JPS59158054U - Thermal conductivity measuring device - Google Patents
Thermal conductivity measuring deviceInfo
- Publication number
- JPS59158054U JPS59158054U JP5354383U JP5354383U JPS59158054U JP S59158054 U JPS59158054 U JP S59158054U JP 5354383 U JP5354383 U JP 5354383U JP 5354383 U JP5354383 U JP 5354383U JP S59158054 U JPS59158054 U JP S59158054U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- plate
- measuring device
- cooling
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の装置の図、第２図はその温度勾配図、第
３図は本考案の一実施例を示す装置の図、第４図は温度
勾配を示す図である。
１：加熱板、１ ２． １ −：熱伝導率の大きい層、
１−３：熱伝導率の小さい層、２：冷却板、３：加熱器
、４：冷却器、フないし１０：温度計、Ｓ：被測定物。
第２Ｍ
第３図
／−２１−ｆ ３FIG. 1 is a diagram of a conventional device, FIG. 2 is a temperature gradient diagram thereof, FIG. 3 is a diagram of a device showing an embodiment of the present invention, and FIG. 4 is a diagram showing a temperature gradient. 1: Heating plate, 1 2. 1-: layer with high thermal conductivity,
1-3: layer with low thermal conductivity, 2: cooling plate, 3: heater, 4: cooler, F to 10: thermometer, S: object to be measured. 2M Fig. 3/-21-f 3
Claims (1)
冷却板と、これらの板を加熱あるいは冷却する手段と、
加熱板および冷却板の厚さ方向異なる２点の位置に夫々
挿入される温度計とからなり、被測定物の熱伝導率を測
定する装置において、熱伝導率の小さい板状の部材の両
面に熱伝導率の大きい板状の部材を密着させてなる積層
体でこれら加熱板および冷却板を形成するとともに、熱
伝導率の大きい部材へ温度計を挿入するようにしたこと
栃特徴とする熱伝導率測定装置。 〜A heating plate and a cooling plate that are respectively brought into contact with both sides of a flat plate-shaped object to be measured, and a means for heating or cooling these plates;
This device consists of a heating plate and a thermometer inserted at two different positions in the thickness direction of a cooling plate, and is used to measure the thermal conductivity of a measured object. Heat conduction is characterized by forming the heating plate and cooling plate with a laminate made of plate-like members with high thermal conductivity and by inserting a thermometer into the member with high thermal conductivity. rate measuring device. ~
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5354383U JPS59158054U (en) | 1983-04-11 | 1983-04-11 | Thermal conductivity measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5354383U JPS59158054U (en) | 1983-04-11 | 1983-04-11 | Thermal conductivity measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59158054U true JPS59158054U (en) | 1984-10-23 |
Family
ID=30183886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5354383U Pending JPS59158054U (en) | 1983-04-11 | 1983-04-11 | Thermal conductivity measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158054U (en) |
-
1983
- 1983-04-11 JP JP5354383U patent/JPS59158054U/en active Pending
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