JPS59154033A - Method and apparatus for eliminating flash at stem edge surface in semiconductor lead frame - Google Patents
Method and apparatus for eliminating flash at stem edge surface in semiconductor lead frameInfo
- Publication number
- JPS59154033A JPS59154033A JP2909583A JP2909583A JPS59154033A JP S59154033 A JPS59154033 A JP S59154033A JP 2909583 A JP2909583 A JP 2909583A JP 2909583 A JP2909583 A JP 2909583A JP S59154033 A JPS59154033 A JP S59154033A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- stem
- stem portion
- semiconductor lead
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims description 17
- 239000011347 resin Substances 0.000 abstract description 14
- 229920005989 resin Polymers 0.000 abstract description 14
- 238000000465 moulding Methods 0.000 abstract description 13
- 238000005520 cutting process Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000013013 elastic material Substances 0.000 abstract 1
- 239000012634 fragment Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RHDGNLCLDBVESU-UHFFFAOYSA-N but-3-en-4-olide Chemical compound O=C1CC=CO1 RHDGNLCLDBVESU-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、半導体素子の樹脂封入成形時において、そ
のリードフレームにおけるステム部端面に付着形成さ庇
るフラフシー（成形樹脂のパリ）の除去方法及び装置に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for removing fluff (flap of molding resin) that adheres and forms on the end surface of a stem portion of a lead frame during resin encapsulation molding of a semiconductor element.
・ところで、半導体リードフレーム上に取シ付けた半導
体素子を樹脂封入成形する場合、第１図及び第２図に示
すように、固定型Ａと可動型Ｂとのパーティングライン
（Ｐ、Ｌ）面における所定位置にリードフレームＣを供
線セットすると共に、上記両型Ａ−Ｂに形成したキャビ
ティ八〇 ・Ｂ１内に溶融樹脂を加圧注入するようにし
ている。・By the way, when resin-encapsulating a semiconductor element mounted on a semiconductor lead frame, as shown in FIGS. 1 and 2, the parting lines (P, L) between fixed mold A and movable mold B are The lead frame C is set in a predetermined position on the surface, and molten resin is injected under pressure into the cavities 80 and B1 formed in both molds A and B.
上記リードフレームＣは、通常の場合、可動型Ｂのパー
ティングライン面に形成した嵌合凹所Ｂ２に嵌入するよ
うに設定されておシ、マた、キャビティＡ１ ・Ｂ、内
への溶融樹脂の注入は、ポット側と連通するランナＢ３
及び該ランナとキャビティＡ１ ・Ｂ１とを連通させた
ゲートＢ４を通して行なわれている。ところが、上記し
た嵌合凹所Ｂ２とリードフレームＣにおけるステム部Ｃ
ｌ’ Ｃ２との間には、該リードフレームの凹所Ｂ２内
への供給セット及び樹脂成形後における該凹所からの取
シ出しを可能にするための若干の間隙Ｄｓ ’Ｄｚが
設けられているため、上記間隙、特に、上記ゲー）Ｂ、
側のステム部Ｃ１と凹所Ｂ２との間に生ずる間隙Ｄ１に
ゲート８番を通してキャビティＡ。The lead frame C is normally set to fit into a fitting recess B2 formed on the parting line surface of the movable mold B. The injection is carried out through runner B3 which communicates with the pot side.
This is carried out through a gate B4 which communicates the runner with the cavities A1 and B1. However, the stem portion C in the above-mentioned fitting recess B2 and lead frame C
A slight gap Ds'Dz is provided between the lead frame and the recess B2 to enable the lead frame to be set in the recess B2 and taken out from the recess after resin molding. Therefore, the above-mentioned gap, especially the above-mentioned game) B,
Cavity A is passed through gate No. 8 through the gap D1 created between the side stem portion C1 and the recess B2.
・Ｂ１内に流入しようとする溶融樹脂の一部が浸入する
ことになシ、従って、樹脂成形後にリードフレームＣを
キャビティＡ１ ・Ｂ１部から取シ呂すと、上記した浸
入樹脂がステム部Ｃ１の端面に固化付着して、第３図に
示すように、フラッジ−Ｅｌを形成することになる。・A part of the molten resin that is about to flow into B1 will not enter. Therefore, when the lead frame C is removed from the cavity A1 after resin molding. It solidifies and adheres to the end face of the flange, forming a fludge-El as shown in FIG.
このフラノシーＥ１は、ゲート８４部に形成されるコー
ルドヌラソグＥ２の除去工程を経ても、第４図に示すよ
うに、なおステム部Ｃ１の端面に残存付着することにな
る。このことは、１１１１１ｍ成形後のリードフレーム
Ｃを、そのステム部Ｃ１・Ｃ２及びタイ／＜−Ｆの切断
除去工程側へ自動的に某内移送する際に、上記フランシ
ュＥ１が移送用シー−ト内、或は、第５図に示すように
、ステム部Ｃ１・Ｃ２を嵌入抱持する移送部材Ｇの嵌合
溝６１ 内等に落下集積して該リードフレームの上記移
送機能を損う等の弊害が発生し、この種成形品の全工程
自動化に多大な障宮となっておシ、このため、従来は、
ゲート部のコτルドヌラノグＥ２の除去工程後に、作業
者が人為的な手作業によシ上記フラッジ−Ｅ１を除去し
ている９が実情である。Even after the process of removing the cold nullasog E2 formed at the gate 84 portion, the flanosee E1 still remains attached to the end surface of the stem portion C1, as shown in FIG. This means that when the lead frame C after 11111m molding is automatically transferred to the cutting/removal process side of the stem portions C1 and C2 and ties/<-F, the franche E1 is or, as shown in FIG. 5, may fall and accumulate inside the fitting groove 61 of the transfer member G that fits and holds the stem portions C1 and C2, impairing the transfer function of the lead frame. This has caused many problems and has become a huge obstacle to automating all processes for this type of molded product.
The actual situation is that after the step of removing the cord tau donuranog E2 of the gate portion, the operator manually removes the fludge E1.
本発明は、半導体リードフレームにおけるステム部の端
面と研削工具における研削面とを接当させた状態で両者
を相対的に摺動させることによシ、該ステム部端面に付
着したフラノン−を除去することを特徴とする半導体リ
ードフレームにおけるステム部端面のフラッジ−除去方
法に係るものであシ、また、本発明は半導体リードフレ
ームにおけるステム部の挟圧支持機構と、上記ステム部
端面のフラッジ−除去用の研削工具とから成シ、該研削
工具に形成した研削面を上記ステム部端面に接当させて
配設すると共に、上記ステム部の挟圧支持４シ構と８１
削工具との両者を相対的に拍動可能に構成したことを特
徴とする半導体リードフレームにおけるステム部端面の
フラノシー除去装置に係るものであシ、上述したような
フラノシーの除去を効率良く、且つ、自動的に行なうこ
とによって、この種成形品の全成形工程の連続自動化に
よる高能率生産を図ることを目的とするものである。The present invention removes furanone adhering to the end surface of the stem portion of a semiconductor lead frame by sliding the end surface of the stem portion of the semiconductor lead frame relative to the grinding surface of the grinding tool while the two are in contact with each other. The present invention also relates to a method for removing fludges from an end surface of a stem portion in a semiconductor lead frame, and the present invention also relates to a clamping support mechanism for a stem portion in a semiconductor lead frame, and a method for removing fludges from an end surface of the stem portion. a grinding tool for removal, the grinding surface formed on the grinding tool is disposed in contact with the end surface of the stem part, and four clamping support structures 81 for the stem part;
The present invention relates to a flannous seam removal device for the end face of a stem portion of a semiconductor lead frame, characterized in that both the cutting tool and the cutting tool are configured to be relatively movable, and which efficiently removes flanose seams as described above. The purpose is to achieve highly efficient production by continuously automating the entire molding process of this type of molded product by automatically performing the process.
以下、本発明を第６図及び８ｇ７図に示す実施例図に基
づいて説明する。Hereinafter, the present invention will be explained based on the embodiment diagrams shown in FIGS. 6 and 8g7.
第６図は、樹脂成形後の半導体リードフレーム１におけ
るステム部１ａの端面に付着したフラッジ−の除去装置
２を示しておシ、該装置はリードフレーム１におけるス
テム部１ａの挟圧支持（点描３と、上記ステム部１ａの
端面に付着したフラノシー除去用の研削ｊ工具４とから
成シ、該研削工具に形成した研削面４ａは下記ステム部
１ａの端面に接当するように配設されると共に、上記ス
テム部１ａの挟圧支持機構３と研削工具４との両者はオ
目対的に摺動可能に構成されている。然して、図例にお
いては、上記したステム部の挟圧支持哉構３側を固定さ
せると共に、該機構の側方位置に配設したイｉｌＦ削工
具４側を上下動可能に構成した場合を示し、更に、上記
挟圧支持機橘３と研削工具４との両者を夫々二組配置し
て構成したものを示している。即ち、上記挟圧支持機構
３は、樹脂成形後のリードフレーム１を前述したヌ７−
４部等の切断除去工程（図示なし）側へ案内するコンベ
アベノ”）５と、ｉ２コンベアベルト上のリードフレー
ム１を所要位置において挟圧支持させる上下一対の支持
部６とから成シ、該支持部の上側に配設した可動支持具
７及びその下側に配設した固定支持具８には、リードフ
レームにおける前記ステム部１ａの上下両面を確実に挟
圧させる突状片７ａ・８ａが設けられている。また、可
動支持具７は非回転軸９を介して上下動機構ｌｏ側へ取
シ付けられると共に、該軸上に巻装させたコイルバネ１
１の弾性によって下方に押動された状態にあシ、また、
その底面にはリードフレーム１の樹脂部上面に接当させ
る弾性相１２が設けられている。また、上記研削工具４
の上端基部は上下動様横１３側の下端部に枢軸１４を介
して軸支されると共に、該工具の下端側はコイルヌプリ
ング１５の弾性によって前記支持部６側へ押圧回動させ
た状態にあシ、且つ、該工具の前記支持部６側には、研
削用の湾或は突起状物からなる研削面４ａが施されてい
る。FIG. 6 shows a device 2 for removing fludge adhering to the end surface of the stem portion 1a of the semiconductor lead frame 1 after resin molding. 3 and a grinding tool 4 for removing the flanose attached to the end surface of the stem portion 1a, and the grinding surface 4a formed on the grinding tool is arranged so as to come into contact with the end surface of the stem portion 1a. In addition, both the clamping support mechanism 3 of the stem portion 1a and the grinding tool 4 are configured to be slidable relative to the eye.However, in the illustrated example, the clamping support mechanism 3 of the stem portion 1a is A case is shown in which the side of the mechanism 3 is fixed, and the side of the IIF cutting tool 4 disposed on the side of the mechanism is configured to be movable up and down. In other words, the clamping support mechanism 3 is constructed by arranging two sets of both of the above.In other words, the clamping support mechanism 3 is configured to hold the lead frame 1 after resin molding in the
It consists of a conveyor bevel (5) that guides the lead frame 1 on the i2 conveyor belt to the cutting/removal process (not shown), and a pair of upper and lower support parts 6 that pinch and support the lead frame 1 on the i2 conveyor belt at a predetermined position. The movable support 7 disposed on the upper side of the lead frame and the fixed support 8 disposed on the lower side thereof are provided with projecting pieces 7a and 8a that reliably pinch both upper and lower surfaces of the stem portion 1a in the lead frame. The movable support 7 is attached to the vertical movement mechanism lo side via a non-rotating shaft 9, and a coil spring 1 wound around the shaft is attached to the movable support 7.
The reed is pushed downward by the elasticity of step 1, and
An elastic phase 12 is provided on the bottom surface of the lead frame 1 to be brought into contact with the upper surface of the resin portion of the lead frame 1 . In addition, the above-mentioned grinding tool 4
The upper end base is pivotally supported by the lower end on the side 13 side for vertical movement via a pivot 14, and the lower end side of the tool is pressed and rotated toward the support part 6 side by the elasticity of the coil nup ring 15. A grinding surface 4a consisting of a grinding bay or protrusion is provided on the reed and on the support portion 6 side of the tool.
従って、上記研削面４ａは上下動機構１３による上動時
及び下動時に、前記リードフレームのステム部１ａの端
面に接当して、該ステム部の端面に７付着したフラッジ
−Ｅｌを強制的に剥離除去するのである。Therefore, the grinding surface 4a comes into contact with the end surface of the stem portion 1a of the lead frame during upward and downward movement by the vertical movement mechanism 13, and forcibly removes the fludge -El attached to the end surface of the stem portion. It is then peeled off and removed.
なお、上記研削工具４の下端部には、前記支持部６側に
向って円弧状に突出形成したガイド部４ｂが配設されて
いるが、このガイド部４ｂを、第６図に示すように、上
記支持部における突状片７ａ・８ａの端面に接当させる
ことによって、上記工具の研削面４ａの位置とリードフ
レームにおけるステム部１ａの端面の位置との適正な接
当位置合せを図シ得るように構成されている。Note that a guide portion 4b is provided at the lower end of the grinding tool 4 and protrudes in an arc shape toward the support portion 6. , by bringing the protruding pieces 7a and 8a into contact with the end faces of the support part, the position of the grinding surface 4a of the tool and the position of the end face of the stem part 1a of the lead frame can be properly brought into contact with each other. It is configured to obtain.
捷だ、上記研削面４ａはリードフレームのステム部１ａ
の長さと略同幅に形成してもよいが、該ステム部におけ
るゲートＢ４の位置と対応する位置及び数を別体に配置
した構成を採用してもよい。The ground surface 4a is the stem part 1a of the lead frame.
Although it may be formed to have approximately the same width as the length of the gate B4, it is also possible to adopt a configuration in which the position and number of gates B4 corresponding to the positions of the gates B4 in the stem portion are separately arranged.
以下、上記フラッジ−Ｅ□の除去作用を更に詳述する。Hereinafter, the removal action of the Fludge-E□ will be explained in more detail.
まず、樹脂成形後のリードフレーム１をコンベアベルト
５上に載置させた状態で挟圧支持機構における支持部６
に搬送すると共に、所要位置において上下動機構１０に
て可動支持具７を下動すると、第７図に示すように、リ
ードフレーム１はその樹脂部がコンベアベルト５及び弾
性相１２間において支持されると共に、そのステム部１
ａが上下の突状片７ａ・８ａ間において確実に挟圧支持
される。次に、研削工具４をその上下動機ｍ１８にて上
下往復動させると、該工具の研削面４ａが上記ステム部
１ａの端面に残存付着したフラッジ−Ｅ工を強制的に剥
離してこれを除去することになるのである。First, with the resin-molded lead frame 1 placed on the conveyor belt 5, the supporting portion 6 of the clamping support mechanism
When the movable support 7 is moved down by the vertical movement mechanism 10 at the desired position, the resin part of the lead frame 1 is supported between the conveyor belt 5 and the elastic phase 12, as shown in FIG. At the same time, the stem portion 1
a is securely supported under pressure between the upper and lower projecting pieces 7a and 8a. Next, when the grinding tool 4 is reciprocated up and down by its vertical mower m18, the grinding surface 4a of the tool forcibly peels off and removes the remaining fludge-E machining remaining on the end surface of the stem portion 1a. That's what I'm going to do.
以上のように、本発明方法は、ステム部の端面と研削工
具における研削面とを接当させた状態で両者を相対的に
摺動させることによってステム部端面のフラソシ二を自
動的に除去させるものであるから、従来の人為的方法と
較べてフラッジ−の除去効率が良く且つ確実であシ、前
述したような弊害を解消することができるといった優れ
た効果を奏するものである。As described above, in the method of the present invention, the end surface of the stem portion and the grinding surface of the grinding tool are slid relative to each other in a state in which they are in contact with each other, thereby automatically removing the flask on the end surface of the stem portion. Therefore, compared to conventional artificial methods, it is more efficient and reliable in removing fludge, and has excellent effects such as being able to eliminate the above-mentioned disadvantages.
また、本発明装置は、ステム部の挟圧支持機構と、ステ
ム部端面に研削面を接当させた研削工具との両者を相対
的に摺動可能に構成したものであるから、ステム部の端
面に残存付着したフラッシュの除去を効率良く、且つ、
自動的に行なうことができるため、このフラッシュ除去
工程をこの種成形品の全成形工程中に組み入れることが
可能となり、従って、その全成形工程の連続自動化によ
る筒能率生産を図ることができるといった優れた効果を
奏するものである。In addition, in the device of the present invention, both the clamping support mechanism of the stem portion and the grinding tool whose grinding surface is in contact with the end surface of the stem portion are configured to be slidable relative to each other. Efficiently removes residual flash remaining on the end face, and
Since it can be performed automatically, it is possible to incorporate this flash removal process into the entire molding process of this type of molded product, and therefore, it is an advantage that it is possible to aim for cylinder efficiency production by continuous automation of the entire molding process. It has the following effects.
第１図乃至第４図はリードフレームのステム部端面に付
着形成されるフランシ二の説明図で、第１図は樹脂成形
金型における可動型にリードフレームを嵌装させた状態
を示す一部切欠平面図、第２図は第１図１−１線におけ
る縦断面図、第３図は樹脂成形後のリードフレーム要部
の拡大斜視図、第４図はゲート部のコールドヌラ・ノブ
を除去した状態を示すリードフレーム要部の斜視図、第
５図はリードフレームの次工程側への移送部材を示す要
部の縦断面図、第６図及び第７図は本発明装置の実施例
を示すもので、第６図は該装置の一部切欠縦断面図、第
７図は該装置の作用説明図である。
Ｃ・・・リードフレーム、 Ｃ１・Ｃ２・・・ステム部
、Ｅｌ・・・フラッジ−１３・・・挟圧支持機描１．４
・・・研削工具、 ４ａ・・・研削面。
特許出願人 長 １）道 男
第６図
第Ｚ図Figures 1 to 4 are explanatory diagrams of the flange formed on the end surface of the stem portion of the lead frame, and Figure 1 is a partial view showing the state in which the lead frame is fitted into the movable mold in the resin molding mold. A cutaway plan view, Figure 2 is a vertical sectional view taken along the line 1-1 in Figure 1, Figure 3 is an enlarged perspective view of the main parts of the lead frame after resin molding, and Figure 4 is a cold null knob of the gate section removed. A perspective view of the main part of the lead frame showing the state, FIG. 5 is a vertical sectional view of the main part showing the member for transferring the lead frame to the next process side, and FIGS. 6 and 7 show an embodiment of the apparatus of the present invention. FIG. 6 is a partially cutaway vertical sectional view of the device, and FIG. 7 is an explanatory diagram of the operation of the device. C...Lead frame, C1/C2...Stem part, El...Fludge-13...Pinch support machine drawing 1.4
...Grinding tool, 4a...Grinding surface. Patent Applicant Long 1) Michio Figure 6 Figure Z
Claims (2)
、研削工具における研削面とを接当させた状態で両者を
相対的に摺動させることによシ、該ステム部端面に付着
したフラソシ二を除去することを特徴とする半導体リー
ドフレームにおける７テム部端面のフラノシー除去方法
。(1) By sliding the end face of the stem portion of the semiconductor lead frame and the grinding surface of the grinding tool relative to each other while they are in contact with each other, the flange attached to the end face of the stem portion is removed. A method for removing flanosey from an end face of a seven-tem portion in a semiconductor lead frame.
持機構と、上記ステム部端面のフラッシュ除去用の研削
工具とから成シ、該研削工具に形成した研削面を上記ス
テム部端面に接当させて配設すると共に、上記ステム部
の挟圧支持機構と研削工具との両者を４′１対的に摺動
可能に構成したことを特徴とする半導体リードフレーム
におけるステム部端面のフラッジａ除去装置。(2) Consisting of a clamping support mechanism for the stem portion of the semiconductor lead frame and a grinding tool for removing flash from the end surface of the stem portion, the grinding surface formed on the grinding tool is brought into contact with the end surface of the stem portion; A device for removing fludge a from an end face of a stem portion in a semiconductor lead frame, characterized in that both the clamping support mechanism of the stem portion and the grinding tool are configured to be slidable in a 4'1 pairwise manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2909583A JPS59154033A (en) | 1983-02-22 | 1983-02-22 | Method and apparatus for eliminating flash at stem edge surface in semiconductor lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2909583A JPS59154033A (en) | 1983-02-22 | 1983-02-22 | Method and apparatus for eliminating flash at stem edge surface in semiconductor lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59154033A true JPS59154033A (en) | 1984-09-03 |
| JPS6348423B2 JPS6348423B2 (en) | 1988-09-29 |
Family
ID=12266790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2909583A Granted JPS59154033A (en) | 1983-02-22 | 1983-02-22 | Method and apparatus for eliminating flash at stem edge surface in semiconductor lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154033A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806120B2 (en) * | 2001-03-27 | 2004-10-19 | Staktek Group, L.P. | Contact member stacking system and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624445U (en) * | 1985-06-25 | 1987-01-12 |
-
1983
- 1983-02-22 JP JP2909583A patent/JPS59154033A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624445U (en) * | 1985-06-25 | 1987-01-12 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6806120B2 (en) * | 2001-03-27 | 2004-10-19 | Staktek Group, L.P. | Contact member stacking system and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6348423B2 (en) | 1988-09-29 |
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