JPS59198140A - High-frequency joined body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high-frequency bonded body.More specifically, it has excellent flexibility and texture,1 has excellent heat insulation properties,1 can be manufactured by a dry method using a powder adhesive, and achieves energy savings.
This invention relates to a high-frequency bonded body that can be manufactured with good productivity by high-frequency bonding.

Conventionally, the following structures are known as high-frequency adhesives.

A base material layer such as hardboard, a high-frequency adhesive film layer, a high-frequency adhesive cushion material layer formed by uniformly forming a film of high-frequency adhesive resin latex on a polyurethane foam skeleton, a high-frequency adhesive film layer) fabric, etc. It is composed of a facing material layer.

However, conventional high-frequency adhesives have the following essential drawbacks.

In terms of quality, since the high-frequency adhesive resin latex forms a uniform film on the polyurethane skeleton, there is a drawback that the original flexibility, texture, and elongation of polyurethane are formed and are inhibited by the latex film.

In particular, when trying to improve high-frequency adhesion, it is necessary to impregnate polyurethane foam with a large amount of latex, which results in an even thicker coating, resulting in poor flexibility, texture, and
The problem was that it reduced elongation.

In terms of process, the process of impregnating latex into polyurethane is a wet method, which has the disadvantage that a large amount of water must be evaporated. In the process of assembling the high-frequency adhesive, a process of inserting a high-frequency adhesive film is necessary in order to obtain practical adhesive strength for some of the high-frequency adhesive parts, and excess scraps of the film are generated when assembling the high-frequency adhesive. However, this had the disadvantage that it could not be reused and had to be thrown away. In addition, in the process of assembling the high-frequency adhesive, it was difficult to position all five layers, including the base material layer, film layer, cushion layer, film layer, and surface material layer.

The drawbacks of conventional high-frequency adhesives in terms of quality, process, and assembly.
There was a demand for a high-frequency adhesive that would not have any drawbacks. In response to the above requirements, the present inventors have conducted extensive research and have developed a high-frequency adhesive cushioning material in which high-frequency adhesive resin powder is uniformly fixed to a polyurethane foam skeleton in the form of particles. It has now become possible to provide a practical high-frequency bonded body without using a high-frequency bonding film like the body. Therefore, the present invention consists of a base material layer, a high-frequency adhesive cushioning material layer, and a facing material layer in one order, some of which are high-frequency adhesive bonded, and the base material layer may be a nonwoven fabric, a woven fabric, or a knitted fabric. This is a high frequency adhesive body characterized by being made of a base material.

The cushion layer of the high-frequency adhesive of the present invention has a structure in which the high-frequency adhesive powder is uniformly fixed to the urethane foam skeleton in the form of particles, so the original flexibility, texture, and elongation of the urethane foam are not impaired at all. , and high-frequency adhesion is a dry method that fixes the foreign exchange powder to the skeleton with practical quality advantages, compared to the wet method of impregnating latex.
There is also the process advantage of saving energy.

Furthermore, compared to conventional high-frequency adhesive bodies, there is an advantage in that there is no need to use a high-frequency adhesive film, and there is also a process advantage in that it eliminates the difficulty of positioning each material layer when assembling a high-frequency adhesive body.

The high-frequency bonded body of the present invention is a structure in which a base material layer 4 made of nonwoven fabric, woven fabric, or silk cloth, a high-frequency adhesive cushioning material layer 3, and a facing material layer 2 are partially bonded by high-frequency bonding at a high-frequency bonding portion 1.

As the base material layer used in the present invention, it is preferable to use nonwoven fabric, woven fabric, or knitted fabric for seat and ceiling material applications. In particular, polyamide resins such as nylon-6 and nylon-66, vinylidene chloride resins such as vinylidene chloride-vinyl chloride copolymers, vinylidene chloride-acrylonitrile copolymers, vinyl chloride-vinylidene chloride copolymers, vinyl chloride-acrylonitrile copolymers, etc. Nonwoven fabrics, woven fabrics, and knitted fabrics of fibers such as monofilaments and staple fibers obtained by melt spinning, dry spinning, and wet spinning of vinyl chloride resins such as polymers are preferable because these resins are dielectrically heated by high frequency waves. Another preferred nonwoven fabric, woven fabric, or knitted fabric is a fabric impregnated with and/or coated with vinylidene chloride copolymer resin and/or vinyl chloride copolymer resin latex and/or powder, which will be described later, and substantially dielectrically heated by high frequency. Synthetic fibers such as polyester, polyacrylonitrile, and polyolefin obtained by melt spinning, dry spinning, and wet spinning methods; recycled fibers such as rayon, cupro, and acetate obtained by wet spinning and dry spinning methods; cotton, wool,
Nonwoven fabrics, woven fabrics, and knitted fabrics made of natural fibers such as monofilament and cotton fabric such as hemp and silk can also be used. It goes without saying that a combination of fibers that are dielectrically heated by high frequency and fibers that are not substantially dielectrically heated, or a nonwoven fabric, a woven fabric, or a knitted fabric that is interwoven or interwoven may also be used.

As the high-frequency adhesive cushioning material, a structure in which high-frequency adhesive resin powder is uniformly adhered to a polyurethane foam skeleton in the form of particles is used.

In addition, a high-frequency adhesive cushioning material in which a natural valve aggregate, a cottonseed aggregate, a synthetic fiber aggregate, etc. is impregnated with the high-frequency adhesive powder of the present invention and fixed to the fiber skeleton is A, especially when the covering material is fabric. This is convenient when static electricity is generated due to clothing on the body. Fabrics made of natural fibers such as natural pulp, cotton, and hemp are suitably hygroscopic and have the effect of gradually transferring frictional static electricity generated on the surface of the covering material toward the material.

A simple method for evaluating static electricity diffusion is, for example, by rubbing a polyester or nylon film against the covering material and dropping cigarette ash on the surface, and determining that the material that can be easily removed by hand has good static electricity dispersion.C High-frequency adhesive cushion As for the material, it is preferable to have a structure in which the high-frequency adhesive resin powder is fixed to the skeleton of the porous body as described above while leaving the particle form.

By adopting such a structure, it becomes possible to retain the characteristics such as the original texture of the porous material of the cushioning material layer. In other words, high frequency adhesiveness is imparted while the degree of freedom of the skeleton of the porous body against external forces remains.

As the high-frequency adhesive resin powder, one having a dielectric loss of 0602 or more among vinylidene chloride copolymer resin, vinyl chloride copolymer resin, and polyamide resin powder can be used. Preferably 0.04 or more, more preferably 0.05
is good. If the dielectric loss is less than 0.02, high-frequency dielectric heat generation will be insufficient, and heating time will become long during high-frequency bonding, and 1 bond strength will become impractical, which is not preferable.

The amount of high-frequency adhesive resin powder that adheres to the urethane foam skeleton varies depending on the degree of Fl'' of the urethane foam and the required adhesive force, but for example, when using urethane foam with a bulk density of 191/l, the amount of powder adhered to 52/1 or more, 1-
8097 or less is better.

Preferably it is 10 or more and 150 or less.

More preferably, it is 13 f/ or more and 100 f/ or less.

If the powder adhesion amount is less than 5 g/l, the high frequency adhesive strength is not practical, and if it exceeds 180 f/l, the feel and elongation of the urethane foam will deteriorate, which is not preferred.

The particle size range of the high frequency adhesive resin powder is 0.5μ
As mentioned above, 1 fl or less is good for adhering to the urethane foam. Preferably it is 10μ or more and 500μ or less, more preferably 100μ or more and 300μ or less.

When the above particle size range is expressed using a JIS standard sieve, it is 16 mesh pass, preferably 32 mesh pass, and more preferably 42 mesh pass, 2 mesh pass.
It is in the range of 00 mesh units.

Particles with a particle size of less than 0.5 .mu.m are undesirable because they deteriorate the feel and elongation of the fixed urethane foam, and particles exceeding 1 particle size cause non-uniformity of high frequency bonding FjfSK bonding (adhesion skipping).

The preferred vinylidene chloride resin as the high-frequency adhesive powder includes a vinylidene chloride (A) component of 20 mol% or more and 93 mol% or less, and 7 mol% or more of one or more monomers copolymerizable with (A). 0 mol % or more of selected functional monomers copolymerizable with component (B) and (A) and/or (B) of 0 mol % or less, 10 mol % or less
Preferably, the powder is a vinylidene chloride copolymer consisting of monomer (C) component of not more than mol % and/or a powder polymerized by an emulsion polymerization method and whose polymer chain terminal is a functional group of a decomposition product of a radical initiator.

For (B) binding, especially vinyl chloride, vinyl acetate, acrylonitrile, methyl acrylate, and methyl methacrylate are industrially mass-produced and may be used in combination.

(0) In particular, acrylic acid, methacrylic acid, itaconic acid monomaleic acid, maleic anhydride, fumaric acid monoacrylic acid amide, methacrylic acid amide, N-n-butquine acrylic amide, hydroxyethyl acrylate, glycidyl acrylate, glycidyl Methacrylate is preferred because it is industrially produced and readily available.

If the content of component (A-) is less than 20 mol %, the amount of high-frequency dielectric heat generation is small, and the powder does not melt, soften, or crosslink to the extent that practical high-frequency adhesive strength can be obtained, which is not preferable.

It is thought that the introduction of the functional monomer (C) works favorably when wetting with the adhesive to melt, soften, or crosslink the powder, but the details are unclear. When the amount of functional monomer (0) introduced is 0.05 mol % or more, a clear effect of increasing high frequency adhesive strength is observed. In addition, if the functional monomer (0) is not used, if polymerization is carried out by emulsion polymerization, a functional group will be introduced at the end of the polymer chain, which is thought to be due to the decomposition product of the radical initiator, and the high-frequency adhesive strength will be improved. It is preferable.

In particular, when structural strength is required, such as in furniture such as chairs, beds, and furniture, it is preferable to have a functional copolymer terminal formed from a functional monomer component and/or an initiator.

As the vinyl chloride copolymer resin preferable as the high-frequency adhesive powder, a copolymer containing vinyl chloride as a main component is preferable, and more preferably a copolymer formed by introducing a functional monomer and/or a radical initiated by emulsion polymerization method. A copolymer formed by introducing a functional group of a chemical decomposition product is preferable.

One or more monomer components selected from ethylene, propylene, vinyl acetate, acrylic ester, methacrylic ester, and acrylonitrile in an amount of 50 mol% or more, 92 mol% or less, 8 mol% or more, and 50 mol% or less as a vinyl chloride component. A copolymer consisting of a combination of components is preferred because it is easy to produce industrially. More preferably, as the functional monomer component, acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid, itaconic acid, acrylamide, methacrylic acid amide, Nn-butquine acrylic acid amide 1-hydroxyethyl acrylate, Glycidyl acrylate and glycidyl methacrylate are industrially produced, readily available, and preferred.

As the polyamide resin preferable as the high-frequency adhesive powder, a polyamide resin with a low melting point is preferable.

The preferred melting point of the polyamide resin is 60°C or higher and 200°C or lower, more preferably 70°C or higher and 180°C or lower, most preferably 80°C or higher and 150°C or lower.

Polyamide resins, which are generally used for nylon fibers, have a high melting point and are not preferred.

A polyamide resin having a melting point exceeding 200° C. is undesirable because when performing high frequency bonding, the high frequency application time becomes long and the bonding operation becomes slow. A polyamide resin having a melting point of less than 60° C. is not preferred because the initial strength of the high-frequency bonded portion is low.

As the facing material layer, a facing material selected from fabric, natural leather, and synthetic leather is preferable. Fabrics include synthetic fibers such as nylon, polyester, acrylic, vinylon, and polypropylene, semi-synthetic fibers such as acetate, and synthetic fibers such as rayon and cupro.1 Spinning of fibers selected from natural fibers such as wool, cotton, and hemp. Yarns made of a blend of two or more types can be used, and these yarns can be knitted or woven singly, or knitted or woven fabrics can be used that are made by knitting or interweaving two or more types of yarns.

Animal skins such as cowskin, sheepskin, and pigskin can generally be used as natural leather. Polyurethane leather, vinyl chloride leather, and polyamide leather can be used as synthetic leather.

Methods for impregnating high-frequency adhesive resin powder into polyurethane foam include: ■ Powder impregnation method: A method in which the urethane foam is passed through the powder and impregnated. ■ Fluid powder impregnation method: A method in which the powder is fluidized with air and then the foam is formed. ■ Air gun method: Spraying a mixture of powder dispersed in the air to impregnate the powder ■ Air suction method: Disperse or fluidize powder in the air and pass through the foam. , a method is adopted in which the other side of the foam is impregnated with powder under reduced pressure.

It goes without saying that a combination of these methods can be employed as needed.

Methods for fixing high-frequency adhesive resin powder to the polyurethane foam skeleton are: ■ Hot air sintering method: A method in which the resin is heated with hot air above its softening or melting point ■ Infrared sintering method: The resin is heated with infrared rays ■ High-frequency sintering method: A method of heating the resin with high frequency and fixing it is adopted.

It goes without saying that a combination of these methods can be employed as needed.

EXAMPLES The present invention will be explained in detail below with reference to Examples, but the present invention is not limited to these Examples.

In addition, the evaluation method in the examples was based on the method described below.

■ High frequency adhesive pearl high m wave elder (Haar Kogyo Co., Ltd.) R-20
Using 3D (3KW, 4.0MI-Tz), 4 widths for the facing material layer and 20mm for the 30Cnn long seal bar.
L: Apply pressure to rn2 and turn the tuning dial 80 (200
mA). The sealing time was 15 seconds when synthetic leather was used as the facing material layer, and 30 seconds when fabric was used as the facing material layer. The cooling time was the same as the sealing time in a pressurized state.

■ Adhesive Strength Using Toyo Baldwin's TEN SIT, ON tensile tester U〒M-4L, the high frequency adhesive surface was peeled off at a 180 degree angle at a tensile rate of 50 min/min, and the hardboard layer and surface material layer were separated. Peel strength was measured. The width of the test piece is 2.5
I made it crn.

Example 1 Copolymer powder consisting of 70 mol% vinylidene chloride component, 30 mol% vinyl chloride component, and 1 mol% acrylic acid component (
42 mesh passes, 200 mesh units) with a bulk density of 16
After impregnating 389/ into a polyurethane foam sheet of S'/7 and having a thickness of 10, it was heated in a hot air sintering furnace at 5160°C.
A high-frequency adhesive cushioning material was prepared by heating the material for 10 minutes to uniformly adhere the powder to the urethane foam skeleton in the thickness direction.

The above-mentioned high-frequency adhesive cushioning material, polyester tricot (fabric weight 550 y ArL2) as a facing material, and nylon nonwoven fabric (AIL N-1050 manufactured by Asahi Kasei Corporation, basis weight 50 ii'/m2) as a base material were used. As shown in Figures 1 and 2, they were overlapped and a portion was high-frequency bonded.

The high-frequency joint did not generate any spark holes due to the application of high-frequency and high voltage, and a high-frequency joint suitable for flexible sorting was obtained.

Example 2 A polyurethane foam sheet having a bulk density of 16 fl/l and having a thickness of 3 is impregnated with 38 f/ of high-frequency adhesive resin powder of 16 mesh passes made of vinyl chloride resin.
A high-frequency adhesive cushioning material was prepared by heating in a hot air sintering furnace at °C for 2 minutes to fix the powder to the urethane foam skeleton.

The above-mentioned high frequency adhesive cushioning material, polyester tricot (fabric weight 55 o y/m2) as a covering material,
Nylon nonwoven fabric as a base material (Nylon 6-Nylon 66 (hot) mixed nonwoven fabric manufactured by Asahi Kasei Industries, Ltd., basis weight 50
S'/m2) were overlapped as shown in Figs. 1 and 2, and a portion was high-frequency bonded. The high-frequency joint was free from spark holes due to the application of high frequency and high voltage, and a high-frequency joint suitable for flexible sheets was obtained.

Example 3 The high-frequency adhesive cushioning material and facing material used in Example 1 were used, and a polyester nonwoven fabric (AIL E-1050 manufactured by Asahi Kasei Industries, Ltd., basis weight 50 f//) was used as the base material.
m2) were overlapped as shown in Figs. 1 and 2, and a portion was high-frequency bonded. The high-frequency joint did not generate any spark holes due to high-frequency and high-constant coining, and a high-frequency joint suitable for flexible ceiling materials was obtained.

1. Spray onto IEL E-1050 using the spray method. Of 7m
250% latex was applied. In the high-frequency bonded portion of the ceiling material having the above-mentioned structure in which the coated nonwoven fabric was used as the base material layer, the covering material and the base material were more firmly welded by high frequency.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing a high-frequency bonded body according to the present invention, and FIG.
, -A' sectional view. DESCRIPTION OF SYMBOLS 1... High frequency joint part, 2... Covering material layer, 3... High frequency adhesive cushioning material layer, 4... Base material layer made of nonwoven fabric, woven fabric, or knitted fabric. Applicant Asahi Kasei Kogyo Co., Ltd. Agent Yutaka 1) Yoshio Figure 1, page 2

Claims (6)

[Claims] (1) The high-frequency bonded body consists of a base material layer, a high-frequency adhesive cushioning material layer, and a facing material layer, some of which are high-frequency bonded, and the base material layer is selected from nonwoven fabric, woven fabric, and knitted fabric. A high-frequency bonded body characterized by being made of a base material. (2) The high-frequency bonded body according to claim 1, wherein the high-frequency adhesive cushioning material layer is a cushioning material in which high-frequency adhesive resin powder is adhered in the form of particles to a polyurethane foam skeleton. (3) The high-frequency bonded body according to claim 1, wherein the facing material is selected from fabric, natural leather, or synthetic leather. (4) The nonwoven fabric, woven fabric, or silk fabric is a nonwoven fabric, woven fabric, knitted fabric, or vinylidene chloride copolymer resin and/or a nonwoven fabric, woven fabric, or knitted fabric selected from fibers selected from polyamide resin, vinylidene chloride resin, and/or vinyl chloride resin. Alternatively, the high-frequency bonded body according to claim 1 is a synthetic fiber, a synthetic fiber, and/or a natural fiber impregnated with and/or coated with vinyl chloride copolymer resin latex and/or powder. (5) Claim 2, wherein the high-frequency adhesive resin powder is a powder selected from vinyl chloride copolymer resin, vinyl chloride copolymer resin, and/or polyamide resin.
High-frequency bonded body as described in section. (6) High-frequency adhesive resin powder is applied to the foam skeleton.
f/1. Claim 1, 2 or 5 is a cushioning material formed by adhering 180 f/ or less.
The high-frequency bonded body described in Section. (Form) The facing material is a fabric, and the fabric is impregnated and/or coated with vinylidene chloride copolymer resin latex and/or vinyl chloride copolymer latex and/or powder. The high-frequency bonded body according to item 3.