JPS59177988A - Mounting and adjusting mechanism of semiconductor laser - Google Patents

Abstract

PURPOSE:To enable to adjust the position and angle of a semiconductor laser by simple mechanisms by constituting a position adjusting mechanism and an angle adjusting mechanism by a leaf spring for adjusting positions, a leaf spring for adjusting angles and an adjust screw. CONSTITUTION:A position adjusting mechanism 18 consisting of a leaf spring 15 for adjusting positions and adjust screws 16, 17 is interposed between a susceptor 11 and an intermediate base 12. The adjust screw 16 is inserted to the leaf spring 15 and screwed to the intermediate base 12 between a first bent section 15a and a second bent section 15b, and the adjust screw 17 is inserted to the interlocking projection 12b of the intermediate base 12 and screwed to the leg 11b of the susceptor 11. An angle adjusting mechanism 24 consisting of a leaf spring 21 for adjusting angles and adjust screws 22, 23 is interposed between the intermediate base 12 and a laser holder 13. Both the adjust screw 22 and the adjust screw 23 are screwed to the intermediate base 12, the nose of the adjust screw 22 is in contact with the back of the laser holder 13 in the side section of a semiconductor laser 14, and the nose of the adjust screw 23 is in contact with the back of the vertical section 21a of the leaf spring 21 for adjusting angles in the lower section of the semiconductor laser 14.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor laser mounting adjustment mechanism that allows adjustment of the position and optical axis direction of a semiconductor laser.

When attaching a semiconductor laser to a device, it is naturally required that the laser light emitted from the semiconductor laser accurately reach a target point. To achieve this, it is necessary to be able to adjust the mounting position and angle of the semiconductor laser, but in conventional equipment, this is done using a precise position adjustment mechanism, so the mounting position of the semiconductor laser and the target point are far apart. In such cases, extremely high mechanical precision is required, resulting in high costs, and even if the precision is improved, it is difficult to make the laser beam reach the target point accurately.

The present invention was made for the purpose of making it possible to adjust the position and angle of a semiconductor laser using a simple mechanism, and includes a support base fixed to an apparatus, an intermediate base, and a semiconductor laser, each of which is made of separate members. A laser holder to be supported is prepared, the support stand and the intermediate stand are connected by a position adjustment mechanism having a position adjustment plate spring and its adjustment screw, and the intermediate stand and the laser holder are connected by an angle adjustment plate spring and its adjustment screw. It is characterized by being connected by an angle adjustment mechanism having. The position adjustment mechanism and the angle adjustment mechanism may be provided between the intermediate stand and the laser holder and between the support stand and the intermediate stand, respectively.

The invention will now be described with reference to the illustrated embodiments. In FIGS. 1 to 3, 11 is a support stand fixed to the device;
2 is an intermediate stand, 13 is a laser holder, and support stand 11
is the leg 11a, llb on both sides and the base 11 that connects this leg.
c, forming a substantially U-shape, and the intermediate stand 12 is connected to this leg 11a.
It has a groove 12a into which the and llc are fitted, and is configured to be movable within the plane of the support base 11. Assuming that the xy plane is a plane on which the intermediate stand 12 can move, the optical axis of the semiconductor laser 4 supported by the laser holder 13 is directed in the Z-axis direction, which is perpendicular to the xy-axis.

A leaf spring 15 for position adjustment is provided between the support stand 11 and the intermediate stand 12.
A position adjustment mechanism 18 consisting of two adjustment screws 16 and 17 is interposed. The position adjustment leaf spring 15 has a first bent portion 15a that is approximately at right angles and a second bent portion 15b that is bent at an angle of 90° or more, and the end on the first bent portion 15a side is located at the side of the supporting base 11 shown in FIG. A part of the leg 11a is fixed to a side surface with a fixing screw 19, and the end on the second bent portion 15b side is fixed to the -L surface of the intermediate stand 12 with a fixing screw 20. The adjusting screw 16 is inserted into the position adjusting plate spring 15 between the first bent part 15a and the second bent part 15b and is screwed into the intermediate stand 12, and the adjusting screw 17 is screwed into the intermediate stand 12. Protrusion 12b
The leg flb of the support base 11 is screwed into the leg flb of the support base 11.

On the other hand, an angle adjustment mechanism 24 consisting of an angle adjustment plate spring 21 and two adjustment screws 22 and 23 is interposed between the intermediate stand 12 and the laser holder 13. As is particularly clear in FIG. 4, the angle adjusting leaf spring 21 has a vertical portion 21a.
The first bent part 21b has a first bent part 21b formed by bending one end of the vertical part 21a horizontally, and a second bent part 21C formed by bending one side part of the vertical part 21a into a substantially U-shape. ”-The intermediate stand 12 is fixed together with the position adjusting leaf spring 15 by the fixing screw 20.
is fixed on the top surface. Further, the laser holder 13 is attached to the folded end of the second bent portion 21c by a fixing screw 25.
is fixed. The adjusting screw 22 and the adjusting screw 23 are both screwed onto the intermediate base 12, and the tip of the adjusting screw 22 contacts the back surface of the laser holder 13 on the side of the semiconductor laser 14, and the tip of the adjusting screw 23 contacts the back surface of the laser holder 13 on the side of the semiconductor laser 14. Laser 1
Vertical portion 21a of angle adjusting plate spring 21 at the bottom of 4
It is in contact with the back side.

In the wooden mounting structure of the above structure, the position of the semiconductor laser 14 in the x and y force directions can be adjusted using the adjustment screws 16 and 17 of the position adjustment mechanism 18, and the orientation in two directions can be adjusted using the adjustment screws 22 of the angle adjustment mechanism 24. This can be done by .23. That is, when the amount of screwing of the adjusting screw 16 into the intermediate stand 12 is changed, the second bent portion 1 of the position adjusting plate spring 15 is changed.
The angle of 5b changes, and the semiconductor laser 14 moves as indicated by arrow P in FIG. Also, the leg support base 1 of the adjustment screw 23
When the amount of screw engagement with 1b is changed, the angle of the first bent portion 15a changes, and the semiconductor laser 14 moves as indicated by the arrow Q. Therefore, the position of the semiconductor laser 14 can be freely adjusted in the xy plane.

On the other hand, when the adjusting screw 22 of the angle adjusting mechanism 24 is rotated, the amount by which the side portion of the laser holder 13 is pushed changes, so that the semiconductor laser 14 rotates in the direction of arrow S (horizontal direction) in FIG. 2. Further, when the adjusting screw 23 is rotated, the amount by which the lower part of the laser holder 13 is pushed changes similarly, so that the semiconductor laser 14 rotates in the direction of arrow R (vertical direction) in FIG. 3. Therefore, the direction of the optical axis of the semiconductor laser 14 can be freely adjusted. Therefore, the four adjustment screws 1
6.17.22.23 allows the position and orientation of the semiconductor laser 14 to be adjusted freely and easily.

As mentioned above, the position adjustment mechanism 18 is provided between the intermediate stand 12 and the laser holder 13, and the angle adjustment mechanism 24 is provided between the support stand 1
Even if it is provided between the intermediate stand 1 and the intermediate stand 12, the same effect as described above can be obtained.

As described above, according to the present invention, the position adjustment mechanism and the angle adjustment mechanism are constituted by the position adjustment leaf spring, the angle adjustment leaf spring, and their adjustment screws. The position and direction of the semiconductor laser can be adjusted freely. In particular, even if there is some variation in the machining accuracy of component parts, it is possible to irradiate the laser beam accurately to the target position, which, combined with the small number of parts, makes it possible to adjust the mounting of the semiconductor laser at low cost. mechanism can be provided.

[Brief explanation of the drawing]

The figures show an embodiment of the semiconductor laser mounting adjustment mechanism of the present invention, in which Fig. 1 is a front view, Fig. 2 is a plan view, Fig. 3 is a sectional view taken along the line ■-■ in Fig. 1, FIG. 4 is a perspective view of the main part showing the shape of the angle adjusting leaf spring. DESCRIPTION OF SYMBOLS 11... Support stand, 12... Intermediate stand, 13... Laser holder, 14... Semiconductor laser, 15... Leaf spring for position adjustment, 16. 17... Adjustment screw, 18...・Position adjustment mechanism, 21... Angle adjustment leaf spring, 22.23
...adjustment screw, 24...angle adjustment mechanism. Patent applicant: Asahi Optical Industry Co., Ltd. Agent: Kunio Miura

Claims (1)

[Claims] (1) a support base fixed to the device; an intermediate base; a laser holder that holds a semiconductor laser; the support base and the intermediate base;
or a position adjustment mechanism interposed between the intermediate stand and the laser holder; and an angle adjustment mechanism interposed between the intermediate stand and the laser holder, or the support stand and the intermediate stand; The angle adjustment mechanism has a position adjusting leaf spring and its adjustment screw that connect the two members so that the relative vertical and horizontal positions of the two members can be adjusted, and the angle adjustment mechanism connects the two members so that the direction of the optical axis of the semiconductor laser can be adjusted. 1. A mounting adjustment mechanism for a semiconductor laser, comprising an angle adjustment leaf spring connecting the two, and an adjustment screw thereof.