JPS59140398A - Surface treatment of al or al alloy - Google Patents

Surface treatment of al or al alloy

Info

Publication number
JPS59140398A
JPS59140398A JP1360583A JP1360583A JPS59140398A JP S59140398 A JPS59140398 A JP S59140398A JP 1360583 A JP1360583 A JP 1360583A JP 1360583 A JP1360583 A JP 1360583A JP S59140398 A JPS59140398 A JP S59140398A
Authority
JP
Japan
Prior art keywords
electroless plating
metal
micropores
alumite
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1360583A
Other languages
Japanese (ja)
Other versions
JPH0245704B2 (en
Inventor
Masaru Yanagida
柳田 賢
Shingo Tonerikawa
真吾 舎川
Satoshi Kawai
川合 慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METARETSUKUSU KK
Pilot Precision KK
Original Assignee
METARETSUKUSU KK
Pilot Precision KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METARETSUKUSU KK, Pilot Precision KK filed Critical METARETSUKUSU KK
Priority to JP1360583A priority Critical patent/JPS59140398A/en
Publication of JPS59140398A publication Critical patent/JPS59140398A/en
Publication of JPH0245704B2 publication Critical patent/JPH0245704B2/ja
Granted legal-status Critical Current

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  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)

Abstract

PURPOSE:To obtain a metallic film having a very high covering rate and superior adhesive strength to an anodic oxide film by applying an electroless plating method as a method for depositing a metal in the micropores in the anodic oxide film of an Al material. CONSTITUTION:Al or an Al alloy is anodically oxidized to form a porous anodic oxide film. Catalytic nuclei for electroless plating are formed in the micropores in the oxide film. For example, a metal acting as the catalytic nuclei is electrochemically deposited in the micropores by a secondary electrolytic coloring technique. After forming the catalytic nuclei, electroless plating is carried out in a bath for depositing Ni-P, Ni-B or the like. Electroless plating starts from the bottoms of the micropores and progresses. The deposited metal fills perfectly the micropores and covers the whole oxide film.

Description

【発明の詳細な説明】 この発明は、Al又はA1合金(以ドAlと称する)の
陽極酸化反映(以ドアルマイト皮験と称する)の微細孔
に無這解メッキ′する方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for non-degradable plating of fine pores in anodized aluminum (hereinafter referred to as alumite coating) of Al or Al alloy (hereinafter referred to as Al). .

従来よりアルマイト皮膜の微細孔に金属を唯積させる方
法としていわゆる2次覗解着色技術は広く利用さ′h2
てbる。この方法はAlを#極酸化処理し、多孔性アル
マイト皮膜を生成させたのち、金M塩を含む浴液中で電
解し、〆電気化学的にアルマイト皮l漢の微細孔に金属
をtO泥せるいわゆる廓方法による析出金属は、孔底っ
まりバリア一層の上にのみ存在し、析出金属で孔を埋め
尽すまでには至らず、水紫ガス元生による反映破壊を起
し易い。金属表面5 ffi VOL24 、323 
、とVOL7.22  ニよれば微細孔全体を析出金属
で埋め尽す検討が行なわれているが、陽惟岐化■圧がa
V以上となると。
Conventionally, the so-called secondary coloring technique has been widely used as a method of accumulating metal in the micropores of an alumite film.
Tebru. In this method, Al is subjected to polar oxidation treatment to form a porous alumite film, and then electrolyzed in a bath solution containing gold salt. The precipitated metal produced by the so-called wafer method exists only at the bottom of the pore and above the barrier layer, and the pore is not completely filled with the precipitated metal, which tends to cause reflection failure due to the generation of water-purple gas. Metal surface 5 ffi VOL24, 323
According to VOL 7.22 D, a study is being conducted to fill the entire micropores with precipitated metal, but if the pressure is a
When it becomes more than V.

金属の被覆率が隋めて悪Aという結果になっている。又
、同じく金属表面技術VOL33 、232では、これ
らのことを考1絋し、バリア一層を除去したのち微細孔
に金属を析出させることが検討さnているが、バリア一
層を除去するということは、 AI素材とアルマイト皮
膜との間の密着性を者しく悪(するばかりでなく、太材
A1と釘出金購との間でガルパニック腐賞を起こし、耐
食性が極めて劣化するという欠点を有している。2次亀
解着色浴にSn系浴を用いて覗解をつづけると、しばし
ば微細孔全体を析出金礪が埋め尽くシ、ざらに嘱解をつ
づけ材 るとアルマイト皮J1典表面にまで析出金属で檀われる
現象が見かけられる。しかしながら、従来のこのような
2次厩解肴色を利用した方法では、アルマイト皮に’A
と析出した金鵡との密着は極めて悪い。
The metal coverage was low and the result was A. Also, in the same Metal Surface Technology VOL 33, 232, taking these matters into consideration, it is considered that the metal is deposited in the micropores after removing the barrier layer, but it is not possible to remove the barrier layer alone. Not only does it seriously deteriorate the adhesion between the AI material and the alumite film, but it also has the disadvantage of causing galvanic corrosion between the thick lumber A1 and the nail drawer, resulting in extremely poor corrosion resistance. When a Sn-based bath is used as the secondary coloring bath and continued plating is carried out, the entire fine pores are often filled with precipitated gold, and the surface of the anodized aluminum J1 layer is kept as a result of continued plating. However, in the conventional method using such a secondary alumite color, 'A' is visible on the alumite skin.
The adhesion to the precipitated gold parrot is extremely poor.

その理由は、恐らく析出金属がデンドライト的に析出す
るためと考えられ、アルマイト皮膜表面なアルマイト皮
膜の微細孔に無電解メッキする方法を見い出し、これを
完成するにφつたのである。
The reason for this is probably that the deposited metal precipitates in a dendritic manner, and we discovered a method of electroless plating into the fine pores of the alumite film on the surface of the alumite film, and completed this process.

即ち、この発明はA1又はA1合金を陽WAOI化処理
(2,多孔性陽極酸化皮膜を生成する第1工程と。
That is, the present invention provides an anodic WAOI treatment of A1 or A1 alloy (2, a first step of forming a porous anodic oxide film).

多孔性陽極酸化皮膜の微細孔に、無電解メッキの触媒(
亥を生成する第2の工程と、ついで無電解メッキする第
3の工程とから成る表面処理方法であり、上記方法によ
り皮膜破壊を生ぜず、被覆率が輸めて良<、シかもアル
マイト皮l!々との密着に優れた金属皮嗅が得られるな
ど、徨々の優〕tた点を有するものである。
Electroless plating catalyst (
This is a surface treatment method consisting of a second step of producing alumite, and a third step of electroless plating. l! It has some advantages over other products, such as the ability to obtain a metallic skin scent that has excellent adhesion to the skin.

次にこの開明を詳細に説明する。まず第1の1wI極酸
化処理として、 Alを陽極酸化処理する処理浴は通常
の硫鍍浴に代表される無機酸浴、シュウ酸に代表される
佇機酸蔭、又はこれらの混nり浴等すづれを用いてもよ
い。1吏用するべ流/11:通常用いられる1区流、交
流、交直爪受等すづれでもよく、砒流回復法、奄流反伝
法、パルス軍流法などを用いてもよい。ulJち公知の
A1の陽極酸化処理法でよい。
Next, this invention will be explained in detail. First, as the first 1wI anodic oxidation treatment, the treatment bath for anodizing Al is an inorganic acid bath represented by a normal sulfur bath, a sulfur acid bath represented by oxalic acid, or a mixed bath of these. You may also use equal distances. 1st flow/11: The normally used one-section flow, alternating current, AC/DC claw catch, etc. may be used, and the helical flow recovery method, torrent flow countercurrent method, pulse force flow method, etc. may also be used. The well-known anodic oxidation method A1 may be used.

次に第2工程として、無電解メッキの#l!媒核をアル
マイト皮@grm孔中に生成させる。触媒1亥の生成方
法としては次のような3通りが考えられる。
Next, as the second step, electroless plating #l! A nucleus is generated in the alumite skin @ grm hole. The following three methods can be considered for producing the catalyst 1.

(1) いわゆる湿式不尋体メッキに利用されている方
法で、1場極酸化処理した被処理物を壜化第1賜−塩酸
溶液中に浸漬し、ノ薔化第1賜をアルマイト皮1漠微6
d孔に吸着させ、ついで被処理物を塩化パラジウム−塩
ばj6液又は硝酸。
(1) In a method used in so-called wet amorphous body plating, a workpiece that has been subjected to one-place polar oxidation treatment is immersed in a bottled No. 1 product-hydrochloric acid solution, and the no. vague 6
The material to be treated is adsorbed into the holes d, and then the material to be treated is mixed with palladium chloride-chloride solution or nitric acid.

銀溶液などの負金属塩溶液中に浸漬し、こり。Immerse it in a negative metal salt solution such as a silver solution to remove stiffness.

らのtイ金属塩な、L原電第1賜の還元作用により賞金
属にまで爾元し、触/Jx:亥とする方法。
A method of converting metal salts into prize metals through the reducing action of the L atomic power plant and converting them into metals.

+21  硝酸パラジウム、又はイ萌岐≦磯と1八つだ
責今娯4 Ill M中に嶋愼「液化処理した被処43
ト物な浸ylL、、It金属塩をアルマイト皮1y:4
鐵・副孔に眼前させる。ついで加PA等の手段を用いて
これらの鳩を分解させ、碓金y4 i:錆を金属にまで
還元し触媒核とする方法。
+21 Palladium nitrate, or I Moeki ≦ Iso and 18 Tsuda responsibility now entertainment 4 Ill M Naka Shin Shima "Liquified treatment 43
Immersion of metal salt into alumite skin 1y:4
The iron and secondary holes are in front of you. Then, these pigeons are decomposed using a method such as APA, and the rust is reduced to metal and used as a catalyst nucleus.

f3)2次4解舊色技前を利用した方法で、アルマイト
皮、漠生成後に眠気化学的に、アルマイト皮膜做細孔に
触媒核となり得る金属を′は析させる方法。
f3) A method that utilizes a secondary 4-dissociation color technique to form an alumite skin and then chemically precipitate metals that can become catalyst nuclei in the pores of the alumite film.

以上いづハ、の方法を用いてもよいが特に(3)の方法
が好ましいつつまり、電気化字面に電析させることによ
り、倣・誦孔孔底即ちバリアーノ帝の上に触媒1亥が生
成されるため、無く解メッキをすると微細孔孔妖より無
電解メッキが開始される。無電解メッキにより析出した
金属(μFメッキ金媛と称する)は、政細孔孔IA:よ
り成長してゆき、ついに(・ま鍼訓孔全体を埋め尽すに
至る。さらに無電解メッキをつづけると、メッキ金属l
は倣、紬孔より5斂れ出し、つい[ハアルマイト皮膜表
面全体をメッキ金属が瞳ってし1つ。このときのアルマ
イト皮膜とメッキ金鳴皮11勺の密4は非常によ層。1
801Q:折り曲げテスト、熱衝撃テストの結果全く異
常はなかった。恐らく、帷めてアンカー効果が強いため
と推察される。
Although the method (3) above may be used, the method (3) is particularly preferable. In other words, by electrodepositing on the electrified surface, a catalyst is formed at the bottom of the imitation hole, that is, on the surface of Barriano. Therefore, if electrolytic plating is performed without electrolytic plating, electroless plating will start from the micropores. The metal deposited by electroless plating (referred to as μF plated gold) grows further and finally fills the entire acupuncture hole.If electroless plating is continued further, , plated metal
The plated metal protrudes from the pongee hole, and then the plated metal pierces the entire surface of the alumite film. At this time, the density of the alumite film and the plated metal skin was very thick. 1
801Q: There were no abnormalities as a result of the bending test and thermal shock test. This is probably due to the overall strong anchoring effect.

仄に触媒核を生成さぜた後、第3工程として無電解メッ
キをするのであるが、無電解メッキ浴は通常の浴が使用
できる。たとえばNi−’P 、 Ni −B 。
After slightly generating catalyst nuclei, electroless plating is performed as the third step, and a normal electroless plating bath can be used. For example, Ni-'P, Ni-B.

Ni −00、Co −P 、 Cu 、等を析出する
浴の他q!rrv合金メッキ浴がある。しかしながらア
ルマイト反物は一般的にアルカリに対し弱いため、中性
〜酸性のPHjdのメッキ浴が好ましい。
In addition to the baths that precipitate Ni-00, Co-P, Cu, etc. There is an rrv alloy plating bath. However, since alumite cloth is generally weak against alkalis, a plating bath with a neutral to acidic PHjd is preferred.

無電解メッキ凌け+ltl常側孔処理をする。目的によ
ってはメッキ金属がアルマイト皮flIt’!表面全体
を榎ってしまうこともあり、このような場合には刺孔処
理する必要はない。
Exceeds electroless plating + always performs side hole treatment. Depending on the purpose, plated metal may be alumite skin flIt'! Sometimes the entire surface is pierced, and in such cases there is no need to puncture.

この弁明は、アルマイト皮J蘭の微細孔に無ぺ解メッキ
を利用して、単体全屈や脅金を析出させる方法で1次の
ような利点を有し工業的作用効果が大きい。
This explanation is based on the method of using non-penetrating plating in the fine pores of alumite skin and depositing black metal on a single body, which has the following advantages and has great industrial effects.

l 無電解メッキを利用してアルマイト皮膜倣細孔に金
属を析出させるため1反映破壊は司らない。
l Electroless plating is used to deposit metal into the pores of the alumite film, so 1-reflection failure does not occur.

2 バリア一層は厚くてもよく、アルマイト皮膜と素材
Alとの密着は極めてよい。又、ガルバニック腐蝕り問
題もない。
2. The barrier layer may be thick, and the adhesion between the alumite film and the material Al is extremely good. Also, there is no problem of galvanic corrosion.

3 アルマイト皮1哄衣而が析出金属で覆われた4合の
アルマイト反映と、析出金属との密着性が愉めて良好で
ある。
3. The alumite skin is covered with the precipitated metal, reflecting the alumite, and the adhesion with the precipitated metal is very good.

以上のように品貞を決める根本的な点で非常に。As mentioned above, it is very fundamental in determining moral character.

優れており、更にたとえば (1)  アルマイト皮膜表面を無電解メッキの析出金
属で柑ったのち通常の電気メッキをすることができ、従
来のZn置換法によるAl上のメッキよりもj・よるか
に信頼性が高いメッキ法である。
Furthermore, (1) the surface of the alumite film can be coated with deposited metal by electroless plating and then subjected to normal electroplating, which is better than plating on Al using the conventional Zn substitution method. This is a highly reliable plating method.

t’21  上記のように、非常に布屑性のよいメッキ
皮暎が得られることからメツキマタ属上に半田付けを行
なっても、加熱による皮膜の剥離は皆無である。
t'21 As mentioned above, since a plating film with very good scraping property is obtained, even when soldering is performed on a metal plate, there is no peeling of the film due to heating.

(3)  無電解メッキの特色の一つである反膜厚みの
均一性は、そのまま色調の均一1生がよいことにつなが
る。従来2次電P!6着色の場合は均一な色調を侍るた
めに、討1嗅とのイ立・は関係からラッキングの方法や
投入位tt vc 1Htlj限があり。
(3) The uniformity of the film thickness, which is one of the characteristics of electroless plating, directly leads to a uniform color tone. Conventional secondary power P! In the case of 6-coloring, in order to achieve a uniform color tone, there are limits to the racking method and input position due to the relationship with the color.

生産性を債ねていたが、いわゆる鮨なりラッキングがD
I能となり、生産性の同上ができる。
Productivity was a concern, but the so-called sushi racking was D.
This will improve productivity and improve productivity.

(4)  無電解メッキのその他の特性としての耐皐耗
性、耐食性はアルマイト皮1鵡との相乗効果としてより
一増向上する。
(4) Other properties of electroless plating, such as wear resistance and corrosion resistance, are further improved as a synergistic effect with alumite coating.

(5)  メッキ金属として無4解磁注メツキを用いる
と、篩性毛磁気記婦材や1%性のよい一イ磁葭−1酋収
材ができる。
(5) When non-decomposition-free plating is used as the plating metal, phloem-like magnetic material and 1-1 porcelain material with good 1% property can be produced.

等の循々の利点が挙けらrLる。There are many benefits such as:

次に実IM例を示す 冥1Utltkリ 1 J工S工0’7QA1磨き板材(1oOX200XO,
5t)[,1に学1υF摩を含む通常の前処理を行ない
、ト記宋件にて膜厚A?す5〜6μの多孔1生アルマイ
ト皮−を生成させた。光沢の優れたアルシマイト皮1°
1濤が1iられた。
Next, an actual IM example is shown.
5t) [, 1 was subjected to normal pretreatment including 1υF, and the film thickness was A? A raw alumite skin with pores of 5 to 6 microns was produced. High-gloss alumite skin 1°
1t was 1i.

1揚襖認化処理采注 cl〈)、   ンr=          2 0 
〜2 2  ℃亀屏粂件  D OIA/am’定電流
電屏定電流電分 時間20分条件にて2次・4解着色を行ない、アルシマ
イト皮・塵の做・1孔に倣癒のNi/f電析させた。
1 Upgrading fusuma recognition processing order cl〈), n r = 2 0
〜2 ℃                                                                    /f was deposited.

1合  7温       24〜26 ℃d屏条件 
 なじみ時間     1分スロースタート時間 1分 A、c!l’i’v定覗圧・板解 屈解時間 17Vl麦30秒 次にN1−Pの無電解メッキをド記条注で行ノよった。
1 cup 7 temperature 24-26℃ d folding conditions
Break-in time: 1 minute Slow start time: 1 minute A, c! l'i'v constant viewing pressure/plate unraveling time 17Vl 30 seconds Next, electroless plating of N1-P was performed as noted below.

とし府負荷が1.0d771/lとなるよう調整した。The load was adjusted to 1.0d771/l.

(ここでニムデン5× :純水=1:5浮鍍比である) 浴 縞   80〜85℃ PH4,3〜4.5 処理時間  30分 30分の処理でアルマイト皮膜表面をもN1−f’のメ
ッキ皮膜が4つだ。ついでN1−Pメ・ツキ皮;喚上に
レベリング作用の犬さい1m常の亀気尤パ鋼メ゛ツキを
8μ被1.3i シ、’=[気光υ〈141メ゛ンキを
IUμ、装y小りロムメ′ンキケ0.2μという)1撞
((被者した。1800の折り曲げテストの結宋、アル
シマイト皮膜泰面とメッキ反;哄との間での刺部は皆無
゛eあ番〕。
(Here, Nimden 5×: Pure water = 1:5 buoyancy ratio) Bath Stripes 80-85°C PH4, 3-4.5 Treatment time 30 minutes After 30 minutes of treatment, the surface of the alumite film was also N1-f' There are four plating films. Next, N1-P mesh skin; 1.3μ of regular 1m-sized steel mesh with a leveling effect was applied to it,' = [Kikou υ〈141 metal with IUμ, There were no small cracks (0.2μ) between the alumite film surface and the plating surface. ].

メッキ層間の剥1帷も/よい。(酵4で反射のよい反@
鏡が肖られた。) 実〃イa七り′リ メジ Jより108L)Al板材(100XI O(JXo、
3t〕に+P!l盾のifJ処珪?rテない、F記条件
にて暎厚ボJ7〜8μの◆孔性アルマイト反映を侍だ。
The peeling between the plating layers is also good. (Anti @ with good reflexes in fermentation 4)
The mirror was reflected. ) 108L from Meji J) Al plate material (100XI O (JXo,
3t]+P! L shield ifJ treatment? ◆ Porous anodized aluminum with a thickness of J7 to 8μ is reflected under the conditions described in F.

r合 温   18〜20℃ 屯4乗件  D O1,5tyya、、(、時間20分
バリア一層を均一化するため通常の中間処理を行ない、
−F記粂)’f” Kでアルマイト皮1漢の倣細孔中に
1救肩、のA7を市イ汀させた。
Temperature: 18-20℃ D O: 1,5tyya, (, Time: 20 minutes Perform normal intermediate treatment to make the barrier layer uniform,
-F 粂)'f'' K was used to place 1 piece of A7 into the imitation pore of 1 piece of alumite skin.

陪 温   23〜26℃   1分 准解条注  なじみ時10J     1分スロースタ
ート時間 ACIOV定イ圧這解とし、10 Vで20秒゛ポ解 つめで下記栄往にて、N1−Bの無電解メッキを行なっ
て。
Temperature: 23-26°C 1 min. Perform plating.

浴組成   BBLニッケル(上付工貰1沫袈)原液に
て所用し、イ合負荷をldm71とした。
Bath Composition: BBL nickel (1 coated) was used as an undiluted solution, and the combined load was 1dm71.

浴温 60〜65℃ PH6,8〜7.0 処理時間  60分 60分の処理で均一な色調の黒色のアルマイト皮膜が侍
られた。この皮膜を倣少硬、1研計で測定したところ、
Hv50υ〜6oo、y示し4f質化した皮膜となった
Bath temperature: 60 to 65°C PH: 6.8 to 7.0 Treatment time: 60 minutes A black alumite film with a uniform color was obtained after 60 minutes of treatment. When this film was measured with a copying and hardening machine, it was found that
The film showed Hv50υ to 6oo,y and had a 4F quality.

寿施ヴIJ 3 J  I  S  1 1  U  OA14反材 (
1o  ox  l o  o’xo、5t)に通常の
前処理を行ない、r記粂件にて2〜3μの多孔性アルマ
イト皮膜を倚た。
Susev IJ 3 J I S 1 1 U OA14 anti-material (
10 ox l o o'xo, 5t) was subjected to the usual pretreatment, and a porous alumite film of 2 to 3 μm was coated on it under the conditions of r.

浴  温     21°〜29℃ 電m=s件  A CI OOpJ、、:時 間  1
0分 ライで′(0112と同様に中間処理を行ない、ド記榮
件にてアルマイト反−1慮aB孔中に1咲−1の0u(
i?ilj:vI−させ7b5 a;    7〕清        23〜26 ℃C
毬解乗t′I:   なじみ1チ存1川     1分
スロースタート時1i−il 1分 AC!13V定心圧、i解とじ13V で30秒鷹解 ついでド記宋注にて(Ji−Sn −Pの無電解メッキ
な行なった。
Bath temperature 21° to 29°C Electric m=s A CI OOpJ, : Time 1
0 minute lie' (0112, same intermediate treatment, 1 Saki-1 0u (
i? ilj:vI-7b5a; 7] Clear 23-26 °C
Mari Kaijo t'I: Familiar 1 chi exist 1 river 1 minute slow start 1i-il 1 minute AC! Electroless plating of Ji-Sn-P was performed at 13V constant pressure, 13V for 30 seconds, and then electroless plating of Ji-Sn-P.

m 温   85〜90′C PH4,5 時 間   30分 30分の処理でアルマイト皮膜表頭をも、Ni−8n−
P7)メッキ金、鳴1父11りlで(衰わ1した。この
Ni−8n −Pメッキ皮膜に半田付けを行7:つだと
ころ、メッキ制禰皮膜とアルマイト、支7腿との剥I4
もなく、良好な半田付けがで宅yc。
m Temperature: 85-90'C PH: 4.5 Hours: 30 minutes After 30 minutes of treatment, the surface of the alumite film also became Ni-8n-
P7) Plated gold, 11 ml (faded).Solder to this Ni-8n-P plating film. I4
Good soldering is possible even at home.

特許出頓人  パイロットプレシジョン株式会社り米弐
法イ上メタレツクス
Patent developer Pilot Precision Co., Ltd.

Claims (1)

【特許請求の範囲】 1、  AI又はA1合金を1@ 倹2化処理し1 多
孔性陥極酸化皮膜を生成する第1の工程と、多孔性璃極
酸化皮嘆のO1I細孔中に、無成解メッキの触媒核を生
成する第2の工程と、ついで無峨解メッキをするプ(3
の工程とから成るA1又はA1合金の辰i■i処理方法
。 2Jす(媒イ亥を生成きせる第2の工程が、微細孔に倣
吋の触媒核を電気化学的に覗析させる方法であることを
特徴とする特許請求の範囲第1項記載のAl又はA1合
金の表面処理方法。
[Claims] 1. A first step of processing AI or A1 alloy to form a porous oxidized film; The second step is to generate catalyst nuclei for non-chemical plating, and then the step (3) for non-chemical plating.
A method for treating A1 or A1 alloy with the following steps: 2J (Al) or Surface treatment method for A1 alloy.
JP1360583A 1983-01-28 1983-01-28 Surface treatment of al or al alloy Granted JPS59140398A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1360583A JPS59140398A (en) 1983-01-28 1983-01-28 Surface treatment of al or al alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1360583A JPS59140398A (en) 1983-01-28 1983-01-28 Surface treatment of al or al alloy

Publications (2)

Publication Number Publication Date
JPS59140398A true JPS59140398A (en) 1984-08-11
JPH0245704B2 JPH0245704B2 (en) 1990-10-11

Family

ID=11837860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1360583A Granted JPS59140398A (en) 1983-01-28 1983-01-28 Surface treatment of al or al alloy

Country Status (1)

Country Link
JP (1) JPS59140398A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184998A (en) * 1984-10-03 1986-04-30 Sony Corp Diaphragm for acoustic device
FR2695653A1 (en) * 1992-09-17 1994-03-18 Rieger Franz Metallveredelung Bath for the pretreatment of light metals.
JP2002505379A (en) * 1998-02-26 2002-02-19 フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ Coating systems for corrosion-resistant coatings and substrates composed of light metals
CN101914798A (en) * 2010-07-29 2010-12-15 南昌航空大学 Method for improving fatigue strength after microarc oxidation of aluminium alloy
WO2024075513A1 (en) * 2022-10-03 2024-04-11 日本軽金属株式会社 Plated member and method for producing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123789A (en) * 1982-12-27 1984-07-17 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Treatment for plating aluminum body to be treated having anodic oxidized film

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59123789A (en) * 1982-12-27 1984-07-17 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション Treatment for plating aluminum body to be treated having anodic oxidized film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184998A (en) * 1984-10-03 1986-04-30 Sony Corp Diaphragm for acoustic device
FR2695653A1 (en) * 1992-09-17 1994-03-18 Rieger Franz Metallveredelung Bath for the pretreatment of light metals.
BE1008295A5 (en) * 1992-09-17 1996-04-02 Rieger Franz Metallveredelung Bath for light metal pretreatment.
JP2002505379A (en) * 1998-02-26 2002-02-19 フラウンホーファー−ゲゼルシャフト ツル フェルデルング デル アンゲヴァンテン フォルシュング エー ファウ Coating systems for corrosion-resistant coatings and substrates composed of light metals
CN101914798A (en) * 2010-07-29 2010-12-15 南昌航空大学 Method for improving fatigue strength after microarc oxidation of aluminium alloy
WO2024075513A1 (en) * 2022-10-03 2024-04-11 日本軽金属株式会社 Plated member and method for producing same

Also Published As

Publication number Publication date
JPH0245704B2 (en) 1990-10-11

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