JPS5915077Y2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a single-phase or multi-phase bridge type semiconductor device.

FIG. 1 shows a conventional example. In FIG. 1A, 1 is a flat semiconductor element, which is sandwiched between a lower cooling fin 2 and an upper cooling fin 3, and is crimped and clamped by an insulating clamp bolt 4 to form a unit 5. It's a formality.

Reference numeral 6 denotes an L-shaped mounting bracket for fixing the unit 5 to the mounting plate 7.

FIGS. 1B-C show an example of a three-phase bridge type semiconductor device in which six units 5 are installed on a mounting plate 7 made of an insulating member with a required insulation interval, and 8 is a lower cooling fin 2. DC busbars fixed to obtain electrical connections on each side wall of the
Reference numeral 9 denotes a three-phase AC bus bar, each end of which is connected to a predetermined location of the upper cooling fin using a flexible connecting wire 10.

In the semiconductor device configured as described above, when inspecting or replacing the flat semiconductor element 1, disconnect the flexible connecting wire 10, remove the three-phase AC bus 9 and the DC bus 8, and then remove the unit 5. must be removed from the mounting plate 7.

Generally, semiconductor devices are installed inside a switchboard, so the above-mentioned removal work must be done in a narrow working space inside the switchboard.In particular, the removal and installation of the cooling fins 2 under the DC bus 8 and the installation of the unit 5 are required. Attachment and removal to and from the plate 7 must be carried out in a space so narrow and deep that even one's hand cannot fit inside, which severely impedes work efficiency.

This invention was made in view of the above problems,
The object of the present invention is to provide a semiconductor device whose unit can be taken out of a switchboard extremely easily.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals as in FIGS.

In FIGS. 2A and B, 11 is a lower cooling fin, 12 is an upper cooling fin, and both fins 11.12 are shifted from each other along a direction parallel to the mounting plate 7, so that the ends 11a of both fins 11.12 are , 12a are provided with attachment holes 13, 13.

A flat semiconductor element 1 is sandwiched between these upper and lower cooling fins 11 and 12, and is crimped and clamped by an insulating clamp bolt 4 to form a unit 14.

Reference numerals 15 and 16 denote current-carrying bolts installed in the mounting plate 7, which connect the unit 1 through the tube seats 17 and 18 made of insulating materials.
4 is attached and fixed by tightening the nut 19.

The other end of the energizing pole 15.16 is made to protrude from the back side of the mounting plate 7, and the L-shaped connecting conductor 20.21 is attached and fixed by tightening the nut 22.

The connecting conductor 20 is connected to the DC bus 8, and the connecting conductor 21 is connected to the three-phase AC bus 9.

FIGS. 3A to 3C show an example of a three-phase bridge type semiconductor device in which six units 14 are provided on the mounting plate 7 with a required insulation interval.

Current-carrying poles 15 and 16 are planted on the mounting plate 7, and are connected to the DC bus 8 and three-phase AC bus 9 arranged on the back of the mounting plate 7 by L-shaped connecting conductors 20 and 21.

The unit 14 is fixed by tightening with a lug 19 via tube seats 17 and 18 fitted in energized poles 15 and 16.

Note that the tube seat may be omitted by using a stepped bolt as the current-carrying bolt.

According to the present invention configured as described above, a pair of cooling fins holding a flat semiconductor element in a crimped manner are shifted from each other in a direction parallel to the mounting plate, and each of the cooling fins is disposed on the back surface of the mounting plate. Because it is connected to the bus bar with a current-carrying bolt,
When inspecting and replacing flat semiconductor devices, there is no need for additional work such as disconnecting the DC bus or AC bus or removing the bus itself. This has a practical effect in that the unit consisting of the flat semiconductor element, the pair of cooling fins, and the insulating clamp bolts can be taken out of the switchboard extremely easily by simply uncoupling them.

[Brief explanation of the drawing]

Figures 1A, B, and C show a conventional example, Figure 1A is a plan view showing a cooling fin unit, and Figures 1B and C are front views of a semiconductor device in which the same unit is configured in a three-phase bridge configuration. 2 and 3 show an embodiment of the present invention, and FIGS. 2A and 2B are a plan view and a side view showing a cooling fin unit, and FIG. 3A is a side view. B and C are a front view, a side view, and a rear view of a semiconductor device in which the same unit is configured in a three-phase bridge type. DESCRIPTION OF SYMBOLS 1... Flat semiconductor element, 7... Mounting plate, 11... Lower cooling fin, 12... Main cooling fin, 14...・Unit, 8...
・DC bus, 9...Three-phase AC bus, 15.16
・・・・・・Electrifying bolt.

Claims (1)

[Scope of utility model registration request] In a semiconductor device in which a unit in which a flat semiconductor element is crimped and held between a pair of cooling fins is mounted along a mounting plate, the pair of cooling fins are mutually shifted in a direction parallel to the mounting plate, and each A semiconductor device, characterized in that the semiconductor device is connected to a bus bar disposed on the back side of the mounting plate by a current-carrying bolt.