JPS59181654A - Terminal plate for semiconductor module - Google Patents

Abstract

PURPOSE:To obtain the titled plate of high quality and high dimensional accuracy without the generation of such an inconvenience as the stripping of a thin plate from the main body of said plate by a method wherein a main electrode terminal and a signal electrode terminal of different plate thickness respectively are formed into an integral body by means of a piece of metallic plate. CONSTITUTION:The terminal plate 21 is made of a piece of metallic plate coincident with the fixed plate thickness on the side of the main electrode terminal 22. In other words, the main body of said plate 21 is formed by punching from the metallic plate having the fixed plate thickness. The main body of this terminal plate 21 is punched in a prescribed shape equipped with the main electrode terminal 22 and the signal electrode terminal 23. The tip of said terminal 23 of said plate 21 is crushed to a thin plate by press-forming, thus being formed to a fixed plate thickness. This terminal plate 21 is treated with surface plating. The fixed plate thickness required to each of said terminal 22 and said terminal 23 can be obtained by only performing press working to the side of said terminal 23, since the plate thickness of the metallic plate serving as the material is coincident with the fixed plate thickness of said terminal 22.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a terminal board of a semiconductor module used, for example, as a control device for a motor of a household cooler.

[Technical background of the invention]

Generally speaking, semiconductor modules are used to control motors in household coolers and the like. FIG. 1 shows this semiconductor module, which includes a plurality of #=physiological elements 1
It is equipped with 1a and llb. This semiconductor element 11a, I
For example, lb converts the frequency, and the input/output electrodes of the semiconductor elements 11a and llb are connected to a plurality of terminal plates 12a to 12a.
12e to make an equal ratio. These terminal boards 12a to 12e are lo
As shown in FIG. 1(B), it consists of a main electrode terminal 13a that outputs no power and a signal electrode terminal 13b that outputs control signals for the semiconductor elements 11a and 11b, each of which has terminals +31). The tip of 13ψ is fixed with a fixing plate J4, and the semiconductor element 1
1a,llb′! i11' It is installed inside the rosin case 15.

FIG. 2 shows a terminal plate 12a for this semiconductor monoyl.
12e, one terminal plate 121f is shown, and this terminal plate 12 has a main electrode terminal 13a and a signal electrode terminal 13.
It is equipped with b. These respective electrode media 13a, 13
In b, the receivers (not shown) are required to have a predetermined thickness from the relationship with the side terminals, and when the thickness of the terminal board 12 body is matched to the predetermined thickness of the signal electrode terminal 13b side,
As shown in the second section 1(A), a thin metal plate 14a is wrapped around the main electrode terminal 13a and pressed to obtain a predetermined thickness.

In addition, as shown in FIG. 3(B), the main electrode terminal 13a
(Secondly, the thin plate 14b may be polymerized and pressed to obtain a predetermined thickness. Such a terminal plate 12 may be formed by passing through the plate or plating after pressing the thin plate 14a or 14b. Processing 'lL: to be applied.

[Problems with background technology]

However, in the terminal board 12 configured in this way, in order to obtain a predetermined thickness of the main electrode terminal 1' 3a, the thin plate 1
4a or 14b are attached or polymerized, respectively, so that a gap may occur between the plate 14a or 14b and the main body of the terminal plate 12, or the thin plate may peel off from the terminal plate 12. There is a fear. Furthermore, during the plating process after the thin plate press working, the plating solution may penetrate into the overlapping portion of the terminal plate 12 and the thin plate, which may deteriorate the quality of the terminal plate 12 itself.

[Purpose of the invention]

This invention was made in order to solve the above-mentioned problems, and provides a high quality and highly dimensionally consistent terminal for semiconductor modules without causing defects such as the thin plate peeling off from the terminal board body. The two purposes are to provide boards.

[Summary of the invention]

That is, the terminal board for a semiconductor module according to the present invention is
Main electrode terminal and signal electrode terminal with different plate thickness! ,
It is integrally molded from a single metal plate.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 3 shows the external appearance of this semiconductor module terminal board. This terminal board 21 is formed from a single metal plate (not shown) having a predetermined thickness on the main electrode terminal 22 side.

That is, first of all, from the metal plate having the above-mentioned predetermined thickness, the main body of the terminal plate 21! Form by punching. This terminal board 21 body is cut out in a prescribed shape that separates the main electrode terminal 22 part and the signal electrode terminal 23 part, and the tip part of the signal electrode terminal 23 of this terminal board 2 is press-molded. crush it into a thin plate shape and form it into a predetermined thickness. And a terminal fixing hole 24a.

24b and the chamfered portions 25a, 25b are formed by finishing punching of the outer shape of the semiconductor element 11a in FIG.
, llb are bent at right angles to the connecting portions 26 to the input/output electrode portions to form the terminal plate 21. This terminal 8+, 2
Step 1 is to perform surface plating treatment.

That is, in this terminal board 21, the predetermined thickness required for each of the main electrode terminal 22 and the signal electrode terminal 23 is such that the thickness of the metal plate that is the material thereof is the same as that of the main electrode terminal 22.
Since it matches the plate thickness of PJr, it can be obtained by simply applying sea press processing on the No. 8 electrode terminal 23 side.
3, even if it is integrally formed from a single metal plate, the shape will not deform and the light intensity will be maintained. Therefore, the connection state Z of the receiver with the side terminal can be maintained stably.

〔Effect of the invention〕

As described above, this invention (two folds) is made by integrally molding electrode terminals with different thicknesses from a single metal plate, which eliminates defects such as changes in the shape of the terminal board body and improves quality. The dimensions and sheath degree can be made the same as above, and the receiver can be connected to the terminals on the side securely.

[Brief explanation of drawings]

Figures 1 (A) and (B) are cross-sectional configuration diagrams showing the semiconductor module viewed from the top and side, respectively, and Figure 2 (A
) and (B) are external views showing conventional terminal boards used in the semiconductor module, respectively, and FIG. 3 is an external view illustrating a terminal board for a half module according to an embodiment of the present invention. 21... Terminal board, 22... Main electrode terminal, 23...
Signal electrode terminal, 24a, 24b...terminal fixing hole, 25
a, 25b... Chamfered portion, 26... Element connection portion.

Claims (1)

[Claims] A terminal board for a semiconductor module, which is formed by integrally molding at least two or more electrode terminals each having a different thickness from a single metal plate.