JPS59161998A - Production of array probe - Google Patents

Abstract

PURPOSE:To prevent the fall or exfoliation of an oscillator with a simple operation by grouping a groove to be cut to obtain a telescopic form and putting a filler into the cut every time the group of the groove is cut to proceed to the cutting of the next group of the groove. CONSTITUTION:An oscillator plate TD and matching layers ML2 and ML1 are laminated on a packing material B. The grooves to be cut are divided into an odd group and an even group, and the odd grooves are successively cut. The filler HM is filled all at once into the grooves of the 1st group as soon as they are cut. Then the second group of even grooves are cut. This filler uses wax, polyethylene, a hot-melt adhesive like pitch, etc. The hot-melt heated and turned into a fluid is filled into each groove after the first group of grooves are cut. Then the second group of grooves are cut after the hot-melt of the first group is cooled and hardened. Then an oscillator plate is heated up to flow out the hot-melt.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is based on a method in which a plate-shaped fi fi3 driver is attached to a backing material, and a single or multilayer acoustic impedance matching layer is further applied thereon. Cut the entire width or most of the width of the transducer in the thickness direction on the welded laminate! The present invention relates to a method for manufacturing an array probe, in which the array probe is manufactured by cutting a large number of grooves with a depth of 1.5 mm at predetermined intervals.

We are creating array probes for use in the Chofuwa Odozo device, etc.
Various manufacturing methods have been used in the past. Among these methods, one of the relatively efficient methods is the dicing method. Figure 1 is a diagram showing this manufacturing method, in which a piece of temporary pressure i is placed on the backing material B.
ff J& moving element temporary (e.g. PZT board) 1" [] and one or two acoustic impedance matching layers M L 1, lvl 12 are stacked and bonded thereon, and then dicing 5r1v is formed. D
iR(n −2, n −1, n
...) to acoustically divide the matching layer and the transducer plate in the horizontal direction.
When cutting grooves at high speed, or when trying to make fine bits for a fused array, when cutting the n-th groove, the n-1th 1ffj
There is a possibility that the vibrator will fall towards the (already cut groove) and break. This 41 is also caused by the brittleness of the vibrator (although the main cause is the poor S(reya feed Rj IJ'c) of Guillensou's sword.Usually, the accuracy is lower, Cheap Installation 46 ``C'' Cutting grooves?) ``C1 Some form of collapse prevention'' 1-Measures are required.

Also, not only collapse, but also I remen (
Problems such as peeling off of ~ and peeling off of the matching layer to Niremen 1 also occur. To solve this kind of problem, 1) Cut the valley grooves all at once using a cutter with all your strength.

■Cut one tree at a time, but immediately after cutting the groove, fill the groove with something to prevent it from collapsing (preferably something that hardens quickly), and then start cutting the next groove.

This is a possible method.

However, in the case of method ■, making a cutter using all your strength is also
Moreover, its maintenance is also very troublesome. On the other hand, in the case of method (■), the work is quite cumbersome as the filling is inserted into the groove each time a piece of wood is cut.In addition, the filling is left as is.
It is possible to use it as a chemical component, but in other cases, it is necessary to use a filling that is easy to remove after the groove cutting process (e.g., can be dissolved, evaporated, or easily subjected to J-decomposition). .

The present invention has been made in view of the above points.
The purpose is to provide a method for manufacturing an array probe that does not require the above-mentioned troublesome steps, is easy to operate, and incorporates measures to prevent collapse and peeling.

Hereinafter, the present invention will be explained in detail with reference to the drawings.

The method of the present invention--(') First, on the backing layer B as shown in FIG. 2,'
Prepare one in which Mll is layered with gi.1 Note that the number of matching layers is not limited to two, and an acoustic lens may be further laminated. Next, for example, the cut vortex is divided into odd-numbered grooves and even-numbered grooves, and as shown in Figure 2 (b), the odd-numbered grooves:
Cut 11 rll grooves one after another. The depth of the groove is such that it cuts the entire width or most of the width in the thickness direction of the vibrator plate. In this case, since the intervals between the cuts are relatively wide, there is no risk of the vibrator falling over or peeling off. 1st JA
After completing the Y groove cutting, - simultaneously fill these grooves with filling 1.
-Insert IM (Figure 2 (c)). Next, cut the 281' groove, which is an even-numbered groove.

Incidentally, the groove cutting operation may be performed three times for every three pieces. Similarly, it may be repeated 4 times or more.

If the cut part is left as an empty space ((d) in Figure 2), it is necessary to remove the filler, so use wax, low-molecular omega polyethylene, pitch (a final product in oil refining), etc. as a filler. For example, in the case of the above example, the following work steps would be taken.

After cutting the grooves in the first group, heated and fluidized Botmelt is poured into the grooves. After this is cooled and C assimilated, the second
Perform group groove cutting. Thereafter, the vibrator plate is heated and the melt flows out into the hole. In addition, the method for removing Kotsutomel 1~ is evaporation in a vacuum.

These include thermal decomposition, combustion, dissolution with solvents, and melting.

On the other hand, when leaving a filling in the groove and calling it a musical component, it is preferable that the filling contains epoxy, silicone rubber, or a suitable filler. be.

As described above, according to the present invention, it is possible to realize a J-array probe manufacturing method that does not require troublesome work setups, is easy to perform the work itself, and is free from the risk of collapsing or peeling off the vibrator.

Note that the method of the present invention is applicable not only to one-dimensional array transducers, but also to
It can also be applied to a two-dimensional array (array of base grains) vibrator.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of a conventional array probe manufacturing method, and FIG. 2 is an explanatory diagram of the method of the present invention. B... Backing material TI)... Vibrator plate M L 1, M L 2... Acoustic impedance matching layer DS... Guising tool - Figure 1 Tail 2 Figure Tail 2 prongs (c) (d) mouth) “−

Claims (4)

[Claims] (1) Backing a plate-shaped piezoelectric vibrator (%': i
Furthermore, a single layer or multilayer high-tech impedance mapping layer is applied to the layer, and a groove is formed in the laminate with a depth that cuts through the entire width or most of the width of the transducer in the thickness direction. In a method of manufacturing an array probe by making a large number of cuts at predetermined intervals, the grooves to be cut are divided into groups such that they are nested inside each other, and each time a group of grooves is cut, a group is added. A method for manufacturing an array probe characterized by applying inner vortex padding and proceeding with machining as if moving on to notching the next group of grooves. (2) The method for manufacturing an array probe according to claim 1, wherein the filling is a hot melt adhesive C. (3) The method for manufacturing an array probe according to claim 1, wherein the filling is removed after -C using any one of evaporation, combustion, melting, and melting. (4) 1'+Fr The method for manufacturing an array probe according to claim 1, wherein the filler is not removed and becomes a constituent element of the probe.