JPS5918645A - Liquid phase epitaxial growth apparatus - Google Patents

Liquid phase epitaxial growth apparatus

Info

Publication number
JPS5918645A
JPS5918645A JP12865782A JP12865782A JPS5918645A JP S5918645 A JPS5918645 A JP S5918645A JP 12865782 A JP12865782 A JP 12865782A JP 12865782 A JP12865782 A JP 12865782A JP S5918645 A JPS5918645 A JP S5918645A
Authority
JP
Japan
Prior art keywords
substrate
epitaxial layer
pressure
heater
epitaxial growth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12865782A
Other languages
Japanese (ja)
Inventor
Mitsuo Yoshikawa
吉河 満男
Hiroshi Takigawa
宏 瀧川
Michiharu Ito
伊藤 道春
Kenji Maruyama
研二 丸山
Tomoshi Ueda
知史 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12865782A priority Critical patent/JPS5918645A/en
Publication of JPS5918645A publication Critical patent/JPS5918645A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02623Liquid deposition
    • H01L21/02625Liquid deposition using melted materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/024Group 12/16 materials
    • H01L21/02411Tellurides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/02562Tellurides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02623Liquid deposition
    • H01L21/02628Liquid deposition using solutions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Abstract

PURPOSE:To obtain a high quality epitaxial growth film under normal temperature by accommodating the component which is easily vaporized in the epitaxial layer forming material within a recess formed at a part of fine tube connected to a hermetically sealed reservior, heating it under the control, balancing a divided pressure thereof with a vapor pressure of epitaxial growth solution within the reservior and moreover providing an exhaust valve. CONSTITUTION:The Hg1-xCdxTe 16 and CdTe substrate 16 are accommodated within a reservior 11 under the support by a bar 13 and the inside is exhausted to the vacuum condition. The heaters 17, 21 are set respectively to 500 deg.C, 300 deg.C, H2 is supplied to a fine tube 18. When vapor pressure of reservoir is 1kg/cm<2>, a gas is introduced from a valve 14 and a divided pressure of Hg 20 within a recess 19 is balanced to the vapor pressure of reservoir 11 by adjusting the heater 21. Next, the solution 12 is dipped into the solution 16, temperature of heater 17 is lowered with the specified gradient. Thereby, an epitaxial layer of Hg1-xCdxTe is provided on the substrate and then substrate is lifted after the specified period. The space 23 in the reservoir 11 is saturated by the Hg vapor and high pressure is no longer necessary for preventing evaporation from the matrial 16. Moreover, unwanted material 16 falls by its own weight while it is lifted and thereby a high quality epitaxial layer can be obtained without surface damage, unlike the sliding method.

Description

【発明の詳細な説明】 (al@明の技術分野 本発明は液411エピタキシャル1j35長装置の改良
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an improvement in a liquid 411 epitaxial 1j35 length device.

(至)技術の背景 赤外線検知素子のような光電変換素子形成材料としては
水銀・カドミウム°・テlレル(Hgx−xCdxTe
 )のようなエネルギーギャップの狭い化合物半導体結
晶が用いられているのは周知である。このような化合物
半4体結晶を素子形成に都合が良いように大面積でしか
も薄層の状態で得るように1するだめに、CdTe (
カドミウム・テルル)の基板−1−にT(g 3−Xc
dXTeの結晶を面相エビタギシャp成長方法で形成す
る方法がとられている。
(To) Background of the technology Materials for forming photoelectric conversion elements such as infrared sensing elements include mercury, cadmium, and Terrell (Hgx-xCdxTe).
It is well known that compound semiconductor crystals with narrow energy gaps such as those shown in (a) are used. CdTe (
T (g 3-Xc
A method has been adopted in which dXTe crystals are formed by a phase-phase p-growth method.

(C1従来技術と問題点 この上うな液相エビタキシャI’rly、長方法として
は、第1図に示すようなディッピング法と称する方法が
ある。
(C1 Prior Art and Problems) Furthermore, as a long method for liquid-phase shrimp taxa, there is a method called the dipping method as shown in FIG.

この方法に用いる装置としては図示するように石英等よ
りなる気密構造の容器l内で上下方向に移動しCd、T
eよりなる基板2を保持する支持棒8を設置している。
As shown in the figure, the apparatus used in this method moves vertically within an airtight container l made of quartz or the like.
A support rod 8 is installed to hold the substrate 2 made of e.

一方、該容器l内には基板2J:に形成すべき結晶層の
材料となるf(gl zcd−zTeの合金4を充填し
、該容器l内を真空に排気するようにしている。また該
容器の空間部5にHR:t−xCdXTθの合金4を溶
融した際に易蒸発性のHgが蒸発しないように配管6よ
りアルゴン(Ar)ガスへ9・の不活性ガスを10kt
i/lyg” の程度の圧力で封入するようにし、この
状態で容器lの周囲に設けたヒータを加熱してl1g 
1−xcd)(Teの月料4を溶解する。
On the other hand, the container 1 is filled with alloy 4 of f(gl zcd-zTe, which is the material of the crystal layer to be formed on the substrate 2J), and the interior of the container 1 is evacuated. In order to prevent easily evaporable Hg from evaporating when alloy 4 of HR: t-xCdXTθ is melted in space 5 of the container, 10 kt of inert gas of 9 is supplied to argon (Ar) gas through piping 6.
In this state, a heater installed around the container l is heated to give a pressure of l1g.
1-xcd) (dissolve Te monthly charge 4.

その後支持棒3を下降させ基板2を)(g 1−zC(
IX′Peの浴液に浸漬せしめたのち、ヒータ70濡度
を所定の温度勾配で低「させて基板2玉にHg1−xc
ctX’reのエビタキンヤル層を形成し、所定の時間
終了して基板2kに所定の厚さのエビタキンヤル層が形
成された段階で、支持棒8 (11−L(gl−)(c
d)(’reの溶液より北部に移動させて是仮2上にエ
ビタキシャ/し層を形成するようにしている。
After that, the support rod 3 is lowered to lower the substrate 2)(g 1-zC(
After immersing the substrate in the bath solution of IX'Pe, the wetness of the heater 70 is lowered at a predetermined temperature gradient to inject Hg1-xc onto the two substrates.
ctX're is formed, and when the predetermined period of time has ended and the Evita Kinyal layer of a predetermined thickness has been formed on the substrate 2k, the support rod 8 (11-L(gl-)(c
d) (It is moved to the north of the solution of 're to form a layer of Ebitaxia on top of 2.

しかしこのような方法であると容器内を高圧に保つ必要
があり、そのため容器が破損して材料が損失する等欠点
が多い。
However, such a method requires maintaining the inside of the container at a high pressure, which has many disadvantages such as damage to the container and loss of material.

またこのような方法の池に通常良く知られている方法と
してスライディング法がある。
A sliding method is a well-known method of this type.

この方法に用いる装置としては周知のように例えば直方
体形状のカーボンよりなる支持台とその上をスライドし
て移動するスライド部AAより構成されるエピタキシャ
ル成長用治具を用いる。そしてFlIJ記叉持台にはC
dTeの基板を埋設する凹所を設は該凹所に基板を埋設
し、またスライド部材にtよ方ibの以油孔状の腋だめ
を設け、この液だめ内に基板1に形成すべきHg1〜x
Cd)(Teの材料を充填する。そしてこの状態で支持
台とスライド部材とからなるエビタキシャ)V成長用治
具を水素(Hg)カス雰囲気の反応管中に挿入し、該反
応管をヒータにて加熱して【(fだめ内のHg 1−X
ca、)(’reの拐料を溶融する。その後スライド部
材を移動して基板上に故だめを静置してからヒータの温
度を低下させテCd’I’e )基板k K Hg 1
−xccj−xTe I)結晶層全形成する方法である
The apparatus used in this method is, as is well known, an epitaxial growth jig comprising, for example, a rectangular parallelepiped support made of carbon and a slide portion AA that slides on the support. And on the FlIJ record stand there is a C.
A recess for embedding the dTe substrate is provided, and the substrate is buried in the recess, and an axillary sump in the form of an oil hole from t to ib is provided in the slide member, and the substrate 1 is formed in this sump. Hg1~x
Cd) (Te material is filled. Then, in this state, a jig for Ebitakisha) V growth consisting of a support stand and a slide member is inserted into a reaction tube in a hydrogen (Hg) gas atmosphere, and the reaction tube is placed in a heater. Heat it to [(Hg in the f reservoir 1-X
ca, ) ('re melting material. After that, move the slide member and leave the waste on the substrate, and then lower the temperature of the heater. ) Substrate k K Hg 1
-xccj-xTe I) This is a method of forming the entire crystal layer.

しかしこのような方法であるとCd’]’eの基板の厚
さが埋設する支持台の凹所の深さより1享いとスライド
部材を移動させる際に核部Hの底面で基板表面を傷つけ
たり、またCdTeの基板の厚さが四ノ9rの深さより
小さい寸法であるとエピタキシャル成長後スライド部材
を移動させても成長後糸根土に残留している不要なHg
l zed>H’l’eの溶液を充分ぬぐい去ることが
できない欠点を生じる。そのため基板の厚さを精度良く
研磨する必要があり、工程土工数が長くかかりすぎる欠
点がある。
However, with this method, if the thickness of the substrate Cd']'e is one inch greater than the depth of the recess of the buried support, the bottom surface of the core H may damage the substrate surface when the slide member is moved. Furthermore, if the thickness of the CdTe substrate is smaller than the depth of 4-9r, even if the slide member is moved after epitaxial growth, unnecessary Hg remaining in the filamentous soil after epitaxial growth will be generated.
This results in the disadvantage that the solution where l zed>H'l'e cannot be sufficiently wiped away. Therefore, it is necessary to precisely polish the thickness of the substrate, which has the disadvantage that the number of earthworks required is too long.

また一般に前述したヌフィテ°イング法はスライド部材
を移動する際に基板表面に傷をっけたり、またエピタキ
シャル層を形成後、基板上に残留している不要なHg 
1−)(CdXTeの溶液を充分ぬぐい去ることができ
ず、そのため基板上に形成されるエビタキンヤp層に結
晶欠陥を生じるなど欠点が多い。
In addition, the above-mentioned Nufiting method generally causes scratches on the substrate surface when moving the slide member, and unnecessary Hg that remains on the substrate after forming the epitaxial layer.
1-) (The CdXTe solution cannot be sufficiently wiped away, which has many drawbacks, such as crystal defects occurring in the Evita Kinya p layer formed on the substrate.

(tjJ  発明の1目的 本発明は上述した欠点を除去し、ティッピンク法によっ
てエピタキシャル層を形成する場合におけるように装置
が高耐j王を必要とするような複雑なものでなく1に9
/CN2程度の常圧で動作できるような装置で済み、ま
た7ライデインク法のように基板表面の結晶層に傷が発
生しないような、前車な装置で高品質なエピタキシャル
結晶層が得られるような新規な液相エピタキシャル成長
装置の提供を目的とするものである。
(tjJ 1.Object of the Invention The present invention eliminates the above-mentioned drawbacks, and eliminates the need for a complex device that requires a high resistance as in the case of forming an epitaxial layer by the tipping method.
It is possible to obtain a high-quality epitaxial crystal layer using a device that can operate at normal pressure of /CN2, and does not cause scratches on the crystal layer on the surface of the substrate as in the 7 Leydenk method. The purpose of this invention is to provide a novel liquid phase epitaxial growth apparatus.

fe)  発明の構成 かかる目的を達成するだめの本発明の面相エピタキシャ
ル成長装置は気密容器内に収容されているエピタキシャ
ル層成長用溶液内へ支持棒で支持し〆こ基板を浸漬して
基板上にエピタキシャルj−を成長する装置において、
前記気密容器に連通して一部にエピタキシャル層成長用
材料のうち、易蒸発性成分を収容する凹所を有する細管
を設置し、[11J記四所の周囲に易蒸発性成分の分圧
と気密容器内の溶液の蒸気圧とを平衡に制御するための
ヒータを設け、史に前記気密容器に排気バルブを有する
排気管を設けたこと(!−特徴とするものである。
fe) Structure of the Invention In order to achieve the above object, the surface phase epitaxial growth apparatus of the present invention supports the substrate with a support rod into an epitaxial layer growth solution housed in an airtight container, and then immerses the substrate to form an epitaxial layer on the substrate. In the apparatus for growing j-,
A thin tube communicating with the airtight container and having a recess for accommodating an easily evaporable component of the material for epitaxial layer growth is installed in a part thereof, and A heater is provided to balance the vapor pressure of the solution in the airtight container, and an exhaust pipe having an exhaust valve is provided in the airtight container.

([)発明の実施例 以下図面を用いて本発明の一実施例につき詳細に説明す
る。
([) Embodiment of the Invention An embodiment of the invention will be described below in detail with reference to the drawings.

第2図は本発明の2夜相エピタキシヤル成長装置の概略
図で、図示するように気密114造となっている石英製
の容器2内にCdTeの基板12f、支え上「に# d
(!Iさせる石英製の支持棒13を設置している。また
該容器11には容器内を排気するだめの排気パルプ14
を有する排気管15を接続し、該容器には基板12.J
:に形成すべき結晶層の材料(7) Hg 1−xCd
xT eの材料16を充填し、また容器11の周辺には
該容器11を加熱するためのヒータ17を設けている。
FIG. 2 is a schematic diagram of the two-night phase epitaxial growth apparatus of the present invention. As shown in the figure, a CdTe substrate 12f is placed in a quartz container 2 with an airtight structure, and a CdTe substrate 12f is placed on a support.
(!I) A support rod 13 made of quartz is installed in the container 11. Also, an exhaust pulp 14 for exhausting the inside of the container is installed in the container 11.
An exhaust pipe 15 having a substrate 12. is connected to the container, and a substrate 12. J
: Material of crystal layer to be formed (7) Hg 1-xCd
The container 11 is filled with xTe material 16, and a heater 17 for heating the container 11 is provided around the container 11.

一方該容器11に連通して細管18を設け、この細管1
8の途中には膨らみをもだした凹所19を設け、該凹所
に基板上に形成すべきHg 1−xCdxTeの材料の
うち易蒸発性の水銀(Hg)20を収容している。そし
てこの凹所19の周辺には水銀20の蒸気圧を制御する
だめの分圧制御用ヒータ21を設けている。
On the other hand, a thin tube 18 is provided in communication with the container 11, and this thin tube 1
A bulging recess 19 is provided in the middle of the substrate 8, and mercury (Hg) 20, which is easily evaporated out of the Hg 1-xCdxTe material to be formed on the substrate, is accommodated in the recess. A partial pressure control heater 21 for controlling the vapor pressure of mercury 20 is provided around this recess 19.

このような装置を用いてCclTeの基板12上にII
(gl−zcdXTeの結晶をエピタキシャル成長させ
る場合について述べる。
II on the CclTe substrate 12 using such a device.
(The case where a crystal of gl-zcdXTe is grown epitaxially will be described.

’1. fm閉fA 22 を開イテ)(gx−xcd
x’、[’eの材料16を充填したのち支持棒18に設
置した基板12を容器11内に挿入する。
'1. fm closed fA 22 open) (gx-xcd
After filling the materials 16 of x' and ['e, the substrate 12 placed on the support rod 18 is inserted into the container 11.

その後容器ll内をパルプ14を開いて真空J?その後
パルプ14を閉じ、ヒータ17の温度が50071; 
、ヒータ21の温度が300℃になるように設定し、細
管18内に矢印Aのように水素(Hg)ガスを導入する
。そして容器ll内の蒸気圧が1kg7cmgになった
時点でパルプ■4を開き細管内へガスを導入し、かつヒ
ータ21の温度を調節して凹所19内の水銀20の分圧
が容器ll内の蒸気圧と平衡になるようにする。その後
支持棒18をト降させテHg1−XCdXTeo溶0.
16中に浸漬させヒータ17の湿度をHr定の温度勾配
で低下させてCcL’L’eの基板12土にHg 1−
XCd)(’l’e (7)結晶層を形成する。
After that, open the pulp 14 inside the container ll and vacuum J? After that, the pulp 14 is closed and the temperature of the heater 17 is 50071;
The temperature of the heater 21 is set to 300° C., and hydrogen (Hg) gas is introduced into the thin tube 18 as indicated by arrow A. Then, when the vapor pressure in the container 11 reaches 1 kg 7 cmg, the pulp 4 is opened and gas is introduced into the thin tube, and the temperature of the heater 21 is adjusted so that the partial pressure of the mercury 20 in the recess 19 is reduced to 1 kg. The vapor pressure should be in equilibrium with the vapor pressure of After that, the support rod 18 is lowered and the Hg1-XCdXTeo melts 0.
Hg 1-
XCd)('l'e (7) Form a crystal layer.

その後所定の時間経たのち、支持棒18を上部に引き上
げエビタキシャ7し成長を停止させる。
After a predetermined period of time has elapsed, the support rod 18 is pulled upwards and the shrimp taxa 7 is pulled up to stop the growth.

このようにすると容器11の内部の空間部23は細管1
8より流入されるHgの蒸気で飽和され、そのだめ従来
の方法のように空間部23を高圧のArガスで埋めて容
器内のHg1−yCdXTθの4J料よりを間部28へ
Hgが蒸発するのを防止する必要がなく約1kg/cm
の常圧でエピタキシャル成長が可能となる。
In this way, the space 23 inside the container 11 is
The space 23 is filled with high-pressure Ar gas as in the conventional method, and Hg evaporates from the 4J material of Hg1-yCdXTθ in the container into the space 28. Approximately 1kg/cm without the need to prevent
Epitaxial growth is possible at normal pressure.

まだエビタキシャlし成長後基板12を北部に移動させ
ることでノ&板上に付着しているHg 1−xCαXT
eの溶液も自重で容易に下部の方向へ落下し、基板表面
が従来のスライド法のように傷がついたり、また基板上
に不要な成長後のHgt−xC(IXTeの溶液が付着
する現象がなくなり、高品質なエピタキシャル層が簡単
な装置で容易に得られる。
By moving the substrate 12 to the north after the epitaxy and growth, the Hg 1-xCαXT attached to the plate is removed.
The solution in e also easily falls downward due to its own weight, causing scratches on the substrate surface as in the conventional sliding method, and the phenomenon in which unwanted Hgt-xC (IXTe solution) adheres to the substrate after growth. A high-quality epitaxial layer can be easily obtained using a simple device.

リ 発明の効果 以上述べたように本発明の液相エピタキシャlし成長方
法によれば、容器内の圧力を高圧に保つ必要がなくなり
、また基板に傷が発生しない高品質のエピタキシャル層
が得られる利、ヴ、を生じる。
Effects of the Invention As described above, according to the liquid phase epitaxial growth method of the present invention, there is no need to maintain the pressure inside the container at a high pressure, and a high quality epitaxial layer that does not cause scratches on the substrate can be obtained. Produces profit, v,.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の液相エピタキシャル成長方法に用いる装
置の概略図、第2図は本発明の液相エビタキシャtvF
t、長方法に用いる装置の4電絡図である。 1.11は気密容器、2,12はCd−Te基板、8、
[8は支持棒、4.16はt(gl−xCdz’L”e
の材料、5.23は空間部、6.15は排気管、7゜1
7はヒータ、18は細管、19は凹所、20は水銀、2
1は分圧制御1−+1ヒータ、Aはガス導入方向留水す
矢印である。
FIG. 1 is a schematic diagram of an apparatus used in a conventional liquid phase epitaxial growth method, and FIG. 2 is a schematic diagram of a device used in a conventional liquid phase epitaxial growth method.
t is a four-electrome diagram of the device used in the long method. 1.11 is an airtight container, 2 and 12 are Cd-Te substrates, 8,
[8 is the support rod, 4.16 is t(gl-xCdz'L”e
material, 5.23 is the space, 6.15 is the exhaust pipe, 7゜1
7 is a heater, 18 is a thin tube, 19 is a recess, 20 is mercury, 2
1 is a partial pressure control 1-+1 heater, and A is an arrow indicating water retention in the gas introduction direction.

Claims (1)

【特許請求の範囲】[Claims] 気密容器内に収容されているエピタキシャル層成長用溶
液内へ支持棒で支持した基板を浸漬して基板上にエビタ
キシャIし層を成長する装置において、前記気密容器に
連通して一部にエピタキシャル層成長用材料のうち、易
蒸発性成分を収容する凹所を有する細管を設置し、前記
凹所の周囲に易蒸発性成分の分圧と気密容器内のRI液
の蒸気圧とを平衡に制御するだめのヒータを設け、更に
前記気密容器に排気パルプを有する排気管を設けたこと
を特徴とする液相エピタキシャlし成長装置。
In an apparatus in which a substrate supported by a support rod is immersed in an epitaxial layer growth solution housed in an airtight container and a layer is grown on the substrate by epitaxy, the epitaxial layer is formed in a part of the epitaxial layer in communication with the airtight container. A thin tube having a recess for accommodating an easily evaporable component of the growth material is installed, and the partial pressure of the easily evaporable component and the vapor pressure of the RI liquid in the airtight container are controlled in equilibrium around the recess. 1. A liquid phase epitaxial growth apparatus, characterized in that a heater is provided, and the airtight container is further provided with an exhaust pipe having exhaust pulp.
JP12865782A 1982-07-22 1982-07-22 Liquid phase epitaxial growth apparatus Pending JPS5918645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12865782A JPS5918645A (en) 1982-07-22 1982-07-22 Liquid phase epitaxial growth apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12865782A JPS5918645A (en) 1982-07-22 1982-07-22 Liquid phase epitaxial growth apparatus

Publications (1)

Publication Number Publication Date
JPS5918645A true JPS5918645A (en) 1984-01-31

Family

ID=14990222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12865782A Pending JPS5918645A (en) 1982-07-22 1982-07-22 Liquid phase epitaxial growth apparatus

Country Status (1)

Country Link
JP (1) JPS5918645A (en)

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