JPS59161676U - wiring board - Google Patents

wiring board

Info

Publication number
JPS59161676U
JPS59161676U JP3789284U JP3789284U JPS59161676U JP S59161676 U JPS59161676 U JP S59161676U JP 3789284 U JP3789284 U JP 3789284U JP 3789284 U JP3789284 U JP 3789284U JP S59161676 U JPS59161676 U JP S59161676U
Authority
JP
Japan
Prior art keywords
wiring board
support substrate
metal foil
metal
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3789284U
Other languages
Japanese (ja)
Inventor
貫井　孝
勝 岩崎
勇次 松田
中武　成夫
粟根　克昶
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP3789284U priority Critical patent/JPS59161676U/en
Publication of JPS59161676U publication Critical patent/JPS59161676U/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図、第３図及び第４図は本考案の一実施例
を示す配線基板の製作工程図である。第５図は第４図の
要部拡大図である。第６図は本考案で得られた配線フィ
ルムと従来の配線フ謙ルムとの引張強度を示すデータで
ある。 １・・・有機フィルム、２・・・配線。1, 2, 3, and 4 are manufacturing process diagrams of a wiring board showing an embodiment of the present invention. FIG. 5 is an enlarged view of the main part of FIG. 4. FIG. 6 shows data showing the tensile strength of the wiring film obtained by the present invention and the conventional wiring film. 1...Organic film, 2...Wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属に対して接着力を有する有機フィルムを支持基板と
し、該支持基板に配線パターン成形された金属箔の少な
くとも底部を埋設して一体化するとともに可撓性を形成
したことを特徴とする配線基板。A wiring board characterized in that an organic film having adhesive strength to metal is used as a support substrate, and at least the bottom part of a metal foil formed with a wiring pattern is embedded in the support substrate to integrate the metal foil and to form flexibility. .
JP3789284U 1984-03-15 1984-03-15 wiring board Pending JPS59161676U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3789284U JPS59161676U (en) 1984-03-15 1984-03-15 wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3789284U JPS59161676U (en) 1984-03-15 1984-03-15 wiring board

Publications (1)

Publication Number Publication Date
JPS59161676U true JPS59161676U (en) 1984-10-29

Family

ID=30168580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3789284U Pending JPS59161676U (en) 1984-03-15 1984-03-15 wiring board

Country Status (1)

Country Link
JP (1) JPS59161676U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175968A (en) * 1974-12-25 1976-06-30 Nitto Electric Ind Co HEIKATSUNARUINSATSUKAIRONO SEIHO
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175968A (en) * 1974-12-25 1976-06-30 Nitto Electric Ind Co HEIKATSUNARUINSATSUKAIRONO SEIHO
JPS52149361A (en) * 1976-06-08 1977-12-12 Casio Computer Co Ltd Method of producing flexible printed circuit board

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