JPS59193055A - Thyristor mounting board - Google Patents
Thyristor mounting boardInfo
- Publication number
- JPS59193055A JPS59193055A JP58067315A JP6731583A JPS59193055A JP S59193055 A JPS59193055 A JP S59193055A JP 58067315 A JP58067315 A JP 58067315A JP 6731583 A JP6731583 A JP 6731583A JP S59193055 A JPS59193055 A JP S59193055A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thyristor
- board
- terminals
- thixotropic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はサイリスタに結露水や水が1査接かかった場合
でも耐リーク性、耐ショート性、酬トラッキング性に優
れ、誤動作や発火の危険性のない安全性の高いサイリス
タ実装基板に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention has excellent leak resistance, short circuit resistance, and leak tracking performance even when a thyristor is exposed to condensed water or water, and there is no risk of malfunction or fire. This relates to a highly safe thyristor mounting board.
従来例の構成とその問題点
近年、消費者がより使いやすく、付加価値の高い製品を
生みだすために、ラジオ、ビデオ、テレビジョン受像機
などに代表される音響・通信分野ではディスクリートの
電子部品から、チップ化された電子部品を使用し、薄型
・軽量・高密度化を可能にしているが、高密度化によっ
て電子部品の間隔が狭くなり、より耐リーク性、耐トラ
ツキング性が要求されている。しかしながら、音響・通
信分野における使用環境は60〜90℃程度の1到熱性
が要求されるが、高湿度雰囲気で使用されない為、湿度
による信頼性・安全性は問題にな−っておらず、特殊な
例として回路パターンのより信頼性・安全性を高める為
にフェス状の樹脂を数十μ施しているにすきない。Conventional configurations and their problems In recent years, in order to create products that are easier for consumers to use and have higher added value, the audio and communication fields, represented by radio, video, and television receivers, have shifted away from discrete electronic components. , which uses electronic components in the form of chips, making it possible to achieve thinner, lighter weight, and higher density. However, as the density increases, the spacing between electronic components becomes narrower, and higher leak resistance and tracking resistance are required. . However, although the usage environment in the audio and communication field requires a heat resistance of about 60 to 90 degrees Celsius, reliability and safety due to humidity are not a problem because it is not used in a high humidity atmosphere. As a special example, in order to improve the reliability and safety of the circuit pattern, several tens of micrometers of face-shaped resin is applied.
一力、今寸で電子化されていなかった洗濯機・炊飯器・
乾燥機なとに代表される家庭電化製品の分野においても
、マイコンを用いて電子化を行ない、センサーをつけ、
より多機能を伺加し、特徴のある製品を生み出している
。しかしながら、家庭用電化製品は浴室・台所・軒下な
どの水を使用する高湿度雰囲気で使用されることが多く
、電子部品に温度差によって水が結露したり、水が直接
かかった場合、リーク、ショート、トラッキングなどに
よって誤動作を生じ、最悪の場合には発火する危険性が
ある。Washing machines, rice cookers, and
Even in the field of home appliances, such as dryers, we are using microcomputers to computerize them, attaching sensors, and
We are adding more functions and creating unique products. However, household electrical appliances are often used in high-humidity environments that use water, such as in bathrooms, kitchens, and under eaves, and if water condenses on electronic components due to temperature differences or is directly exposed to water, leaks may occur. Malfunctions may occur due to short circuits, tracking, etc., and in the worst case, there is a risk of fire.
チップ部品のみからなる実装基板であれば1、通常の液
状樹脂中に浸漬し、引き上げ液切りをした後、硬化させ
ることによってリード端子を被覆できるが、端子間の電
位差が100■以上の交流回路においてモーターの速度
制御や直流回路においてスイッチなとに使用されるサイ
リスク日1、削’を圧・電流容量・熱放散性なとから、
チップ化か困難で、ディスクリート部品の′−4外であ
り、l・ライアノクなとは放熱板を数例け、テノくイス
の温1及上昇を押えている為、リート部分は樹脂かう土
<イ;」着しな(ハで露出した1捷であり、」(ね塗り
をすれば被覆できるが、量産性のないものになってしま
う。丑だ、チクソトロビノク性の尚い液状樹脂中に浸漬
し、厚く被覆し/こものは、浸漬時のし・〈リング性、
液切れ性か悪く、硬化1粕にダしたり、必要としない部
分丑で厚く皮膜するので、高価なものになっている。If it is a mounted board consisting only of chip components, the lead terminals can be covered by dipping it in a normal liquid resin, pulling it up, draining the liquid, and curing it, but for AC circuits where the potential difference between the terminals is 100 μ or more Cyrisk is used for speed control of motors and switches in DC circuits.
It is difficult to make it into a chip, and it is outside of the discrete component '-4, and since it is a l.ryanok, several heat sinks are installed to suppress the temperature rise of the chair, so the leat part is made of resin. (It is possible to cover it by painting it, but it will not be suitable for mass production.) It is immersed in a liquid resin with no thixotrobinok properties. and cover it thickly/thickly.
It is expensive because it has poor drainage properties, dregs into hardened lees, and forms a thick film on parts that are not needed.
したかって、端子間の電位差が1o○■以十の回路に用
いられるサイリスタのリード部分のみをチクソトロビノ
ク性のある樹脂で局部的に被覆し他の電子部品は浸漬に
よ−〕て被覆し、耐リーク性・耐ショート性・耐トラツ
キング性に優れたものにすれはよいが、サイリスタ実装
面のIJ−1,端子と回路面とノ・ンダにより接続した
リード端子を同時に局部被覆できないので、一方の面の
リード端子を局部被覆し、硬化させた後、他方の面のリ
ード端子を局部被覆し、硬化させる必要があり、量産性
に欠ける。Therefore, only the lead parts of thyristors used in circuits where the potential difference between the terminals is 1 o○■ or more are locally coated with a thixotrobinok resin, and other electronic parts are coated by immersion. It would be better to use a material with excellent leakage, short-circuit resistance, and tracking resistance, but it is not possible to locally cover the IJ-1 on the thyristor mounting surface, the terminal and the lead terminal connected to the circuit surface and the solder at the same time. After the lead terminals on one side are locally coated and cured, the lead terminals on the other side need to be locally coated and cured, resulting in a lack of mass productivity.
発明の目的
本発明は例えは端子間の電位差か100■以上の回路に
使用されるサイリスタに結露水や水が直接かかった場合
でも耐リーク性・耐ショート性・耐トラツキング性に優
れ、誤動作や発火の危険性のない安全性の高いサイリス
タ実装基板を得るのが目的である。Purpose of the Invention The present invention has excellent leak resistance, short circuit resistance, and tracking resistance, and prevents malfunctions even when a thyristor used in a circuit with a potential difference between terminals of 100 μ or more is directly exposed to condensation or water. The purpose is to obtain a highly safe thyristor-mounted board with no risk of fire.
発明の構成
本発明のサイリスタ実装基板はプリント基板のスルーホ
ールにサイリスタのリード端子を前記プリント基板の第
1主面側より挿入し、前記プリント基板の第2主面側で
前記リード端子と配線部をハンダにより電気的接続して
なり、前記プリント基板の前記リード端子間にスリット
が形成され、前記第1主面側のリード端子がチクントロ
ピノク性樹脂で被覆されるとともに前記第2主面側のリ
ード端子が前記スリットを介したチクソトロピノク性樹
脂で被覆され、さらに前記チクソトロピノク樹脂の少な
くとも一部が防湿膜で被覆されたものである。Structure of the Invention In the thyristor mounting board of the present invention, the lead terminal of the thyristor is inserted into the through hole of the printed board from the first main surface side of the printed board, and the lead terminal and the wiring part are inserted into the through hole of the printed board from the first main surface side of the printed board. are electrically connected by solder, a slit is formed between the lead terminals of the printed circuit board, the lead terminals on the first main surface side are coated with chikuntropinok resin, and the leads on the second main surface side are The terminal is coated with a thixotropic resin through the slit, and at least a portion of the thixotropic resin is further coated with a moisture-proof film.
実施例の説明
本発明における端子間の電位差か10oV以上の回路に
使用されるサイリスタには3端子双方向性のトライアッ
ク、逆阻止3端子のパワー1〜シンシスター、GTO(
ケートターンオフザイリスク)、逆阻止2端子の半導体
整流ダイオードなどがあるが、これらに限定されるもの
ではない。Description of Examples In the present invention, thyristors used in circuits with a potential difference between terminals of 10 oV or more include a three-terminal bidirectional triac, a reverse blocking three-terminal power 1 to syn sister, and a GTO (
Examples include, but are not limited to, reverse-blocking two-terminal semiconductor rectifier diodes.
チクソトロピンク性樹脂はエポキン樹脂、ポリブタジェ
ン樹脂、アクリル樹脂、ポリエステル樹脂などにチクソ
トロピ・/り性M8剤を添加することによって得るこる
ができ、これらを変性し5たものも使用でき、必要に応
じて、キンレン、トルエン、メチルエチルケトン、酢酸
ブチルなとの溶剤を添加したり、赤リン、リン化合物、
ブロム化合物、水利アルミナなどの難燃化剤を加え、難
燃化することもできる。そして、チクントロピック性樹
脂のチクソトロピノク指数は3以上のものが望1しく、
指数か3以下であると、サイリスク実装面のり一ト端子
を被覆1−でも硬化時にダしてリード端子か露出したり
、回路面に必要とする突起を設けることかできなくなる
。Thixotropic resin can be obtained by adding a thixotropic M8 agent to Epoquine resin, polybutadiene resin, acrylic resin, polyester resin, etc. Modified products of these can also be used. Then, add solvents such as quinolene, toluene, methyl ethyl ketone, butyl acetate, or add red phosphorus, phosphorus compounds,
It is also possible to add flame retardants such as bromine compounds and alumina to make it flame retardant. It is desirable that the thixotropic resin has a thixotropic index of 3 or more.
If the index is less than 3, the lead terminals will be exposed even if the glue terminals are coated on the silicone mounting surface during curing, or the necessary protrusions cannot be provided on the circuit surface.
一方、浸漬による防湿被覆はチタンドロピンク性樹脂と
同様な樹脂か使用でき、レベリング性。On the other hand, moisture-proof coating by dipping can use resin similar to titanium drop pink resin and has leveling properties.
液切れ性、チップ部品・半導体などの被覆性から浸漬時
の粘度か200〜2000 cps の範囲のものが
望せしい。It is desirable that the viscosity at the time of immersion be in the range of 200 to 2000 cps from the viewpoint of drainage properties and coverage of chip parts, semiconductors, etc.
ところで、サイリスクのリード端子間に設けるスリット
の幅は狭すぎると回路面に突起を設けるのが困難で、広
すきるとチクソトロピノク性樹脂が硬化時にダレる危険
性があること、プリント基板の強度、回路の構成などか
ら2〜B膿の範囲が望ましく、回路面からの突起の高さ
はサイリスクのリード端子がかくれる2胴以上必要であ
る。By the way, if the width of the slit between the lead terminals of Cyrisk is too narrow, it will be difficult to create protrusions on the circuit surface, and if the slit is too wide, there is a risk that the thixotropic resin will sag during curing, and the strength of the printed circuit board and the circuit will be affected. A range of 2 to B is desirable due to the structure, and the height of the protrusion from the circuit surface needs to be at least 2 to hide the lead terminal of the cyrisk.
以下、本発明のさらに具体的な実施例について、図面を
参照しながら説明する。第1図、第2図は本発明の実施
例におけるサイリスクを実装したプリント基板のそれぞ
れ平面図、断面図である。端子間にスリッl−2,21
,22を設り−たプリント基板1上に、回路バク−ン1
0、端子間のjh4 f’1.;!rか110■のトラ
イアック3、LEL14,41、端子間の電位差か10
5■の半導体整流型ダイオード6、電解コンデンサ−6
、ディスクリート型抵抗7,71、ジャンパー線8、チ
ノノ雪<j1品9゜91からなる実装基板に、チクノト
ロビック指数が4.6 の主剤かエボキ/樹脂、硬化
剤かポリアミドアミンからなる44脂でテイスペノザ−
を用いてトライアック3、半導体、!Iに原型タイオー
1・5の実装面のリード端子を完全に被覆するとともに
スリットを介して回路面のリ−1・端子も同時に被設し
、100’C,30分の硬化条件で硬化させ、チクソト
ロピノク性樹脂による被覆11を作成した3、次に、電
子回路を構成した実装基板を粘度が510Cps の
主剤ポリエステル樹脂、硬化剤カイノ7アネ−1・から
なる樹脂中に浸漬し、100℃、20分の硬化条件で硬
化させ、浸漬による防湿被螢12を作成した。Hereinafter, more specific embodiments of the present invention will be described with reference to the drawings. FIGS. 1 and 2 are a plan view and a sectional view, respectively, of a printed circuit board on which a SIRISK according to an embodiment of the present invention is mounted. Slit between terminals l-2, 21
, 22 are installed on the printed circuit board 1.
0, jh4 f'1 between terminals. ;! r or 110■ triac 3, LEL14, 41, potential difference between terminals or 10
5■ semiconductor rectifier diode 6, electrolytic capacitor 6
, discrete type resistors 7, 71, jumper wires 8, and 44 resin consisting of base material or ebony/resin with a chikunotorovic index of 4.6 and hardening agent or polyamide amine on a mounting board consisting of −
Using triac 3, semiconductor,! Completely cover the lead terminals on the mounting surface of prototype TIO 1 and 5 on I, and simultaneously cover the lead terminals on the circuit surface through the slit, and cure at 100'C for 30 minutes. After creating the coating 11 with thixotropic resin, the mounting board on which the electronic circuit was formed was immersed in a resin consisting of a polyester resin as a main component with a viscosity of 510 Cps and a curing agent of Kaino 7Ane-1, and heated at 100°C for 20 minutes. The moisture-proof cover 12 was prepared by dipping the resin under the curing conditions of 10 minutes.
以上のようにして作成した本発明のサイリスタ実装基板
は、40℃、1oo%RH中、定格110V連続印加の
条件、すなわち、端子間に電位差か100■以七かかっ
たサイリスタを含んだ電子回路に水か結露した状態で、
10o o Hr 経過してモl)−り、ンヨート、ト
ラッキングによる誤動作もなく、正常であった。The thyristor-mounted board of the present invention produced as described above can be used in an electronic circuit including a thyristor under the conditions of continuous application of rated 110V at 40°C and 1oo%RH, that is, a potential difference of 100 cm or more is applied between the terminals. In a state of water or condensation,
After 10 hours passed, there was no malfunction due to malfunction or tracking, and everything was normal.
発明の効果
以上の説明から明らかなように、本発明のサイリスタ実
装基板はサイリスタをプリント基板に実装する場合、サ
イリスタのリード端子間にスリットを設け、チタンドロ
ピンク性樹脂でサイリスタ実装面のリード端子を完全に
被覆するとともに、スリットを介して回路面のリード端
子も同時に被覆することによって、温度差によって水が
結露したり、水が直接かかった場合でも耐リーク性、耐
ショート性、耐トラツキング性に優れ、誤動作や発火の
危険性がない等の効果がある。Effects of the Invention As is clear from the above description, when the thyristor is mounted on a printed circuit board, the thyristor mounting board of the present invention provides a slit between the lead terminals of the thyristor, and the titanium droppink resin is used to close the lead terminal on the thyristor mounting surface. In addition to completely covering the lead terminals on the circuit surface through the slits, it has leak resistance, short circuit resistance, and tracking resistance even when water condenses due to temperature differences or is directly exposed to water. It has advantages such as excellent performance and no risk of malfunction or fire.
第1図は本発明の実施例におけるサイリスタを実装した
プリント基板平面図、第2図は同断面図である。
1・・・・プリント基板、2,21.22 端子間
に設けたスリット、3・・端子間の電位差か110vの
トライアック、5−・ 端子間の電位差が105■の半
導体整流型ダイオード、11チクントロビノク性樹脂に
よる被覆、12 浸漬による防湿被覆。FIG. 1 is a plan view of a printed circuit board mounted with a thyristor according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof. 1... Printed circuit board, 2, 21.22 A slit between the terminals, 3... A triac with a potential difference of 110 V between the terminals, 5-... A semiconductor rectifier diode with a potential difference of 105 cm between the terminals, 11 Chikuntrovinok 12 Moisture-proof coating by dipping.
Claims (3)
リード端子を前記プリント基板の第1主面側より挿入し
、前記プリント基板の第2主面側で前記リード端子と配
線部をハンダにより電気的接続してなり、前記プリント
基板の前記リード端子間にスリットが形成され、前記第
1主面側のリード端子がテクノトロピック性樹脂で被覆
されるとともに前記第2主面側のリード端子が前記スリ
ットを介したテクノトロピック性樹脂で被覆され、さら
に前記チクソトロビック樹脂の少なくとも一部が防湿膜
で被覆されたことを特徴とするサイリスタ実装基板。(1) Insert the lead terminal of the thyristor into the through hole of the printed circuit board from the first main surface side of the printed circuit board, and electrically connect the lead terminal and the wiring part with solder on the second main surface side of the printed circuit board. A slit is formed between the lead terminals of the printed circuit board, the lead terminal on the first main surface side is coated with a technotropic resin, and the lead terminal on the second main surface side is coated with a technotropic resin. What is claimed is: 1. A thyristor mounting board, characterized in that the thyristor-mounted board is coated with a thixotropic resin, and further, at least a portion of the thixotropic resin is coated with a moisture-proof film.
圧が印加されるものであることを特徴とする特許請求の
範囲第1項記載のサイリスタ実装基板。(2) The thyristor mounting board according to claim 1, wherein the thyristor has a voltage of 100 μ or more applied between its terminals.
指数(回転粘度側で2rpmの粘度/ 2 Or pm
の粘度)が3以上であることを特徴とする特許請求の範
囲第1項記載のサイリスタ実装基板。(3) Thixotropic index of technotropic resin (viscosity at 2 rpm on rotational viscosity side/2 Or pm
The thyristor-mounted substrate according to claim 1, wherein the thyristor-mounted substrate has a viscosity of 3 or more.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58067315A JPS59193055A (en) | 1983-04-15 | 1983-04-15 | Thyristor mounting board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58067315A JPS59193055A (en) | 1983-04-15 | 1983-04-15 | Thyristor mounting board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59193055A true JPS59193055A (en) | 1984-11-01 |
Family
ID=13341461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58067315A Pending JPS59193055A (en) | 1983-04-15 | 1983-04-15 | Thyristor mounting board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59193055A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4985747A (en) * | 1988-06-09 | 1991-01-15 | Oki Electric Industry Co., Ltd. | Terminal structure and process of fabricating the same |
-
1983
- 1983-04-15 JP JP58067315A patent/JPS59193055A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4985747A (en) * | 1988-06-09 | 1991-01-15 | Oki Electric Industry Co., Ltd. | Terminal structure and process of fabricating the same |
US4989318A (en) * | 1988-06-09 | 1991-02-05 | Oki Electric Industry Co., Ltd. | Process of assembling terminal structure |
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