JPS59151499U - Conductive resin package for integrated circuits - Google Patents
Conductive resin package for integrated circuitsInfo
- Publication number
- JPS59151499U JPS59151499U JP4618783U JP4618783U JPS59151499U JP S59151499 U JPS59151499 U JP S59151499U JP 4618783 U JP4618783 U JP 4618783U JP 4618783 U JP4618783 U JP 4618783U JP S59151499 U JPS59151499 U JP S59151499U
- Authority
- JP
- Japan
- Prior art keywords
- conductive resin
- resin package
- integrated circuits
- integrated circuit
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例を示す断面図、第２図は本考案
の実施例を示す斜視図である。
１・・・一部を構成する導電性樹脂、２・・・残部を構
成する高導電性樹脂、３・・・集積回路。FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a perspective view showing an embodiment of the present invention. 1... Conductive resin constituting a part, 2... Highly conductive resin constituting the remainder, 3... Integrated circuit.
Claims (1)
表面表示部が透視可能な導電性樹脂とし、残部を高導電
性樹脂として、両者を一体に成形したことを特徴とする
集積回路用導電性樹脂パッケージ。 ２ 前記導電性樹脂の電気抵抗が１０９〜１０１１Ωで
あることを特徴とする実用新案登録請求の範囲第１項記
載の集積回路用導電性樹脂パッケージ。 ３ 前記高導電性樹脂の電気抵抗が１０８Ω以下である
ことを特徴とする実用新案登録請求の範囲第１項及び第
２項記載の集積回路用導電性樹脂パッケージ。[Scope of Claim for Utility Model Registration] 1. In a package for an integrated circuit, a part is made of conductive resin through which the surface display part of the integrated circuit can be seen, the remaining part is made of highly conductive resin, and both are integrally molded. A conductive resin package for integrated circuits featuring: 2. The conductive resin package for an integrated circuit according to claim 1, wherein the conductive resin has an electrical resistance of 10 9 to 10 11 Ω. 3. The conductive resin package for an integrated circuit according to claims 1 and 2, wherein the electrical resistance of the highly conductive resin is 108Ω or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4618783U JPS59151499U (en) | 1983-03-30 | 1983-03-30 | Conductive resin package for integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4618783U JPS59151499U (en) | 1983-03-30 | 1983-03-30 | Conductive resin package for integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59151499U true JPS59151499U (en) | 1984-10-11 |
Family
ID=30176732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4618783U Pending JPS59151499U (en) | 1983-03-30 | 1983-03-30 | Conductive resin package for integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59151499U (en) |
-
1983
- 1983-03-30 JP JP4618783U patent/JPS59151499U/en active Pending
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