JPS59146182A - Panel heater device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a planar heating element device that improves temperature variation distribution by integrally configuring a heat equalizing plate and a planar heating element.

Conventional structure and its problems Normally, the sheet heating element is attached directly to the object to be heated. In some cases, there were parts that did not bond properly, resulting in abnormally high temperatures in those parts. In addition, if the sheet heating element has a positive temperature coefficient of resistance, the resistance value distribution that occurs with the temperature distribution changes in the direction of expanding the temperature distribution, so the temperature distribution often becomes uneven. Ta. In particular, the higher the power density, the more likely it is to occur, and some kind of countermeasure was needed.1 Among the various countermeasures, the most reliable one is to bond a heat-uniforming plate with good thermal conductivity to the planar heating element. The thermal conductivity of the heat equalizing plate eliminates some temperature distribution, and there is no need to strictly control the state of connection with the object to be heated. However, in planar heating element devices equipped with a heat equalizing plate, depending on the manufacturing process and materials, air may get mixed in between the electrical insulating layer and the heat equalizing plate, and reactive gases may be generated. The problem is that it gets bigger, forming areas with poor adhesion and causing abnormal heat generation.

For this reason, the materials used are limited and it cannot be used for a long period of time.

OBJECTS OF THE INVENTION The present invention has been made in view of the above-mentioned conventional drawbacks, and an object of the present invention is to improve the thermal coupling between the heat equalizing plate and the planar heating element.

Structure of the Invention In order to achieve the above object, the present invention comprises laminating a heat equalizing plate, an adhesive, an electrical insulating layer, and a resistor in this order, and providing small holes in the heat equalizing plate.

DESCRIPTION OF EMBODIMENTS Below, embodiments of the present invention will be described with reference to FIGS. 2 and 3.

In Figures 2 and 3, 5 is a heating element made of a dispersion system of carbon black and resin, 6 is an electrode formed on both ends of the heating element 5, and 7 is an electrically insulating layer, for example, an electrically insulating layer. It is a polyester film substrate. 8 is a polyester hot-melt adhesive layer, 9 is a heat equalizing plate made of an aluminum plate, and 1o is a small hole provided in the heat equalizing plate 9. Then, a heat soaking plate 9, a polyester hot melt adhesive layer 8, an electrical insulation layer 7
, the heating elements 5 are sequentially stacked. Note that a large number of small holes 1° are provided with an area ratio that does not prevent the thermal conductivity of the heat equalizing plate 9.

In the above configuration, the small holes 10 provided in the heat equalizing plate 9 can prevent the growth of air bubbles on the heat equalizing plate 9, and can uniformly radiate heat from any part. In addition, in the above-described configuration, there is no need to limit the adhesive 8 between the heat soaking plate 9 and the heating element 5, and although it has excellent thermal conductivity like a silicone adhesive, it generates a lot of reaction residue and cannot be used. This is especially effective in cases where it is considered impossible to do so. Temperature Coefficient of ResistanceDepending on the sheet heating element, if there is a temperature abnormality in even a minute part, a part with increased resistance will occur there, voltage will be concentrated, and power will also be concentrated, leading to destruction of the heating element. However, it is thought that this effect is even more effective in cases like this. In addition, when manufacturing a very large planar heating element, it is expected that it will be technically difficult to bond them together without letting air in, but it is also a very effective method in such cases. It is believed that there is.

Effects of the Invention As stated above, the present invention realizes stable performance and quality of a sheet heating element, and is suitable for sheet heating elements characterized by high output, positive temperature coefficient of resistance, large area, etc. It is valid.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a conventional planar heating element device, FIG. 2 is a sectional view of a planar heating device according to an embodiment of the present invention, and FIG. 3 is a back view of the same. 6... Heating element, 7... Electrical insulation layer, 8...
・Polyester true melt adhesive layer, 9...
Soaking plate, 10...Small hole. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure, 3 Figure 2

Claims (1)

[Claims] A planar heating element device in which a heat equalizing plate, an adhesive, an electrical insulating layer, and a resistor are laminated in this order, and small holes are provided in the heat equalizing plate.