JPS59174549A - 金属とガラスの接合方法 - Google Patents

金属とガラスの接合方法

Info

Publication number
JPS59174549A
JPS59174549A JP58045600A JP4560083A JPS59174549A JP S59174549 A JPS59174549 A JP S59174549A JP 58045600 A JP58045600 A JP 58045600A JP 4560083 A JP4560083 A JP 4560083A JP S59174549 A JPS59174549 A JP S59174549A
Authority
JP
Japan
Prior art keywords
glass
metal
bonding
amorphous silicon
silicon film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58045600A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0250066B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Fumiya Furuno
古野　二三也
Akihiro Murata
明弘 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokogawa Electric Corp
Original Assignee
Yokogawa Hokushin Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Hokushin Electric Corp filed Critical Yokogawa Hokushin Electric Corp
Priority to JP58045600A priority Critical patent/JPS59174549A/ja
Publication of JPS59174549A publication Critical patent/JPS59174549A/ja
Publication of JPH0250066B2 publication Critical patent/JPH0250066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding

Landscapes

  • Laminated Bodies (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Measuring Fluid Pressure (AREA)
JP58045600A 1983-03-18 1983-03-18 金属とガラスの接合方法 Granted JPS59174549A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58045600A JPS59174549A (ja) 1983-03-18 1983-03-18 金属とガラスの接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58045600A JPS59174549A (ja) 1983-03-18 1983-03-18 金属とガラスの接合方法

Publications (2)

Publication Number Publication Date
JPS59174549A true JPS59174549A (ja) 1984-10-03
JPH0250066B2 JPH0250066B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-11-01

Family

ID=12723841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58045600A Granted JPS59174549A (ja) 1983-03-18 1983-03-18 金属とガラスの接合方法

Country Status (1)

Country Link
JP (1) JPS59174549A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5141148A (en) * 1990-07-20 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Method of anodic bonding a semiconductor wafer to an insulator
WO2003097552A1 (en) * 2002-04-30 2003-11-27 Agency For Science Technology And Research A method of wafer/substrate bonding
JP2006248895A (ja) * 2003-12-02 2006-09-21 Bondtech Inc 接合方法及びこの方法により作成されるデバイス並びに接合装置
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
CN110246769A (zh) * 2019-05-10 2019-09-17 太原理工大学 基于阳离子导电金属与玻璃表面原位金属化共晶键合方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5141148A (en) * 1990-07-20 1992-08-25 Mitsubishi Denki Kabushiki Kaisha Method of anodic bonding a semiconductor wafer to an insulator
WO2003097552A1 (en) * 2002-04-30 2003-11-27 Agency For Science Technology And Research A method of wafer/substrate bonding
US7192841B2 (en) 2002-04-30 2007-03-20 Agency For Science, Technology And Research Method of wafer/substrate bonding
JP2006248895A (ja) * 2003-12-02 2006-09-21 Bondtech Inc 接合方法及びこの方法により作成されるデバイス並びに接合装置
US7927975B2 (en) 2009-02-04 2011-04-19 Micron Technology, Inc. Semiconductor material manufacture
US8389385B2 (en) 2009-02-04 2013-03-05 Micron Technology, Inc. Semiconductor material manufacture
CN110246769A (zh) * 2019-05-10 2019-09-17 太原理工大学 基于阳离子导电金属与玻璃表面原位金属化共晶键合方法

Also Published As

Publication number Publication date
JPH0250066B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-11-01

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