JPS5917172A - Contact socket for inspection - Google Patents

Abstract

PURPOSE:To obtain a socket for inspection which allows the secure and easy inspection of a semiconductor device having numbers of external leads by providing even a cover-side socket board with a contact part for connecting with external leads of the semiconductor device. CONSTITUTION:Contact pins 4 for connecting with the external leads 2 of the semiconductor device 1 are provided to a socket board 3 on a main body side. Further, contact pins 9 in zigzag array relation with those pins 4 are provided to the cover-side socket board 7. Therefore, the device 1 is inserted in the board 3 and the board 7 is rotated around a shaft 6 and clamped with a lock lever 5 to connect the leads 2 to the pins 4 and 9, obtaining the socket for inspection which allows the secure and easy inspection of the semiconductor device having numbers of external leads.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a test contact socket in which a semiconductor device is set when testing the electrical characteristics of a semiconductor device having a large number of external leads.

Generally, when inspecting the electrical characteristics of a manufactured semiconductor device to determine whether it exhibits predetermined functions and characteristics, the semiconductor device is set in a test socket and measured and inspected.

When the number of external leads of the semiconductor device is small, the contact pins, which are the contact portions, can be arranged within the test socket with ample space. However, as the number of external leads of a semiconductor device increases and the pitch between the external leads becomes smaller, it becomes difficult to arrange contact pins that make electrical contact with the external leads on one plane in line with the external leads.

Furthermore, in addition to inserting a single semiconductor device with a large number of external leads into a test socket, there are cases where multiple semiconductor devices are assembled into a long frame and inserted into a test socket (multi-socket). be.

At this time, there is a problem that contact pins and screws corresponding to external leads of adjacent semiconductor devices come into contact with each other, and these contact pins cannot be arranged on one plane.

However, in conventional inspection contact sockets, the first
As shown in the figure, a large number of contact pins 4 are provided on the inner surface of the main body side (lower side) socket board 3 for contacting with a large number of external leads 2 of a semiconductor device 1 which is an object to be tested. On the side of the lid-side socket board 7, which is rotated in the direction of the arrow x and locked by the lock lever 5, with the rotation shaft 6 in the center so as to sandwich the semiconductor device 1 between the main body-side socket board 3. No contact pins are provided. Of course, no external contact pins such as the external contact pins 8 protruding outward from the main body socket board 3 are provided on the outside of the lid side socket board 7.

Therefore, with this conventional structure, when the number of external leads of a semiconductor device increases, it becomes impossible to obtain good contact as described above. The object of the present invention is to solve the problems of the prior art described above, and to provide an inspection contact that can reliably and easily inspect a cow conductor package having a large number of external leads. Its purpose is to provide sockets.

Hereinafter, the present invention will be explained in detail according to an embodiment shown in the drawings.

FIG. 2 is a perspective view showing an embodiment of the inspection contact socket according to the present invention. In this embodiment, parts corresponding to those of the conventional example in FIG. .

In the embodiment shown in FIG. 2, in addition to the contact portions or contact pins 4 on the inner surface of the main body side socket board 3 and the external contact pins 8 on the outer surface, a lid side socket board 7 combined with the main body side socket board 3 is provided. A contact pin 9 is provided on the inner surface, and an external contact pin 10 is provided on the outer surface.

M (The contact pins 9 of the llfl socket board 7 are arranged in a staggered manner with respect to the contact pins 4 of the main body side socket board 3.

Therefore, in this embodiment, the semiconductor device @1, which is the object to be inspected, is inserted into the main body side socket board 3, and the lid side socket board 7 is rotated about the rotation axis 6 in the direction of the arrow After the socket boards 3 and 7 are brought together by inserting the semiconductor device 1 between them, the lock lever 5 is
Lock both socket boards 3 and 7 with .

Thereby, the contact pins 4 and 9 of both socket boards 3 and 7 come into contact with each of the external leads 2 of the semiconductor device 1 with appropriate contact pressure. In particular, since the contact pins 4 of the main body side socket board 3 and the contact pins 9 of the lid side socket board 7 of this embodiment are arranged in a staggered relationship with each other, the number of external leads 2 of the semiconductor device 1 is large and Even if the pitch between the leads 2 is small, the contact pins 4 and 9 on each side can contact alternate (every other) external leads 2 in a corresponding manner, so that the pitch between the contact pins 4 or 9 is small. The distance between the external leads 2 can be sufficiently widened, and a semiconductor device having a larger number of external leads 2 can be tested reliably and easily in the same space.

Note that the present invention is not limited to the above embodiments,
The contact pins 4 on the main body side socket board 3 may be arranged in two rows on the left and right, and the contact pins 9 on the lid side socket board 7 may be arranged in two rows on the front and back.

Further, each contact pin may be arranged in a staggered manner within one row.

Furthermore, it goes without saying that contact sockets may be connected in series for multiple long frames.

Further, the contact pins in the contact socket can be concentrated in one direction on the socket boards on the main body side and the lid side.

As described above, according to the present invention, it is possible to reliably and easily test a semiconductor device having a larger number of external leads in the same space.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a conventional test contact socket, and FIG. 2 is a perspective view showing an embodiment of a test contact socket according to the present invention. 1. Semiconductor component part, 2... External lead, 3... Main body side socket board, 4゛° contact bin (contact part), 5... Lock lever 16... Rotation axis, 7...
Lid side socket board, 8... External contact bin which is an external contact part, 9... Contact bin which is a contact part, 10... External contact bin. Agent Patent Attorney Susuki 1) Toshiyuki “Kin・i) Figure 1

Claims (1)

[Claims] 1. In a contact socket used for testing the electrical characteristics of a semiconductor device having a large number of external leads,
1. A contact socket for testing, characterized in that contact portions that come into contact with external leads of a semi-transparent device are provided on both opposing surfaces of a main body side socket board and a lid side socket board. 2. The contact socket for inspection according to claim 1, wherein the contact portions are arranged in a staggered manner on the main body side socket board and the lid side socket board. 3. The contact socket for testing as set forth in claim 1 and claim 2, wherein a plurality of semiconductor devices having a large number of external leads can be inserted at the same time.