JPS59143390A - Method of regenerating substrate for perforating panel - Google Patents
Method of regenerating substrate for perforating panelInfo
- Publication number
- JPS59143390A JPS59143390A JP1773983A JP1773983A JPS59143390A JP S59143390 A JPS59143390 A JP S59143390A JP 1773983 A JP1773983 A JP 1773983A JP 1773983 A JP1773983 A JP 1773983A JP S59143390 A JPS59143390 A JP S59143390A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- panel
- holes
- putty
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はパネルに孔明けを行なう際に用いられる基板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a substrate used when drilling holes in a panel.
例えばエレクトロニクス回路に用いられるフェノール樹
脂板、自動車や建材等に用いられる繊維板や木質板、キ
ャビネットや隔壁に用いられるプラスチック板等のパネ
ルには素子取付孔。For example, panels such as phenol resin boards used in electronic circuits, fiberboards and wood boards used in automobiles and building materials, and plastic boards used in cabinets and bulkheads have element mounting holes.
ボルト取付孔等の孔が明けられる。上記パネルに孔明け
を行なうには第１図に示すようにパネル（１）に穿孔機
のカッター（２）を刺通すのであるが、図に示すように
裏面にバＩＪ（＋）Ａが形成され外観上あるいは実用上
好ましくない。そこでパリ（１）Ａを研削等によって除
去する必要があるが研削するにも手間を要する。現在は
孔明けの時点でパリ形成そのものを防止するために第２
図に示すような基板（３）を用い、該基板（３）にパネ
ル（１）を多数積層したもの全体にカッター（２）を刺
通して孔明けを行なう。このような方法ではパリ（３）
Ａは最下層のパネル、即ち基板（３）の裏面にのみ形成
され、パネル（１）には形成されない。しかしこの方法
では基板（３）には孔明けのつど孔が明けられるからそ
のつど新らしいものに交換しなければならず、基板（３
）の材料が浪費され省資源的観点からみて好ましくない
。Holes such as bolt mounting holes can be drilled. To make a hole in the above panel, as shown in Figure 1, the cutter (2) of the punching machine is pierced through the panel (1), and as shown in the figure, a hole is formed on the back side of the panel (IJ(+)A). This is not desirable in terms of appearance or practicality. Therefore, it is necessary to remove the paris (1) A by grinding or the like, but even grinding requires time and effort. Currently, a second hole is installed at the time of drilling to prevent paris formation itself.
Using a substrate (3) as shown in the figure, a cutter (2) is pierced through the entire structure in which a large number of panels (1) are stacked on the substrate (3) to make holes. In this way Paris (3)
A is formed only on the bottom panel, that is, the back surface of the substrate (3), and is not formed on the panel (1). However, with this method, a hole is drilled in the substrate (3) each time, so it must be replaced with a new one each time, and the substrate (3) must be replaced with a new one each time.
) is wasted, which is undesirable from the viewpoint of resource conservation.
本発明は基板を再生１．て繰返し使用することを目的と
し、使用後の基板の孔部分に硬化性パテを充填［７硬化
せしめることを骨子とするものである。The present invention regenerates substrates.1. The purpose of this is to fill the holes in the board with hardening putty [7] and allow it to harden after use.
本発明を第３図以下に示す一実施例によって説明すれば
、基板（３）はパネル（１）と同種のものを用いるのが
一般的であり、例えばフェノール樹指板の孔明けには基
板としてフェノール樹脂板が用いられる。使用後の基板
（３）には多数の孔（３）Ｂが形成され、該孔（３）Ｂ
の装面周縁にはパリ（３）Ａが形成されているから所望
なれば先づバリ（３）Ａをヤスリ、グラインダー等によ
って研＊ １．、て除去する。そして後基板（３）の孔
（３）Ｂには基板（３）の表１１４１から硬化性パテが
充填される。硬化性パテ（４）は、例えばエポキシ樹脂
、不飽和ポリエステル樹脂、ウレタン樹脂、フェノール
樹脂、尿紫嗣脂、メラミン樹脂等の常温もＬ＜は熱硬化
性合成樹脂、あるいはウレタンプレポリマー。The present invention will be explained with reference to an embodiment shown in FIG. A phenolic resin board is used as the material. A large number of holes (3)B are formed in the substrate (3) after use, and the holes (3)B
Since a burr (3) A is formed on the periphery of the mounting surface, if desired, first grind the burr (3) A with a file, a grinder, etc.*1. , and remove it. Then, the hole (3)B of the rear substrate (3) is filled with a hardening putty from the surface 1141 of the substrate (3). The curable putty (4) is a thermosetting synthetic resin or urethane prepolymer, such as epoxy resin, unsaturated polyester resin, urethane resin, phenol resin, uricaria resin, or melamine resin.
スチレンモノマー、メタクリルエステルモノマー等の重
合もしくは縮合可能なプレポリマー。Prepolymers that can be polymerized or condensed, such as styrene monomers and methacrylic ester monomers.
オリゴマー、七ツマー等の硬化性物質を主体として所望
なればこれに炭酸カルシウム、水酸化アルミニウム、プ
ラスチック粉等の充填材、硬化触媒等を混合した混合物
からなる。基板（３）の孔（３１ＢＫ該硬化性パテ（４
）を充填するには例えば第４図に示すようなリバースロ
ールコータ−（５）、その（１！１ナイフコーター等が
用いられる。It consists of a mixture consisting mainly of curable substances such as oligomers and hexamers, and if desired, fillers such as calcium carbonate, aluminum hydroxide, plastic powder, and curing catalysts. Hole of substrate (3) (31BK) The hardening putty (4
), for example, a reverse roll coater (5) as shown in FIG. 4, its (1!1 knife coater), etc. are used.
基板（３）の孔（３）Ｂに硬化性パテ（４）を充填した
後は常温もしくは加熱によって硬化性パテ（４）を硬化
せしめる。その後表面を平滑化するために研摩してもよ
い８また（＋９ｉ化性パテ（４）は基板（３）の裏面か
らも充填してもよい。After filling the holes (3) B of the substrate (3) with the curable putty (4), the curable putty (4) is cured at room temperature or by heating. Thereafter, the surface may be polished to make it smooth.Also, the putty (4) having an i-forming property (4) may also be filled from the back side of the substrate (3).
本発明は上記構成を有するから基板は繰返し使用が出来
、基板の孔に充填１．／これを塞ぐ硬化性パテの小量が
再生に必要とされるのみであり、材料費が大ｒｔｌＫ節
減される、Since the present invention has the above configuration, the substrate can be used repeatedly, and the holes in the substrate can be filled. /Only a small amount of hardening putty to plug this is required for regeneration, resulting in a large material cost saving,
第１図はパネル孔明は状態の側面図、第２図は基板を用
いたパネル孔明は状的の側面図、第３図以下は本発明の
一実施例を示すものであり、第３図は使用後の基板平面
図、第４図ｒｔ基板の孔に硬化性パテを充填する工程を
示す模式側面図である。
図中、（１）・・・・パネル、（３）・・基板、（３）
Ｂ・・・・孔、（４）・・・・硬化性パテFig. 1 is a side view of the state of the panel perforation, Fig. 2 is a side view of the state of the panel perforation using a substrate, Fig. 3 and the following show an embodiment of the present invention; FIG. 4 is a plan view of the substrate after use; FIG. 4 is a schematic side view showing a step of filling holes in the rt substrate with hardening putty. In the figure, (1)... Panel, (3)... Board, (3)
B...hole, (4)...hardening putty
Claims (1)
された基板の孔部分に硬化性パテを充填１７硬化せしめ
ることを特徴とするパネル孔明は用基板の再生方法A method for recycling a substrate for panel drilling, which comprises stacking panels on a substrate and drilling holes, and then filling the holes in the drilled substrate with hardening putty (17) and curing the putty.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1773983A JPS59143390A (en) | 1983-02-04 | 1983-02-04 | Method of regenerating substrate for perforating panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1773983A JPS59143390A (en) | 1983-02-04 | 1983-02-04 | Method of regenerating substrate for perforating panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59143390A true JPS59143390A (en) | 1984-08-16 |
| JPS6332561B2 JPS6332561B2 (en) | 1988-06-30 |
Family
ID=11952109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1773983A Granted JPS59143390A (en) | 1983-02-04 | 1983-02-04 | Method of regenerating substrate for perforating panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59143390A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6353627U (en) * | 1986-09-29 | 1988-04-11 | ||
| JPH05237799A (en) * | 1992-02-26 | 1993-09-17 | Kitamura Valve Seizo Kk | Preventing method of burr generation in drilling |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259544A (en) * | 1992-03-10 | 1993-10-08 | Fujitsu Ltd | Laser diode drive circuit |
-
1983
- 1983-02-04 JP JP1773983A patent/JPS59143390A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6353627U (en) * | 1986-09-29 | 1988-04-11 | ||
| JPH052253Y2 (en) * | 1986-09-29 | 1993-01-20 | ||
| JPH05237799A (en) * | 1992-02-26 | 1993-09-17 | Kitamura Valve Seizo Kk | Preventing method of burr generation in drilling |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6332561B2 (en) | 1988-06-30 |
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