JPS5918472U - Lead wire attachment device for metal-based circuit boards - Google Patents

Lead wire attachment device for metal-based circuit boards

Info

Publication number
JPS5918472U
JPS5918472U JP11390982U JP11390982U JPS5918472U JP S5918472 U JPS5918472 U JP S5918472U JP 11390982 U JP11390982 U JP 11390982U JP 11390982 U JP11390982 U JP 11390982U JP S5918472 U JPS5918472 U JP S5918472U
Authority
JP
Japan
Prior art keywords
lead wire
metal
attachment device
based circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11390982U
Other languages
Japanese (ja)
Inventor
寺中 俊幸
稲沢 嗣夫
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP11390982U priority Critical patent/JPS5918472U/en
Publication of JPS5918472U publication Critical patent/JPS5918472U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a、  bは紙フェノールやガラスエポキシ等の
絶縁ベースの基板にリード線を取り付ける従来例を示す
平面図および正面図、第2図a、  bは金属ベース回
路基板に対する従来のリード線取り付は構造を示す平面
図および正面図、第3図a。 b及び第4図a、  bは従来の絶縁ベースの基板にリ
ード線を取り付ける具体例を示す平面図および断面図、
第5図は本考案による金属ベース回路基板に対するリー
ド線の取り付は構造を示す断面図、第6図は本考案を実
施して金属ベース回路基板へリード線を取り付ける際の
半田ゴテからの熱の流れを示す平面図、第7図a、  
bは本考案の他の実施例を示す平面図、第8図a、  
bは小型直流モータの電源用リード線の取り付けに本考
案を実施した具体例を示す平面図および正面図である。 11・・・・・・ベース金属板、13・・・・・・導体
パターン、14・・・・・・端子部、15・・・・・・
導体ランド、16・・・・・・貫通孔、16′・・・・
・・切欠き、17・・・・・・リード線、18・・・・
・・芯線部、19・・・・・・半田。
Figures 1a and b are plan and front views showing a conventional example of attaching lead wires to an insulating base board such as paper phenol or glass epoxy, and Figures 2a and b are conventional lead wire attachments to a metal-based circuit board. Attached are a plan view and a front view showing the structure, and Figure 3a. b and FIGS. 4a and 4b are a plan view and a sectional view showing a specific example of attaching a lead wire to a conventional insulating base board,
Fig. 5 is a cross-sectional view showing the structure of attaching lead wires to a metal-based circuit board according to the present invention, and Fig. 6 is a sectional view showing the structure of attaching lead wires to a metal-based circuit board according to the present invention. A plan view showing the flow of FIG. 7a,
b is a plan view showing another embodiment of the present invention, FIG. 8a,
FIG. 1B is a plan view and a front view showing a specific example of the present invention applied to the attachment of a power supply lead wire for a small DC motor. 11... Base metal plate, 13... Conductor pattern, 14... Terminal section, 15...
Conductor land, 16... Through hole, 16'...
...Notch, 17...Lead wire, 18...
...Core wire part, 19...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属ベース回路基板の一部に、外部回路に接続されるリ
ード線の半田接続用導体ランドを有する端子部を設け1
.この端子部の導体ランドより回路基板側に孔あるいは
切欠きを設け、この孔あるいは切欠きに前記リード線の
被覆部を挿通し、かつリード線の芯線部を前記導体ラン
ドに半田接続した金属ベース回路基板のリード線取付装
置。
A terminal portion having a conductor land for solder connection of a lead wire connected to an external circuit is provided on a part of the metal base circuit board.
.. A metal base with a hole or notch on the side of the circuit board from the conductor land of the terminal, the sheath of the lead wire inserted through the hole or notch, and the core wire of the lead wire soldered to the conductor land. Circuit board lead wire attachment device.
JP11390982U 1982-07-27 1982-07-27 Lead wire attachment device for metal-based circuit boards Pending JPS5918472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11390982U JPS5918472U (en) 1982-07-27 1982-07-27 Lead wire attachment device for metal-based circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11390982U JPS5918472U (en) 1982-07-27 1982-07-27 Lead wire attachment device for metal-based circuit boards

Publications (1)

Publication Number Publication Date
JPS5918472U true JPS5918472U (en) 1984-02-04

Family

ID=30263509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11390982U Pending JPS5918472U (en) 1982-07-27 1982-07-27 Lead wire attachment device for metal-based circuit boards

Country Status (1)

Country Link
JP (1) JPS5918472U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126998A (en) * 1980-03-12 1981-10-05 Mitsubishi Electric Corp Method of connecting electric conductor
JPS5710781B2 (en) * 1975-12-16 1982-02-27

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710781B2 (en) * 1975-12-16 1982-02-27
JPS56126998A (en) * 1980-03-12 1981-10-05 Mitsubishi Electric Corp Method of connecting electric conductor

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