JPS59185845U

JPS59185845U - semiconductor equipment

Info

Publication number: JPS59185845U
Application number: JP7931983U
Authority: JP
Inventors: 姫野　和幸
Original assignee: 三菱電機株式会社
Priority date: 1983-05-26
Filing date: 1983-05-26
Publication date: 1984-12-10

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は従来の半導体装置を示す構成図、第２・図は第
１図の左側面図、第３図は本考案の一実施例を示す構成
図、第４図は第３図の左側面図である。１・・・・・・平形半導体素子、２・・曲溝電性冷却片
、５・・・」・・導電性ボルト、６・・・・・・絶縁管
、１１・・曲取付脚、１２・・・・・・撓み導体。なお
、図中、同一符号は同−又は相当部分を示す。Fig. 1 is a block diagram showing a conventional semiconductor device, Fig. 2 is a left side view of Fig. 1, Fig. 3 is a block diagram showing an embodiment of the present invention, and Fig. 4 is a left side view of Fig. 3. It is a front view. DESCRIPTION OF SYMBOLS 1... Flat semiconductor element, 2... Curved groove electrical cooling piece, 5... Conductive bolt, 6... Insulating tube, 11... Curved mounting leg, 12 ...Flexible conductor. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

A conductive cooling piece that is inserted between multiple semiconductor elements to electrically connect each semiconductor integrated element to each other and cool each semiconductor element, and a conductive cooling piece that presses and clamps each semiconductor element and the conductive cooling piece. A semiconductor device characterized by a bolt and a conductor connecting the conductive bolt and the conductive cooling piece.