JPS59148499A - Speaker - Google Patents

Speaker

Info

Publication number
JPS59148499A
JPS59148499A JP2326883A JP2326883A JPS59148499A JP S59148499 A JPS59148499 A JP S59148499A JP 2326883 A JP2326883 A JP 2326883A JP 2326883 A JP2326883 A JP 2326883A JP S59148499 A JPS59148499 A JP S59148499A
Authority
JP
Japan
Prior art keywords
diaphragm
heat
radiator
speaker
voice coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2326883A
Other languages
Japanese (ja)
Inventor
Megumi Kageyama
蔭山 惠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2326883A priority Critical patent/JPS59148499A/en
Publication of JPS59148499A publication Critical patent/JPS59148499A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • H04R9/022Cooling arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

PURPOSE:To complete a radiator system by a speaker itself by using the radiator in common use with a protecting plate of a diaphragm. CONSTITUTION:When a high input is applied to the speaker, a heat generated in a voice coil 1 moves to a heat pipe 2 via a center pole 3, is delivered to the radiator 14 quickly and discharged into external air. In case of a woofer especially, since the amplitude of the diaphragm 9 is large and the air flow produced by the vibration of the diaphragm 9 cools forcibly the radiator 14 in common use with the protecting plate on the entire face of the diaphragm 9, the heat dissipation effect is high. Thus, the temperature rise of the voice coil 1 is suppressed, then the decrease in the sound pressure level due to the heating of the voice coil and a change for disconnection are decreased.

Description

【発明の詳細な説明】 産業上の利用分野 本弁明は、界磁部にヒートバイブプを介しC放熱手段を
結合した動電型のスピーカに関づるもの(あ・る。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electrodynamic speaker in which a C heat dissipation means is coupled to a field part via a heat vibrator.

従来例の構成とその問題魚 従来の一般的なスピーカCは、第1図のように1JI別
な放熱手段を持つ−Cいない。この場合、スピーカに高
入力が加わった時にボイスコイル1が発熱し、インピー
タンスがL胃づるICめIIIレベルが低下したり、極
端な場合はボイスコイル1が断線する可能性があった。
Conventional configuration and its problems A conventional general speaker C does not have a separate heat dissipation means as shown in FIG. In this case, when a high input is applied to the speaker, the voice coil 1 generates heat, causing the impedance to drop in the IC level, or in extreme cases, the voice coil 1 may become disconnected.

イこC第2図のように、放熱手段としでヒートバイブ2
を利用したものが提案されているが、センターボール3
ど結合されたヒートバイブ2がスピーカ背面に導かれで
dタリ、スピーカをキャビネット4に組み込んだ場合、
放熱器5はキャビネッ1〜4の内部にあり、外気と直接
接触できないため放熱効果が低い。特にキiヒネット4
が密閉タイプの場合、空気の入れ換えが行なわれないた
め冷N1効宋は一層低い。放熱器ε3を外気に触れさυ
るためには、キトじネット4の外側に取り角【ブる必要
がある。このため第3図のようにヒートバイブ2をキャ
ビネッ1へ4を真通して取付り、ヤセヒネッ1−4の背
面に取(;1番〕られた放熱器5と結合させるか、或い
は第4図のようにヒートバイブ2をU字型に折り曲げ−
C,i−トヒネッ1−4の前面、天面、又は側面に取f
1けられた放熱機5と結合Jるなと、複雑な取付構造を
必要とした。なお第1図において、6はマグネット、7
はプレート、8はフレーノ1.91よ振動板、10は1
ツジ、11はガスケット、12 GJダンパー、13は
センターキャップCある。
As shown in Figure 2, heat vibrator 2 is used as a heat dissipation means.
It has been proposed that the center ball 3
When the connected heat vibrator 2 is guided to the back of the speaker and the speaker is installed in the cabinet 4,
The heat radiator 5 is located inside the cabinets 1 to 4 and cannot directly contact the outside air, so its heat radiation effect is low. Especially Kihinet 4
If it is a closed type, the cold N1 effect is even lower because air is not exchanged. Expose the heat sink ε3 to the outside air υ
In order to do so, it is necessary to set an angle on the outside of the kitoji net 4. Therefore, as shown in Fig. 3, the heat vibrator 2 is attached to the cabinet 1 by passing 4 straight through it, and it is combined with the heat sink 5 attached to the back of the heat sink 1-4, or as shown in Fig. 4. Fold the heat vibrator 2 into a U-shape as shown.
C, i-F is attached to the front, top, or side of
A complicated mounting structure was required to connect the radiator 5 to the radiator 5. In Fig. 1, 6 is a magnet, and 7 is a magnet.
is the plate, 8 is Freno 1.91 diaphragm, 10 is 1
Tsuji, 11 is gasket, 12 is GJ damper, 13 is center cap C.

発明の目的 本発明は」−記従来の欠点を解消するもので、構造が簡
単で、しかもスピーカにへ入力が加えられた時にボイス
コイルに発生する熱を効率良く放熱できるスピーカを提
供覆ることを目的とする。
OBJECTS OF THE INVENTION The present invention overcomes the drawbacks of the prior art and provides a speaker that has a simple structure and can efficiently dissipate heat generated in the voice coil when input is applied to the speaker. purpose.

発明の構成 上記目的を達づるため、本発明のスピーカは、振動板前
面に配置されてこの振動板の保護板を兼ねた熱伝導率の
高い物質からなる放熱器と、界磁部を構成しているセン
ターボールに形成された孔に一端部が挿入されて熱的に
結合されかつボイスコーrルボビンを刺通して他端部が
前記放熱部と結合されたヒートバイブとを備えた構成で
ある。
Structure of the Invention In order to achieve the above object, the speaker of the present invention comprises a radiator made of a material with high thermal conductivity, which is placed in front of the diaphragm and which also serves as a protection plate for the diaphragm, and a field section. The heat vibrator has one end inserted into a hole formed in a center ball to be thermally coupled to the heat vibrator, and a heat vibrator whose other end is coupled to the heat dissipation section by piercing the voice call bobbin.

実施例の説明 以下、本発明の一実施例について、図面に基づいて説明
する。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第5図は本発明の一実施例にd3Lノるスピーカの断面
図、第6図は同スピーカを用いたスピーカシステムの断
面図であり、第1図〜第4図に承り構成要素と同一の構
成要素には同一の符号を付している。
FIG. 5 is a sectional view of a d3L speaker according to an embodiment of the present invention, and FIG. 6 is a sectional view of a speaker system using the same speaker. Components are given the same reference numerals.

14は振動板9の保護板を兼ねた放熱器であって、音響
特性に彰豐を与えず、かつ放熱面積を広くとれるように
多孔状になつそいる。又放熱特性を良くするために熱伝
導率の高い物質で作られており、その周辺部をフレーム
8とガスケット11の間で断熱材16を介して固定され
ている。ヒートバイブ2は、一端が放熱器14の中心部
分でサーマルジヨイント15を介して固定され、他端が
サーマルジヨイント15を介してセンターボール3の孔
に嵌入固定されている。またヒートバイブ2がセンター
キャップ13をn通覆る部分には屈曲自在なシーリング
材11が貼付され、防塵と気密性の保持とが確保されて
いる。
Reference numeral 14 denotes a heat radiator which also serves as a protection plate for the diaphragm 9, and is porous so as not to affect the acoustic characteristics and to provide a large heat radiation area. In addition, it is made of a material with high thermal conductivity to improve heat dissipation characteristics, and its peripheral portion is fixed between the frame 8 and the gasket 11 via a heat insulating material 16. One end of the heat vibrator 2 is fixed at the center of the radiator 14 via a thermal joint 15, and the other end is fitted and fixed into a hole of the center ball 3 via the thermal joint 15. Further, a flexible sealing material 11 is attached to the portion where the heat vibrator 2 covers the center cap 13 n times to ensure dustproofing and airtightness.

上記構成において、スピーカにへ入力が加わった時にボ
イスコイル1に発生する熱は、センターボール3をべて
ヒートバイブ2に移動し、すみやかに放熱器14に伝達
されて外気へ放出される。特に低音用スピーカの場合は
、振動板9の振幅が大きいため、振動板9の振動によっ
゛(生じる空気の流れが振動板9の全面にある保護板を
兼ねた放熱器14を強lす冷M1するため放熱効果【よ
高い。従ってボイスコイル1の温度上野が抑制されるた
め、従来の放熱手段を17 kないスピーカのようにボ
・rスフイル1の発熱による音圧レベルの低Fや断線を
起こす器会が減少する。またスピーカ中独で放熱系が完
成されているため、第6図のようにキャビネット4に組
み込む際にもキトヒネット4に特別な細工は不要Cあり
、しかも放熱器14が外部に露出しているため、組み込
んだ後の放熱効果は依然高い。また放熱器14は同時に
振動板9の保護板として器能するので、部品としての投
資効果も高い。
In the above configuration, the heat generated in the voice coil 1 when an input is applied to the speaker moves through the center ball 3 to the heat vibrator 2, is immediately transmitted to the radiator 14, and is emitted to the outside air. Especially in the case of a bass speaker, since the amplitude of the diaphragm 9 is large, the air flow generated by the vibration of the diaphragm 9 forces the radiator 14, which also serves as a protection plate, on the entire surface of the diaphragm 9. Because of the cold M1, the heat dissipation effect is higher. Therefore, the temperature range of the voice coil 1 is suppressed, so the sound pressure level can be lowered by the heat generation of the voice coil 1, and the sound pressure level is lower than the conventional heat dissipation means. The chances of wire breakage are reduced.Also, since the heat dissipation system for the speaker has been completed in China and Germany, there is no need for any special work on the Kitohinet 4 when it is assembled into the cabinet 4 as shown in Figure 6, and there is no need for a heat dissipation system. Since the heat sink 14 is exposed to the outside, the heat dissipation effect after installation is still high.Furthermore, since the heat sink 14 also functions as a protection plate for the diaphragm 9, the investment effect as a component is also high.

尚リーマルジョインi〜134;L、ピンターポール3
或いは放熱器14とピー1−パイプ2どの熱抵抗をトげ
る目的、断熱材16は、ヒー(へバイブ2とフレーム8
との熱:f゛渉を防ぐ目的でそれぞれ用いられている。
In addition, legal join i ~ 134; L, Pinter Paul 3
Alternatively, for the purpose of increasing the heat resistance of the radiator 14, pipe 1 and pipe 2, the heat insulating material 16 is used to
Both are used for the purpose of preventing heat and heat interference.

なお、−に記実施例においては、第5図のように]−ン
形振動根を備えたスピーカについて説明したが、平面形
振動板やドーム形振動板などを備えたスピーカに適用し
ても同様の効果が4qられる口とは勿論である。
In addition, in the embodiment described in -, a speaker equipped with a horn-shaped vibration root as shown in FIG. Of course, the same effect can be achieved with 4q.

発明の詳細 な説明したように本発明によれば、スピーカに高入力を
加えた時でもボイスコイルの発熱による温度1譬を一効
率良く抑制づ−ることができるのぐ、ボイスコイルの発
熱に伴う、インピーダンス上着(こよる音圧レベルの低
下や、段線を良好に防止し得る。またこのような効果を
有づるスピーカシステムを特別な細工をしたキャビネッ
トを用いることなしに実現でき、安価に製作し1qる。
As described in detail, according to the present invention, even when high input is applied to the speaker, the temperature caused by heat generation of the voice coil can be efficiently suppressed. It is possible to effectively prevent a drop in the sound pressure level and the occurrence of broken lines due to the impedance jacket (impedance jacket).Also, a speaker system with such effects can be realized without using a specially crafted cabinet, and it is inexpensive. It was made and cost 1q.

更に放熱器がスピーカ振動板の保護板を兼ねるため、部
品としての投資効果が高い。
Furthermore, since the heatsink also serves as a protection plate for the speaker diaphragm, the investment effect as a component is high.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来□の特別な放熱手段を持1.:ないスピー
カユニットの断面図、第2図〜第4図はそれぞれ従来の
ヒートバイブを用いたスピーカシステムの断面図、第5
図は本発明の一実施例にお(−)るスピーカの断面図、
第6図は本発明の一実施例にd3けるスピーカを用いた
スピーカシスiムの断面図である。 1・・・ボイスコ
イル、2・・・ヒートバイブ、3・・・センターボール
、9・・・振動板、14・・・放熱器代理人   森 
 本  義  弘 第1図 1 第2゜    第3図 第4 第り図 4 □工。−一 )\。 第5図 、ユん ノ2 π ノ
Figure 1 shows a conventional □ special heat dissipation means. Figures 2 to 4 are cross-sectional views of a speaker system using a conventional heat vibrator.
The figure is a sectional view of a speaker (-) according to an embodiment of the present invention.
FIG. 6 is a sectional view of a speaker system i using speakers d3 in one embodiment of the present invention. 1...Voice coil, 2...Heat vibe, 3...Center ball, 9...Vibration plate, 14...Radiator agent Mori
Yoshihiro MotoFigure 1 1 2゜ Figure 3 4 Figure 4 □Eng. -1)\. Figure 5, Yunno 2 π ノ

Claims (1)

【特許請求の範囲】[Claims] 1、振動板前面に配置されてこの振動板の保護板を兼ね
た熱転3#率の高い物質からなる放熱器と、界磁部を構
成しているセンターボールに形成された孔に一端部が挿
入されて熱的に結合されかつボイスコイルボビンを川面
して11!!喘部が前記放熱器と結合されたヒートバイ
ブどを1ihえたスピーカ。
1. A radiator made of a material with a high heat transfer ratio that is placed in front of the diaphragm and also serves as a protection plate for the diaphragm, and one end attached to the hole formed in the center ball that constitutes the field part. is inserted and thermally coupled, and the voice coil bobbin is exposed to the surface of 11! ! A speaker whose pane includes a heat vibrator combined with the radiator.
JP2326883A 1983-02-14 1983-02-14 Speaker Pending JPS59148499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2326883A JPS59148499A (en) 1983-02-14 1983-02-14 Speaker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2326883A JPS59148499A (en) 1983-02-14 1983-02-14 Speaker

Publications (1)

Publication Number Publication Date
JPS59148499A true JPS59148499A (en) 1984-08-25

Family

ID=12105849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2326883A Pending JPS59148499A (en) 1983-02-14 1983-02-14 Speaker

Country Status (1)

Country Link
JP (1) JPS59148499A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757547A (en) * 1987-09-10 1988-07-12 Intersonics Incorporated Air cooled loudspeaker
US5042072A (en) * 1989-04-14 1991-08-20 Harman International Industries, Inc. Self-cooled loudspeaker
KR100692256B1 (en) 2005-07-19 2007-03-14 주식회사 블루콤 Heat emission structure of micro-speaker
JP2014082760A (en) * 2012-10-16 2014-05-08 Eberspaecher Exhaust Technology Gmbh & Co Kg Speaker with improved load capacity
US20160007120A1 (en) * 2014-07-03 2016-01-07 Creative Technology Ltd Electronic device and a heatsink arrangement associated therewith
WO2016135517A3 (en) * 2015-02-27 2016-11-24 Native Design Limited Light and loudspeaker driver device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4757547A (en) * 1987-09-10 1988-07-12 Intersonics Incorporated Air cooled loudspeaker
US5042072A (en) * 1989-04-14 1991-08-20 Harman International Industries, Inc. Self-cooled loudspeaker
KR100692256B1 (en) 2005-07-19 2007-03-14 주식회사 블루콤 Heat emission structure of micro-speaker
JP2014082760A (en) * 2012-10-16 2014-05-08 Eberspaecher Exhaust Technology Gmbh & Co Kg Speaker with improved load capacity
US9591387B2 (en) 2012-10-16 2017-03-07 Eberspaecher Exhaust Technology Gmbh & Co. Kg Loudspeaker with improved thermal load capacity
US20160007120A1 (en) * 2014-07-03 2016-01-07 Creative Technology Ltd Electronic device and a heatsink arrangement associated therewith
WO2016135517A3 (en) * 2015-02-27 2016-11-24 Native Design Limited Light and loudspeaker driver device
US10219061B2 (en) 2015-02-27 2019-02-26 Native Design Limited Light and loudspeaker driver device
EP3641331A1 (en) * 2015-02-27 2020-04-22 Zuma Array Limited Light and loudspeaker driver device
US10924832B2 (en) 2015-02-27 2021-02-16 Zuma Array Limited Light and loudspeaker driver device
TWI737593B (en) * 2015-02-27 2021-09-01 英商祖瑪陣列有限公司 Light and loudspeaker driver device

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