JPS59179603A - Curable resin material - Google Patents

Abstract

PURPOSE:A curable resin material capable of forming a cured product of a high inside hiding power and useful as a sealant for electronic parts such as composite blocks or integrated circuits, prepared by mixing a photocurable synthetic resin material with both a cold curing agent and a colorant. CONSTITUTION:A curable resin material prepared by mixing a photocurable synthetic resin material (e.g., epoxy acrylate or unsaturated polyester resin) with both a cold curing agent (e.g., a polyamide for epoxy resins and benzoyl peroxide for unsaturated polyesters) and a colorant (e.g., red iron oxide pigment or chrome yellow pigment). This resin material can form a cured product of a high inside hiding power and is useful as, for example, a sealant for eldctronic parts such as composite blocks or integrated circuits.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a curable resin material used as a sealing material for electronic components such as composite blocks and integrated circuits (ICs), and others.

[Background technology]

Among the curable resin materials, there are those whose main component is photocurable synthetic resin such as ultraviolet (UV) curable resin. This material cures by simply irradiating it with light such as ultraviolet rays, and does not require heating unlike products whose main component is thermosetting synthetic resin. It can be said that it is very suitable for

However, with the conventional curable resin materials as described above, it is very difficult to obtain a colored cured product by incorporating a coloring agent. This is because if the curable resin material is colored black or a dark color, when it is irradiated with light and cured, it will be difficult for light to pass through to the inside, increasing the possibility that uncured parts will form inside. Under these circumstances, conventional curable resin materials can be barely colored in colors other than black, but their internal hiding power is weak, so when coating electronic components such as ICs and hybrid ICs, internal circuits and There were many concerns that the elements etc. would be visible and the aesthetic appearance would be impaired.

[Purpose of the invention]

The object of the present invention is to provide a curable resin material from which a cured product with high internal hiding power can be obtained. [Disclosure of the Invention] In order to achieve the above object, the inventors have conducted repeated research. As a result, they discovered that by adding a temperature-curing curing agent and a coloring agent to a photocurable synthetic resin material, the surface could be cured by exposing it to light, and the interior could be cured by leaving it at room temperature. This invention was completed here.

The gist of the present invention is a curable resin material characterized by being formed by adding a room temperature curing agent and a coloring agent to a photocurable synthetic resin material. The present invention will be explained in detail below.

Here, examples of synthetic resin materials that can be cured by light such as ultraviolet rays (including ;・(methyl acrylate), methyl methacrylate (methyl meccrylate)
, methyl vinyl quinone, unsaturated polyester resin, etc. are used, and if necessary, a photocuring agent (sensitizer, photopolymerization initiator), diluent, etc. or synthetic resin material is used for purposes such as adjusting viscosity. may be added to. Even if G,
For evogisya acrylate, urethane acrylate-1, and melamine acrylate, benzyl dimethyl ketalone, benzoquinone, acetone phenone, etc. are used as photocuring agents, and ethylene glycol diacrylate, etc. are used as diluents. Ru. For unsaturated polyester resins, diphenyl disulfide or the like is used as a photocuring agent. For methyl methacrylate, benzoin or the like is used as a photocuring agent. Examples of room-temperature curing curing agents include organic peroxides and polyamides, but they need to be specifically determined depending on the type of synthetic resin material. For example, unsaturated polyester resins include hensyl peroxide, methyl ethyl ketone peroxide, bis(
1-hydroxycyclohexyl peroxide) and the like, and in the case of epoxy resin systems such as epoxy acrylate, polyamide and the like are used. Note that the room temperature curing agent may be used together with an accelerator. For example, when methyl ethyl ketone peroxide is used as a room temperature curing agent, cobalt naphthenate or the like is used as an accelerator, and in the case of hensyl peroxide, a tertiary amine or the like is used as an accelerator.

As mentioned above, in the curable resin material according to the present invention, a room temperature curing curing agent is added to the synthetic resin material that hardens with light, so the surface portion is hardened by light irradiation, and the inside is left at room temperature. This can make it harder. Therefore, even if a black or dark-colored cured product is obtained by adding a colorant, there is little risk that the interior will remain uncured. Therefore, the curable resin material according to the present invention has a high internal hiding power and can easily produce a cured product with an excellent appearance, so it is preferable to use the curable resin material for circuit boards such as ICs and hybrid ICs whose internal parts are not visible. It is suitable for use as a sealant for non-seats and for decorative items. Furthermore, if this curable resin material is used, circuit boards can be color-coded and sealed for each type, so that the type of circuit board can be easily identified by color.

As a coloring agent, use Hengara pigment. A chrome yellow pigment or the like is used, and the type is not particularly limited.

Note that additives other than those listed above may be added for the purpose of improving the performance of the resulting cured product.

Next, examples will be described.

The raw materials shown in Table 1 were blended in the proportions shown in the same table to produce the curable resin material of Example 1.2.

However, epoxy acrylate is a photocurable synthetic resin material, ethylene glycol diacrylate is a polymerizable diluent, benzyl dimethyl ketal is a photocuring agent, 6% cobalt naphthenate is an accelerator, and peroxide (manufactured by Kayaku Nouri Co., Ltd., 328E) is a room temperature curing agent. Red red pigment and chrome yellow pigment were used as colorants, respectively.

(Margins below) Table 1 The curable resin material (facial shape) of Example 1.2 was applied to a hybrid IC board with a thickness of 1 mm, and a power of 80 W/
The surface was cured by irradiating ultraviolet rays at cm, and the inside was left at room temperature to cure. In both Examples 1 and 2, the surface was cured in 10 seconds, and the inside was cured in 4 hours. No matter which one was used, it was possible to completely hide the circuitry on the board surface.

〔Effect of the invention〕

Since the curable resin material according to the present invention is made by adding a room temperature curing curing agent and a colorant to a photocurable synthetic resin material, a cured product with high internal hiding power can be easily obtained.

Agent: Patent Attorney Takehiko Matsumoto

Claims (1)

[Claims] (1) A curable resin material characterized by being made by adding a room temperature curable curing agent and a coloring agent to a photocurable synthetic resin material.