JPS59168809A - Brush apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a brush device, and more particularly to an improvement in a brush device for removing beams generated on semiconductor components.

[Technical background of the invention and its problems]

In the manufacture of semiconductor devices, semiconductor chips that have been internally connected are sealed with resin to remove them from the outside air. Generally, a molding process is used. by the way,
During this molding process, resin burrs b are inevitably generated at the bases of the mold parts a, as shown in FIG.

- Therefore, it is necessary to remove the resin burr b... Conventionally, this resin burr b... has been removed using a brush device, and the details are as follows.

That is, the brush body shown in FIGS. 2(a) and 2(b),
Alternatively, a structure in which brush bodies are provided in multiple stages as shown in FIGS. 3(a) and 3(b) has been used. In other words, Figure 2 (
, ) , (b) shows that a brush part l having an annular structure is formed from a nylon thread g containing abrasive grains and a brush alignment plate h to the outer peripheral surface of a brush support e made of a cylindrical member. The brush body is constructed by attaching the brush body to a caulking member, and in the case shown in FIGS. 3(a) and 3(b), the brush part r is composed of a nylon thread m and an annular fixture t, and is composed of a disc member. The brush body is constructed by surrounding the outer peripheral surface of the brush support j. Then, as shown in FIG. 4, these brush bodies are placed on the rotation axis n, and spacers are placed at the pitch distance X of the mold portion a of the semiconductor device. A brush structure is used in which the brushes are attached in multiple stages.

Then, the rotary shaft n is rotated at high speed by a rotary drive source (not shown), and in this state, each mold part a, a of the semiconductor device supported and guided by the support member p is held in contact with the 't'fl contact server e. Even the resin burrs b are removed by passing them through a brush made of nylon thread g or nylon thread m. Note that d is a locking nut for fixing the brush body C on the rotating shaft n.

By the way, when removing burrs with such a brush, it is necessary that the distance between the pitches of the brushes and the distance between the pins and the tips of the mold part a-- be constant, and that the pitch of the entire length of the brush corresponds accurately to the semiconductor device. is required.

However, in the structure in which the brush parts 1+r are attached using the cylindrical or disc-shaped brush supports e + f as described above, the overall width of each brush support e and the brush part 1+r inevitably varies depending on the number of layers in the brush supports e and ni. There is a variation of about ±0.2 cylinders. For this reason, if the brush body is adjusted to the pitch distance X of the mold part a..., it is difficult to keep the pitch distance X of the brush constant, and errors in the pitch of IX-xl are accumulated. There is a problem that it becomes impossible to remove the stains during the period. In other words, as the errors accumulate, the position of the brush deviates from the covering removal part where the resin bap... This causes inconvenience.

Therefore, in order to avoid such problems, it is recommended to prepare spacers 0 having various stacking thickness dimensions in advance, and adjust the pitch distance X while selecting the spacer 0 according to the overall width y of each brush. However, this would require a lot of adjustment time.

[Purpose of the invention]

This invention was made by Kimi Kamiguchi, focusing on 11i.
The purpose is to provide a brush device that can keep the distance between the pitches of the brushes constant over the entire school.

[Summary of the invention]

This invention provides a brush device in which brush bodies each having a brush part attached to the outer periphery of the brush support body are provided in multiple stages, in which the brush support body is brought into close contact with a 111 part in the width direction of one of the brush parts, and in the multi-stage brush body. A flange member 21 for determining the distance between the pitches of the provided brush bodies, and a flange member connected to the first flange member in close contact with the other widthwise side of the brush portion. By comprising a second Franz member that holds the brush part together with the brush member, the pitch distance between the brushes can be kept constant over the entire length by eliminating the accumulation of pitch distance errors to other brushes. Describe what you are trying to do.

[Embodiments of the invention]

The present invention will be explained below based on an embodiment shown in FIGS. 5 and 6. Reference numeral 1 in FIG. 5 is a rotating shaft that is rotationally driven at high speed by a rotational drive source (not shown). and,
On this rotating shaft l, brush bodies 2 are provided in multiple stages along the axial direction of the rotary shaft l, thereby configuring a brush device. Immediately below the rotating shaft 1, the semiconductor device 3 disposed at the lower stage is configured to pass along the width direction thereof. The brush body 2 of the brush device constructed in this way is shown in FIG. To explain the structure of this brush body 2, numeral 4 in the figure is a brush portion. This brush part 4 is formed into a ring shape by attaching a large number of long nylon threads 5 containing abrasive grains radially, and has disc-shaped brush alignment plates 6, 6 on both sides of the nylon thread group. and a brush support 7 to be described later. The width y of this brush portion 4 is determined by the width y of the covered removal portion 3 between the mold portions 3a of the semiconductor device 3.
It is set corresponding to 1 of b. On the other hand, the brush support 7 (d), which is the main part of the present invention, is composed of a first Franz member 7a and a second Franz member 7b.

The first flange member 7a is constructed using a high-precision machine: a cylindrical shaft attachment part 8 and a flange part 9 are attached to one end of the shaft attachment part 8 by machining. The overall length W is matched with the pitch distance X of the mo-not portions 3a of the semiconductor device 3 with high accuracy of approximately ±0.01 m. The brush portion 4 is fitted into the outer peripheral portion of the shaft mounting portion 8 of the first seven-run member 7a. Further, a groove 10 is carved on the outer peripheral portion of the tip of the shaft mounting portion 8 in a direction opposite to the rotational direction of the rotating shaft 1. On the other hand, the 7-run member 7b of I2 is composed of a disk 13 having a through hole 11 in the center and a female screw 12 corresponding to the male screw 10 and serving as a locking portion. The disc 13 is screwed into the male thread 10 of the shaft mounting part 8 into which the brush part 4 is inserted so that it can move forward and backward, and the brush part 4 can be inserted into the brush part 4 by its width at both end surfaces of each flange part 9 and the disc 13. It is clamped and fixed from both sides. Therefore, the first flange member 7a comes into close contact with one widthwise side portion of the brush portion 4, and the second flange member 7b comes into close contact with the other widthwise side portion to sandwich the brush portion 4. ing. Note that the disc 13 is designed to loosen in a direction opposite to the direction of rotation of the rotation axis l, and to loosen in a direction along the rotation direction. Further, it goes without saying that the thickness F of the seven-run part 9 constituting the first flange part 7a is set with high precision in accordance with the pitch distance X of the mold part 3a of the semiconductor device 3. .

A plurality of brush bodies 2 configured as described above are arranged along the axial direction of the rotating shaft 1 according to the distance between the pinches X, and are attached to the rotating shaft -1 through a locking nut 14° 14. .

When removing the resin beam (not shown) generated at the base of the mold part 3a of the semiconductor device 3 using the plan device configured in this way, the rotational drive source (
(not shown) rotates each brush body 4 at high speed through the rotating shaft 1, and in this state slides over each mold part 3a of the semiconductor device 3 supported and guided by the support member 15. The resin burrs are removed by moving the semiconductor device 3 along its width. Here, the connection of the plurality of brush bodies 4... is determined by the overall width W, that is, the distance between the pinches of the brush by the continuous threads of the first and second brushes a and 7b, so the brush width The variation in y is the difference between the first and second flange parts.

This is a problem only within zb, and it is now possible to eliminate variations in the width of individual brushes, and other brush bodies 4...
(The variation causes an effect, and the error does not accumulate. Therefore, it is easy to keep the pitch distance X of the multi-stage brushes within a certain value over the entire length of the brush device. When removing the beam, it is possible to accurately and reliably remove the resin at the base of the mold part 3a without damaging the mold part 3a. I can do it.

7. In the embodiment described above, the first flange member and the second flange member are connected and moved back and forth using screws.
Although the structure is designed to be adjustable, it goes without saying that other securing means may be used to adjust the forward and backward movement.

Furthermore, in the above embodiment, the semiconductor device is passed through the brush side, but it is also possible to completely fix the semiconductor device and move the brush side to remove deburrs. Of course.

〔Effect of the invention〕

As explained above, according to the present invention, by connecting the first flange part and the second 7-run member to each other for surface accuracy, it is possible to completely eliminate the accumulation of errors in other brushes. become able to.

Therefore, the distance between the pitches of the brushes can be maintained within a small error within a certain value over the entire length of the brush device, and the entire distance can be kept constant, allowing accurate burrs and burrs to be removed without damaging other parts. and can be removed reliably.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the state of chipping in a semiconductor device, FIGS. 2(a) and 3(b), and FIG. 3(a). (b) is a sectional view and side view showing a different conventional brush body, FIG. 4 is a front view showing a brush device constituted by the brush body, and FIGS. 5 and 6 are one embodiment of the present invention. FIG. 5 is a partially sectional front view of the brush device;
FIG. 6 is a front sectional view of the brush body. No...Rotating shaft, 2 - Brush body, 4... Brush part, 7
...Brush support body, 7a...First Franz member, 7
b - Second 7-run member, lO male thread, 12-female thread. Application No. Agent Patent Attorney Takehiko Suzue I Illustration 2 (a) (b)

Claims (1)

[Scope of Claims] A brush device comprising a disk-shaped brush body configured by arranging brush parts and a brush support body, and the brush bodies are arranged in multiple stages along the axial direction on a rotating shaft. a first Franz member that brings the brush support constituting the brush body into close contact with one widthwise side portion of the brush portion and defines a pitch distance between the brush bodies provided in multiple stages; A brush device comprising: a second Franz member that is engaged with the Franz member and tightly grips the brush portion together with the first Franz member.