JPS59175199A - Lower mold mechanism for electronic part inserting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a lower die mechanism for an electronic component inserter, that is, a lower die mechanism used in an electronic component inserter that inserts lead wires of electronic components into lead wire holes of a printed circuit board. This relates to the structure of the lower die mechanism that performs caulking and insertion detection.

Conventionally, as this type of lower die mechanism, the one shown in FIGS. 1 and 2 is known. In the figure, 1 is a cylinder body, 1a is a boat that receives the supply of compressed air, 2 is a piston built into the cylinder body 1, and 3 is a piston return spring that lowers the piston 2 when the supply of compressed air is stopped. , 4.5 is an arm, 6.7 is a shaft pivotally connected to these arms 4 and 5, and nine rollers, 8Fi is a shaft that serves as a fulcrum for the rotation of these arms 4.5, and is fixed to the cylinder body 1. has been done. 9 and 10 are the above 7-me 4
, 5 return springs, 11 a claw fixed to the arm 4, 1
2 is a die fixed to the cylinder body 1, and 13 is a continuity detector.

In the lower mold mechanism configured as described above, by supplying compressed air to the bow of the cylinder body 1, the piston 2 is pushed up against the spring 6, and the arm 4.5 is pushed up against the spring 6.
The rollers 6 and 7 supported by the piston 2 rotate along the tapered end of the piston 2, the arms 4 and 5 rotate around the shaft 8, and the claw 11 fixed to the arm 4 moves in the direction of the die 12. do.

The lead wire 15a of the electronic component 15 inserted into the printed circuit board 14 by the movement of the claw 11 is cut by the claw 11 and the die 12. At the same time as this cutting, the lead wire 15m is detected by the continuity detector 16, and the lead wire 15m is detected by the continuity detector 16.
is bent toward the printed circuit board 14 by the claws 11.

Since the conventional lower mold mechanism for an electronic component insertion machine is configured as described above, the lead wire must be detected when the lead wire is cut, and therefore the lead wire length cannot be adjusted to take into account the cutting allowance. is necessary.

Furthermore, in order to cut one pair of lead wires, two sets of claws, dies, and continuity detectors are required, which has the disadvantage of complicating the structure. Furthermore, since the lead wires are bent to secure electronic components to the printed circuit board, there is a risk of pattern short circuits, which limits the design of the printed circuit board and makes high-density mounting assembly difficult. There were drawbacks such as:

This invention eliminates the above-mentioned conventional drawbacks and deforms the lead wire by crushing the part near the printed circuit board that passes through the printed circuit board, thereby making the longest section of the lead wire υ larger than the lead wire insertion opening diameter. Therefore, electronic components can be fixed to a printed circuit board, and automatic assembly of high-density packaging can be facilitated.

An embodiment of the present invention will be described below with reference to the drawings. Third
In FIGS. 1 to 5, the same reference numerals as in FIGS. 1 and 2 indicate the same elements, so detailed explanation will be omitted. code 1
6 is a spring, which serves as a fulcrum for arm rotation of 4°50 and roller 6.
．． 7, and each roller 6.7
This is for arm 4.5 return. 17.18
are outer cutters, which are fixed to the ends of the arms 4, 5 opposite to the rollers 6.7, respectively. Reference numeral 19 denotes an inner cutter fixed to the cylinder body 1, and is located at a position forming a cutting direction with the outer cutter 17 and 18. 2 [ ], 21 are deformation adjustment screws, which are attached to the outer cutter 17 and 18, and are attached to the inner cutter 1.
This is to adjust the gap between 9 and 9.

Further, the continuity detector 16 is wired to the outer blade 17, 18.

In the lower mold mechanism configured as described above, by supplying compressed air to the port 1a, the piston 2
is pushed up and rollers 6.7 supported by arms 4 and 5
is rotated and opened outward following the tapered tip of the piston 2. Therefore, the arms 4 and 5 are rotated around the shaft 8, and the outer cutters 17 and 18 fixed to the arms 4.5 each approach the inner cutter 19, and the lead wire 15m of the electronic component 15 is moved closer to the inner cutter 19.
After cutting it, I approached it further and crushed the 15m lead wire.
Transform this. FIG. 5 shows this deformed lead wire 15a (the deformed portion is indicated by 15b), and the longest section of the lead wire is larger than the lead wire insertion opening of the printed circuit board 14. When the outer cutter 17.18 approaches until the lead wire 15m is deformed in this way, the deformation adjustment screw 20.21 attached to the arm 4.5 causes the arm 4.
5 is stopped. At the same time, the outer blade 17.18
The lead wire 15 & is detected by the conduction detector 16 connected to the wire, and the insertion state of the electronic component 15 is indicated. After that, by stopping the supply of compressed air,
Piston 2 descends, earth 4.5 rotates, and outer cutter 1
7.18 is separated from the inner blade 19, and the electronic component 15 is fixed to the printed circuit board 14.

In the above embodiment, one pair of outer cutters 17 is provided for the inner cutter 19.
．． 18 is provided so that the two lead wires 15a are simultaneously deformed by these outer cutters 17 and 18, but the present invention is not limited to this. A blade and an inner blade may be provided so that lead wires of electronic components having different lead wire intervals can be deformed by the same lower die mechanism. The movable mechanism of the outer cutter that deforms the twisted lead wire is also not limited to that of the embodiment, and various modifications are possible.

As described above, this invention allows the first blades such as the outer blades 17 and 18 and the second blades such as the inner blade 19 to move relatively, and the first blades and the second blades By sandwiching the lead wire 15m of the electronic component 15 on the printed circuit board 14, the side of the lead wire close to the printed circuit board 14 is crushed and deformed by the first blade and the second blade. And since the part outside the deformation was cut off, this lead wire 1
Due to the deformation of the diameter of 5a, the electronic component 15 is attached to the printed circuit board 14.
Since it is fixed to the electronic component 15 and the printed circuit board 14
Highly reliable, high-density mounting is possible with no damage to the parts and no pattern shorts during soldering assembly.

Further, at the time of deforming the lead wire 15a, the lead wire 15
Since the detection of a is performed, automation is possible even if the lead wire length of the electronic component 15 is shortened, compared to the conventional method in which the lead wire is detected at the time of cutting.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional lower die mechanism, FIG. 2 is an enlarged sectional view of the main part of the mechanism shown in FIG. The figure is an enlarged cross-sectional view of the main parts in Figure 6, and Figure 5 is modified 2: Piston, 4, 5: Arm, 16: Continuity detector, 14 Niblint board, 15
: Electronic component, 15a: Lead wire, 15b: Lead wire deformation part, 17° 18: Outer blade, 19: Inner blade. Agent Shin Kuzuno - Figure 4 Figure 5) φ

Claims (1)

[Claims] In a lower die mechanism of an electronic component insertion machine that inserts a lead wire of an electronic component into a lead wire insertion hole of a printed circuit board, a first blade and a second blade disposed at a position on the back surface of the printed circuit board;
and a means for relatively moving these blades, and by sandwiching the lead wire of the electronic component on the printed circuit board between the first blade and the second blade, the lead wire is close to the printed circuit board. The side is crushed and deformed by the first blade and the second blade, and the portion outside the deformation is cut off, and the lead wire between the first blade and the second blade is A lower die mechanism for an electronic component inserter, characterized in that insertion of a lead wire is confirmed by checking continuity through the lower die mechanism.