/δ2〉〉
d五/ε工とすると EA/E8#l       となる。
Next, when the plate-shaped dielectric 9 is interposed, the central part (A
), then E^= where d3/ε2〉〉d2/ε1d3/δ2〉
If it is d5/ε, then it becomes EA/E8#l.

すなわち、d3/ε2を大きくするために、板状誘電体
9を誘電率ε2の小さい材料で構成すると、端部と中央
部との電界強度の均一化が達成されるのである。
That is, in order to increase d3/ε2, if the plate-shaped dielectric 9 is made of a material with a small dielectric constant ε2, the electric field strength between the ends and the center can be made uniform.

つぎに、下記の樹種の素材単板を用い、上記実施例の陰
極板8とブック4の側面との間に厚み51のシリコン樹
脂製板状誘電体9を介在させ、下記の条件でフリッチを
つくった。
Next, using a veneer of the following tree species, a silicone resin plate dielectric 9 with a thickness of 51 was interposed between the cathode plate 8 of the above embodiment and the side surface of the book 4, and flitching was performed under the following conditions. I made it.

使用樹種 :アガチス単板 サイズ  :303x606X1t (100枚)陰極
位置 :陽極から170B 陰極サイズ:60鶴幅(フィンあり) 高周波電圧:1200V 高周波電流70.8A 印加時間 :5分 この場合、中央部温度と端部温度との差が5〜8℃程度
となり、板状誘電体9を介在させない場合の温度差20
〜30℃に比べて著しく良好な結果が得られた。
Wood species used: Agatis veneer size: 303x606x1t (100 pieces) Cathode position: 170B from the anode Cathode size: 60mm width (with fins) High frequency voltage: 1200V High frequency current 70.8A Application time: 5 minutes In this case, the center temperature and The difference from the end temperature is about 5 to 8°C, and the temperature difference is 20 when the plate-shaped dielectric 9 is not interposed.
Significantly better results were obtained compared to ~30°C.

なお、この発明は、予めつくられたブックを積層接着す
るのではなく、上記の装置でブックをつくりながらそれ
を順次積層接着してフリッチ化するようにしてもよい。
In the present invention, instead of stacking and bonding prefabricated books, the books may be sequentially stacked and bonded to form a flitch while the books are being fabricated using the above-mentioned apparatus.

〔発明の効果〕〔Effect of the invention〕

この発明は以上のようにしてフリッチを製造するため、
高周波発振装置の容量を大きくしたり、陰極板を下げた
りすることなく、接着不良や形くずれのないフリッチを
得ることができる。
In order to manufacture a flitch as described above, this invention
A flitch without poor adhesion or deformation can be obtained without increasing the capacity of the high-frequency oscillator or lowering the cathode plate.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は従来例の説明図、第3図はこの発
明の一実施例の構成図、第4図はその動作説明図である
。 4.4′・・・ブック 5・・・下型 6.6′・・・
接着剤層 7・・・上型 8・・・陰極板 9・・・板
状誘電体代理人 弁理士 松 本 武 彦 第1図 第2図 第4図
1 and 2 are explanatory diagrams of a conventional example, FIG. 3 is a configuration diagram of an embodiment of the present invention, and FIG. 4 is an explanatory diagram of its operation. 4.4'... Book 5... Lower mold 6.6'...
Adhesive layer 7... Upper mold 8... Cathode plate 9... Plate dielectric agent Patent attorney Takehiko Matsumoto Figure 1 Figure 2 Figure 4

Claims (1)

【特許請求の範囲】 (11高周波誘電加熱の一方の電極ともなる上型と、こ
の上型の型面に対応する型面を有する下型と、上型と下
型の間に上下動自在に配置される左右一対の板状体であ
って高周波誘電加熱の他方の電極となる電極板を備えた
フリッチの製造装置を準備し、上型と下型の間に素材単
板積層体を入れてその素材単板積層体の相対向する側面
に、素材単板積層体の素材単板よりも誘電率の低い板状
誘電体を介して電極板を当接し、高周波誘電加熱を施し
ながら上型と下型とで素材単板積層体を圧締してフリッ
チ化することを特徴とするフリッチの製法。 (2)板状誘電体がシリコン樹脂からなる特許請求の範
囲第1項記載のフリッチの製法。
[Claims] (11) An upper mold that also serves as one electrode for high-frequency dielectric heating, a lower mold having a mold surface corresponding to the mold surface of the upper mold, and a vertically movable member between the upper mold and the lower mold. A flitch manufacturing device is prepared, which is a pair of left and right plate-shaped bodies to be arranged, and is equipped with an electrode plate that serves as the other electrode for high-frequency dielectric heating. An electrode plate is brought into contact with the opposing side surfaces of the material veneer laminate through a plate-like dielectric material having a lower dielectric constant than the material veneer of the material veneer laminate, and the upper mold and the upper mold are heated while applying high frequency dielectric heating. A method for manufacturing a flitch, which comprises pressing a laminate of material veneers with a lower mold to form a flitch. (2) A method for manufacturing a flitch according to claim 1, in which the plate-like dielectric is made of silicone resin. .
JP58084820A 1983-05-14 1983-05-14 Manufacture of flitch Pending JPS59209804A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58084820A JPS59209804A (en) 1983-05-14 1983-05-14 Manufacture of flitch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58084820A JPS59209804A (en) 1983-05-14 1983-05-14 Manufacture of flitch

Publications (1)

Publication Number Publication Date
JPS59209804A true JPS59209804A (en) 1984-11-28

Family

ID=13841381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58084820A Pending JPS59209804A (en) 1983-05-14 1983-05-14 Manufacture of flitch

Country Status (1)

Country Link
JP (1) JPS59209804A (en)

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