JPS59195799U - integrated circuit case - Google Patents
integrated circuit caseInfo
- Publication number
- JPS59195799U JPS59195799U JP8993083U JP8993083U JPS59195799U JP S59195799 U JPS59195799 U JP S59195799U JP 8993083 U JP8993083 U JP 8993083U JP 8993083 U JP8993083 U JP 8993083U JP S59195799 U JPS59195799 U JP S59195799U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- case
- circuit case
- plastic
- simultaneous molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例を示す斜視−、第2図は同じ
く断面図、第3図は本考案の他の実施例を示す断面図で
ある。
゛図中1はケース本体、2−は上面部、3は底面部、4
.5は側面部、6は集積回路、7は凸段部、8 −は半
導電性プラスチック膜、9はリード線、10゜11は斜
面部、帯部12,13は帯部である。FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a sectional view of the same, and FIG. 3 is a sectional view showing another embodiment of the present invention.゛In the figure, 1 is the case body, 2- is the top part, 3 is the bottom part, 4
.. 5 is a side surface, 6 is an integrated circuit, 7 is a convex step, 8 - is a semiconductive plastic film, 9 is a lead wire, 10° 11 is a sloped portion, and band portions 12 and 13 are band portions.
Claims (1)
、かつ底面部のほぼ中央に集積回路載置用の凸段部が形
成された透明もしくは半透明状プラスチックケースにお
いて、同ケース内面の上面部を除く両側面部及び底面部
に、薄肉の半導電性プラスチックを同時成形によって被
覆し、かつ上面部の長さ方向に同じく半導電性プラスチ
ックの帯部を同時成形によって付着したことを特徴とす
る集積回路用ケース。In a transparent or translucent plastic case with a cross-sectional shape consisting of a top surface, a bottom surface and both side surfaces, and a convex step for mounting an integrated circuit formed approximately in the center of the bottom surface, the inner surface of the case is A thin semiconductive plastic is coated on both sides and the bottom excluding the top by simultaneous molding, and a strip of semiconductive plastic is attached along the length of the top by simultaneous molding. A case for integrated circuits.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8993083U JPS59195799U (en) | 1983-06-14 | 1983-06-14 | integrated circuit case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8993083U JPS59195799U (en) | 1983-06-14 | 1983-06-14 | integrated circuit case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59195799U true JPS59195799U (en) | 1984-12-26 |
Family
ID=30219827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8993083U Pending JPS59195799U (en) | 1983-06-14 | 1983-06-14 | integrated circuit case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59195799U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647953U (en) * | 1979-09-20 | 1981-04-28 |
-
1983
- 1983-06-14 JP JP8993083U patent/JPS59195799U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5647953U (en) * | 1979-09-20 | 1981-04-28 |
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