JPS59177154A - Plasma spraying apparatus - Google Patents

Plasma spraying apparatus

Info

Publication number
JPS59177154A
JPS59177154A JP5145783A JP5145783A JPS59177154A JP S59177154 A JPS59177154 A JP S59177154A JP 5145783 A JP5145783 A JP 5145783A JP 5145783 A JP5145783 A JP 5145783A JP S59177154 A JPS59177154 A JP S59177154A
Authority
JP
Japan
Prior art keywords
plasma spraying
thermal spraying
flowline
flow path
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5145783A
Other languages
Japanese (ja)
Inventor
Takao Suzuki
隆夫 鈴木
Hiromitsu Takeda
博光 竹田
Kazumi Shimotori
霜鳥 一三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP5145783A priority Critical patent/JPS59177154A/en
Publication of JPS59177154A publication Critical patent/JPS59177154A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1404Arrangements for supplying particulate material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1404Arrangements for supplying particulate material
    • B05B7/1468Arrangements for supplying particulate material the means for supplying particulate material comprising a recirculation loop

Landscapes

  • Nozzles (AREA)

Abstract

PURPOSE:To suppress the wastefulness of a plasma spraying material by enabling plasma spraying to various small complicated functional parts, by additionally providing a flowline change-over mechanism to a powdery plasma spraying material flowline. CONSTITUTION:A plasma spray apparatus is constituted of a powdery plasma spraying material supply apparatus 1, a plasma spraying gun 2 and powdery plasma spraying material flowlines 31, 32, 33 connecting both of them and a flowline change-over mechanism 4 is additionally provided to the position directly before the plasma spraying gun 2 of the flowline. The flowline change- over mechanism 4 is equipped with a powdery plasma spraying material inflow port A, an outflow ports B, C and the outflow port C is connected to the powdery plasma spraying material supply port D of the plasma spraying gun 2 through a flowline 32 while the outflow port B is connected to the supply apparatus 1 through the recirculation flowline 33. In this case, the inflow port A, the outflow port B and the outflow port C are constituted so as to connect or block the circuit connecting respective ports A, B, C by the indicating order from the outside.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は溶射装置に関し、更に詳しくは、溶射ガンへの
溶射材粉末の供給を短時間で微調整することが可能で、
かつ、溶射材粉末の浪費を抑制し得て経済性に優れる溶
射装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a thermal spraying apparatus, and more particularly, the present invention relates to a thermal spraying apparatus, and more particularly, to a thermal spraying apparatus that allows fine adjustment of the supply of thermal spray material powder to a thermal spray gun in a short time,
The present invention also relates to a thermal spraying apparatus that can suppress wastage of thermal spraying material powder and is highly economical.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

溶射法は、溶融若しくは半溶融状態の金属。 Thermal spraying uses molten or semi-molten metal.

合金、セラミックス、有機合成材料などの微細粒を被溶
射材の表面に吹きつけ、これを積層して皮膜−とする表
面処理法の1つであって、その適用分野は広い。
It is one of the surface treatment methods in which fine particles of alloys, ceramics, organic synthetic materials, etc. are sprayed onto the surface of the material to be thermally sprayed, and the particles are laminated to form a film, and its application fields are wide.

溶射方式には種々の方法が知られているが、最近、溶射
材料として粉末を用いる方式(粉末溶射法)や溶射炎と
してプラズマジェットを用いる方式などが導入されて以
来、溶射材料と被溶射材の適用範囲が飛躍的に拡大して
いる。
Various methods are known for thermal spraying, but since the recent introduction of methods that use powder as the thermal spraying material (powder thermal spraying method) and methods that use plasma jet as the thermal spraying flame, there have been changes in the thermal spraying material and the material to be thermally sprayed. The scope of application is expanding dramatically.

その結果、従来は溶射法が不適と考えられていた各種の
機能部品(例えば、コンデンサー。
As a result, various functional parts (for example, capacitors) that were previously considered unsuitable for thermal spraying.

記録ヘッド、義歯)への溶射もできるようになった。It is now possible to thermal spray onto recording heads and dentures).

しかしながら、この場合、工業的にはつぎのような問題
が生じている。すなわち、粉末溶射法に用いる溶射装置
の構成に伴う問題である。
However, in this case, the following problems have arisen industrially. That is, this is a problem associated with the configuration of the thermal spraying apparatus used in the powder thermal spraying method.

一般にこの種の溶射装置は、溶射材粉末を所定流量で供
給用ガスにのせて供給する溶射材粉末供給装置と、溶射
ガンと、この両者を結ぶ溶射材粉末流路とから構成され
ている。該流路は通常2m程度のホースである。したが
って、供給装置を操作して溶射材粉末の供給量の調整処
置を施しても、その結果が溶射ガンに現出するまでには
流路長に照応するタイムラグが発生せざるを得ない。更
には、流路長が大きい場合、断続する溶射時に流路内へ
溶射材粉末が不規則に残留する傾向は増大し、全体の溶
射材粉末供給の円滑な進行が阻害される。
Generally, this type of thermal spraying apparatus is comprised of a thermal spraying material powder supply device that supplies thermal spraying material powder at a predetermined flow rate on a supply gas, a thermal spraying gun, and a thermal spraying material powder flow path that connects the two. The flow path is usually a hose with a length of about 2 m. Therefore, even if the supply amount of the thermal spray material powder is adjusted by operating the supply device, a time lag corresponding to the flow path length inevitably occurs before the result appears in the thermal spray gun. Furthermore, if the flow path length is large, there is an increased tendency for the thermal spray material powder to remain irregularly in the flow path during intermittent thermal spraying, and the smooth progress of the overall thermal spray material powder supply is inhibited.

さて、機能部品は一般にその形状が小型かつ複雑なもの
が多い。したがって、機能部品への溶射材料は少量で済
む場合もある反面、一方では、それが高価な材料である
ということが多い。
Generally speaking, functional parts are often small and complex in shape. Therefore, while it may be possible to use a small amount of thermal spray material for functional parts, on the other hand, it is often an expensive material.

そのため、高価な溶射材料を小さく複雑な領域に溶射す
るということは、上記した構成の溶射装置では非常に歩
留りが悪くなり溶射材料の浪費を招き経済性を低下させ
るものとなる。
Therefore, when an expensive thermal spraying material is sprayed onto a small and complicated area, the yield of the thermal spraying apparatus having the above-mentioned configuration is extremely poor, the thermal spraying material is wasted, and economic efficiency is reduced.

そのため、当業界にあっては、短時間でもタイムラグを
生ずることなく溶射材粉末の供給量を溶射ガンでの応答
性よ(微調整できる溶射装置の開発が望まれていた。
Therefore, there has been a desire in the industry to develop a thermal spraying device that can finely adjust the response of a thermal spray gun to the supply amount of thermal spray material powder without causing a time lag even for a short period of time.

〔発明の目的〕[Purpose of the invention]

本発明は、極めて簡単な機構を流路系に付設することに
より、上記した問題点を解消し得る粉末式溶射装置の提
供を目的とする。
An object of the present invention is to provide a powder type thermal spraying apparatus that can solve the above-mentioned problems by attaching an extremely simple mechanism to a flow path system.

〔発明の概要〕[Summary of the invention]

本発明者らは、機能部品への溶射法の適用を効率化する
ためには、必要なときに必要な量だけ溶射利粉末が溶射
ガンに供給されればよいということに着目した。その上
で、■溶射材粉末の溶射ガンへの供給調整を溶射ガンの
溶射材粉末供給口の直前で行なうことにより、上記した
流路長の大きさの影響を解消し得ること、■溶射ガンへ
の溶射材粉末供給の有無若しくは断続は、流路への溶射
材粉末流入の有無若しくは断続としてではなく、流路の
切換によって可能となり得ること、という2点を着想す
るに到り本発明装置を完成した。
The present inventors have focused on the fact that in order to efficiently apply the thermal spraying method to functional parts, it is sufficient to supply thermal spray powder to the thermal spray gun in the required amount at the required time. On top of that, ■ By adjusting the supply of thermal spray material powder to the thermal spray gun immediately before the thermal spray material powder supply port of the thermal spray gun, the effect of the above-mentioned flow path length can be eliminated; ■ The thermal spray gun We came up with the following two points: the presence or absence or interruption of the supply of thermal spray material powder to the flow path can be made possible by switching the flow path, rather than the presence or absence or interruption of the flow of thermal spray material powder into the flow path. completed.

すなわち、本発明装置は溶射材粉末装置と溶射ガンと両
者を結ぷ溶射材粉末流路とから成る溶射装置において、
該流路の該溶射ガン直前位置に流路切換機構を介在させ
たことを特徴とする。
That is, the apparatus of the present invention is a thermal spraying apparatus consisting of a thermal spraying material powder device, a thermal spraying gun, and a thermal spraying material powder flow path connecting the two.
The present invention is characterized in that a flow path switching mechanism is interposed in the flow path at a position immediately before the thermal spray gun.

本発明装置を例示した概念的模式図に基づき説明する。The device of the present invention will be explained based on a conceptual diagram illustrating the device.

図で1は溶射材粉末供給装置、2は溶射ガンである。3
が溶射材粉末流路で、4は本発明にがかる流路切換機構
である。流路切換機構4としては、通常、図示したよう
な三方バルブでしかも流路方向を外部からの作動指令信
号で変更できるものであることが好ましい。溶射ガン2
に供給された溶射材粉末は被溶射材5の表面に溶射され
る。
In the figure, 1 is a thermal spray material powder supply device, and 2 is a thermal spray gun. 3
4 is a thermal spray material powder flow path, and 4 is a flow path switching mechanism according to the present invention. It is generally preferable that the flow path switching mechanism 4 is a three-way valve as shown in the figure, and the direction of the flow path can be changed by an external operation command signal. Thermal spray gun 2
The thermal spraying material powder supplied to is thermally sprayed onto the surface of the material to be thermally sprayed 5.

図の本発明装置において、流路切換機構4は溶射材粉末
流入口A、流出口B及び流出口Cを備えていて、流出口
Cは流路3□を介して溶射ガン2の溶射材粉末供給口り
に接続し、流出口Bは循環流路33を介して供給装置1
に接続している。流入ロA、流出口B及び流出口Cはそ
れぞれを結ぶ回路が外部からの指令信号によって連結又
は遮断されるようになっている。
In the apparatus of the present invention shown in the figure, the flow path switching mechanism 4 is equipped with a thermal spray material powder inlet A, an outlet B, and an outlet C. The outflow port B is connected to the supply device 1 through the circulation channel 33.
is connected to. The circuits connecting the inlet A, the outlet B, and the outlet C are connected or disconnected by an external command signal.

例えば、流入口Aと流出口Bを連結し流入口Aと流出口
Cとの回路を遮断すれば、供給装置1から流路3、を通
って供給されてきた′溶射材粉末は溶射カン2に供給さ
れることなく流出口Bから流路33を通って供給装置1
に還流する。そして、溶射すべきとき流入口Aと流出口
Cを連結し流入ロムと流出口Bとの回路を所定時間遮断
すれば、所定量の溶射材粉末は流路3□から溶射ガン2
に流入して被溶射材5の表面に溶射される。この場合、
切換機構4は溶射ガン2の直前若しくは極めて近接した
位置に付設されているので、切換機構と溶射ガン20間
の流路32の長さは極めて短いため、切換機構4の操作
による溶射材粉末の供給量の有無若しくは断続は大きな
タイムラグを生ずることなくただちに溶射ガン2に現出
することになる。
For example, if the inlet A and the outlet B are connected and the circuit between the inlet A and the outlet C is cut off, the thermal spray material powder supplied from the supply device 1 through the flow path 3 will be transferred to the spray can 2. from the outlet B through the flow path 33 without being supplied to the supply device 1.
Reflux to. Then, when thermal spraying is to be performed, if the inlet A and outlet C are connected and the circuit between the inlet ROM and the outlet B is interrupted for a predetermined period of time, a predetermined amount of thermal spray material powder will be transferred from the flow path 3□ to the thermal spray gun 2.
and is sprayed onto the surface of the material 5 to be thermally sprayed. in this case,
Since the switching mechanism 4 is attached to a position directly in front of or very close to the thermal spray gun 2, the length of the flow path 32 between the switching mechanism and the thermal spray gun 20 is extremely short, so that the thermal spray material powder cannot be removed by operating the switching mechanism 4. The presence or absence or interruption of the supply amount will immediately appear in the thermal spray gun 2 without a large time lag.

切換機構4の動作を予めプログラム化しておけば、自動
溶射も可能とすることができる。
If the operation of the switching mechanism 4 is programmed in advance, automatic thermal spraying can also be made possible.

〔発明の実施例〕[Embodiments of the invention]

実施例1 直径100 run?;4さ100闘の5US304製
の円柱表面に粒径1ツのアルミナ粉でサンドブラスト処
理を施した。これを所定の回転台にのせて33,3rp
mで回転させ、その表面(側面)に溶射距離125喘、
電流値700A 、電圧値34Vの条件でNi−Cr合
金をプラズマ溶射した。装置は、図に示したものでNi
−Cr合金粉末の供給パターンは、0.9秒供給−〇、
9秒遮断を反復するものであった。
Example 1 Diameter 100 run? ; The surface of a cylinder made of 5US304 with a 100mm diameter was sandblasted with alumina powder having a particle size of 1mm. Place this on the designated rotary table and turn it for 33.3rp.
Rotate at a speed of 125 m and spray the surface (side) at a distance of 125 mm.
The Ni-Cr alloy was plasma sprayed under conditions of a current value of 700 A and a voltage value of 34 V. The equipment shown in the figure is Ni
-Feeding pattern of Cr alloy powder is 0.9 second supply -〇,
The 9-second interruption was repeated.

その結果、円柱側面の半分のみにNi(:r溶射層(厚
み200μm)が形成され残り半分には溶射層は形成さ
れず5US304のままであった。
As a result, a Ni(:r sprayed layer (thickness: 200 μm) was formed only on half of the side surface of the cylinder, and no sprayed layer was formed on the remaining half, which remained 5US304.

比較のため、切換機構4を外した従来装置を用いて、供
給装置1を操作することにより円柱側面の半分のみに同
一厚みの溶射層の形成を試みた。
For comparison, an attempt was made to form a sprayed layer of the same thickness on only half of the cylindrical side surface by operating the supply device 1 using a conventional device with the switching mechanism 4 removed.

消費したNi−Cr粉末の量の比は1:2であり、本発
明装置では約50チ材料節約が可能であった。
The ratio of the amount of Ni--Cr powder consumed was 1:2, and the device of the invention could save about 50 tons of material.

実施例2 縦100■横50關厚み3mmのアルミ片の全面に粒径
1鮎のアルミナ粉でサンドブラスト処理を飾した。この
試片を溶射台位置にセヅトし、横手方向に300ルーの
速度で300闘の距離を1往復させその後垂直方向に5
胴移動させるという運動を反復させながら、本発明装置
を用いて0.65秒間隔で0.35秒間のアルミナ粉末
のプラズマ溶射を行なった。溶射争件は、溶射距離95
祁、電流値900 A p電圧値36Vであった。
Example 2 The entire surface of an aluminum piece measuring 100 x 50 x 3 mm thick was sandblasted with alumina powder having a grain size of 1. This specimen was placed on the thermal spraying table position, and it was made to reciprocate once in the transverse direction at a speed of 300 roux over a distance of 300 mm, and then vertically for 5
Plasma spraying of alumina powder was performed for 0.35 seconds at 0.65 second intervals using the apparatus of the present invention while repeating the movement of moving the cylinder. The thermal spraying dispute concerns the thermal spraying distance of 95
The current value was 900 A and the p voltage value was 36 V.

比較のため、切換装置を外した従来装置で同様のプラズ
マ溶射を行なった。同一厚みのアルミナ溶射層形成に到
るまでの消費アルミナ粉末量の比は35 : 100で
あり、本発明装置の場合には約65係節約することが可
能であった。
For comparison, similar plasma spraying was performed using a conventional device with the switching device removed. The ratio of the amount of alumina powder consumed to form a sprayed alumina layer of the same thickness was 35:100, and in the case of the apparatus of the present invention, it was possible to save about 65 parts.

〔発明の効果〕〔Effect of the invention〕

以上の説明で明らかなように、本発明装置は極めて簡単
な機構の付設により、溶射ガンへの溶射材粉末供給がタ
イムラグを生ずることなく良好な応答性をもって微調整
できるので、形状小型・複雑な各種機能部品への溶射も
可能であり、しかも溶射材料の浪費も抑制されて経済性
に優れているため、その工業的価値は大である0
As is clear from the above explanation, the device of the present invention is equipped with an extremely simple mechanism and can finely adjust the supply of thermal spray material powder to the thermal spray gun with good responsiveness without causing a time lag. It can be thermally sprayed onto various functional parts, and it is highly economical as waste of thermal spraying material is suppressed, so its industrial value is great.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明装置の概念的模式図である。 1・・・溶射材粉末供給装置、2・・・溶射ガン、3、
.3..33・・・溶射材粉末流路、4・・・流路切換
機構、5・・・被溶射材。
The figure is a conceptual diagram of the device of the present invention. 1... Thermal spray material powder supply device, 2... Thermal spray gun, 3.
.. 3. .. 33... Thermal spray material powder flow path, 4... The flow path switching mechanism, 5... Thermal sprayed material.

Claims (1)

【特許請求の範囲】 1、 溶射材粉末供給装置と溶射ガンと両者を結ぷ溶射
材粉末流路とから成る溶射装置において、 該流路の該溶射ガン直前位置に流路切換機構を介在させ
たことを特徴とする溶射装置。 2、 該流路切換機構が、作動指令信号によって作動す
る三方パルプである特許請求の範囲第1項記載の溶射装
置。
[Scope of Claims] 1. In a thermal spraying device comprising a thermal spraying material powder supply device, a thermal spraying gun, and a thermal spraying material powder flow path connecting the two, a flow path switching mechanism is interposed in the flow path in front of the thermal spraying gun. A thermal spraying device characterized by: 2. The thermal spraying apparatus according to claim 1, wherein the flow path switching mechanism is a three-way pulp operated by an operation command signal.
JP5145783A 1983-03-29 1983-03-29 Plasma spraying apparatus Pending JPS59177154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5145783A JPS59177154A (en) 1983-03-29 1983-03-29 Plasma spraying apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5145783A JPS59177154A (en) 1983-03-29 1983-03-29 Plasma spraying apparatus

Publications (1)

Publication Number Publication Date
JPS59177154A true JPS59177154A (en) 1984-10-06

Family

ID=12887461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5145783A Pending JPS59177154A (en) 1983-03-29 1983-03-29 Plasma spraying apparatus

Country Status (1)

Country Link
JP (1) JPS59177154A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2845652A3 (en) * 2013-09-04 2015-05-27 Nordson Corporation Hot melt adhesive supply having agitation device, and related methods
US9499355B2 (en) 2012-10-26 2016-11-22 Nordson Corporation Pedestal for supporting an adhesive melter and related systems and methods

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9499355B2 (en) 2012-10-26 2016-11-22 Nordson Corporation Pedestal for supporting an adhesive melter and related systems and methods
US10202246B2 (en) 2012-10-26 2019-02-12 Nordson Corporation Pedestal for supporting an adhesive melter and related systems and methods
EP2845652A3 (en) * 2013-09-04 2015-05-27 Nordson Corporation Hot melt adhesive supply having agitation device, and related methods
US9580257B2 (en) 2013-09-04 2017-02-28 Nordson Corporation Hot melt adhesive supply having agitation device, and related methods

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