JPS59136494A - Plating method for inner surface of hollow body - Google Patents

Plating method for inner surface of hollow body

Info

Publication number
JPS59136494A
JPS59136494A JP1115883A JP1115883A JPS59136494A JP S59136494 A JPS59136494 A JP S59136494A JP 1115883 A JP1115883 A JP 1115883A JP 1115883 A JP1115883 A JP 1115883A JP S59136494 A JPS59136494 A JP S59136494A
Authority
JP
Japan
Prior art keywords
plating
hollow body
hollow object
electrode
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1115883A
Other languages
Japanese (ja)
Inventor
Shingo Ishiguro
石黒 信吾
Satoru Takano
悟 高野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP1115883A priority Critical patent/JPS59136494A/en
Publication of JPS59136494A publication Critical patent/JPS59136494A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To apply excellent plating onto the inner surface of a hollow body, by sealing both ends of the hollow body into which an electrode is inserted with covers through which both ends of the electrode liquid-tightly thrust, and circulating a plating solution through an inlet provided at one cover and an outlet provided at the other cover. CONSTITUTION:A hollow body 10 is supported with a stand 11, and an electrode 12 is inserted into said hollow body 10. Thereafter, covers 13, 13' are attached to both ends of the hollow body 10, and the parts of the hollow body 10 connected to the covers 13, 13' are liquid-tightly sealed. Lead wires 12 for applying an electric current are connected to the projected parts of the electrode 12 at its both ends. Thereafter, a plating solution inside a tank 15 for a plating solution is circulated in the course of an opening 13b provided at the cover 13 the interior of the hollow body 10 an opening 13b' provided at the cover 13' by a circulating pump 16. At the same time, an electric current is applied for a predetermined time while holding the electrode 12 as an anode and the hollow body 10 as a cathode, to form a plating layer on the inner surface of the hollow body 10.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、中空物の内面にメッキ層を形成するだめの
方法、特に長尺中空物の内面メツ−t−1とおいて多大
の効果を発揮する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Industrial application field The present invention has great effects on the method of forming a plating layer on the inner surface of a hollow object, especially in the inner surface layer-t-1 of a long hollow object. Concerning how to demonstrate.

叩) 従来技術 従来、パイプ等の中空物内面にメッキを施す場合、第1
図(こ示すよう(こ、中空物1を陰極、中空物の内面(
こ対し均等の距離を保って挿入した溶解性@極2、を陽
極とし、こ7とを処理槽3内のメッキ液中に浸l貨して
通礪し、中空物内面にメッキ層を生成する方法が採られ
ていた。
Prior Art Conventionally, when plating the inner surface of a hollow object such as a pipe, the first
(As shown in this figure, the hollow object 1 is used as the cathode, and the inner surface of the hollow object (
The soluble @electrode 2 inserted at an equal distance from the other electrode is used as an anode, and is immersed in the plating solution in the processing tank 3 to form a plating layer on the inner surface of the hollow object. A method was adopted to do so.

曾→ 発明が解決しようとする問題点 しかしながら、上記の方法は、 ■中空物が長尺になると大型の処理槽が必要(こなるだ
め、殖解脱脂、屯解酸洸、ド池メンキ、本メッキ等に利
用する処理液や水洗水の使用量が非常番こ多くなり、ま
だ、それに伴なって多量の廃液が発生し、設備の占有面
積も大きくなる。
澾→ Problems to be solved by the invention However, the above method requires a large treatment tank if the hollow object becomes long (Konarudame, exfoliation and degreasing, Tunke Sanko, Doike Menki, Hon. The amount of processing liquid and rinsing water used for plating, etc. is extremely large, and as a result, a large amount of waste liquid is generated and the area occupied by the equipment is also increased.

■中空物をメッキ液中に完全に浸漬するので、メッキ層
が外面に回り込む恐れがあり、その防止のためには、中
空物の外面シールが必要になる。
■Since the hollow object is completely immersed in the plating solution, there is a risk that the plating layer may wrap around the outer surface, and to prevent this, it is necessary to seal the outer surface of the hollow object.

■表面状態の良好なメッキ層を得るには、メッキ処理時
に発生するV°スを確実lこ除去する必要があるが、仮
に処理槽内のメッキ液を強制環流させても、中空物の内
面に局部的に付脩するV゛ス気泡充分に1余去すること
ができず、従ってメツキネ良が起り易い。
■In order to obtain a plating layer with a good surface condition, it is necessary to reliably remove the V° gas generated during the plating process, but even if the plating solution in the processing tank is forced to circulate, the inner surface of the hollow It is not possible to sufficiently remove the V-space bubbles that are locally attached to the surface of the tube, and therefore, it is easy to cause damage to the surface.

■陽極に溶解性(極を利用しているだめ、償解脱脂から
本メッキ迄の間に使用する処理液の性質壷こ応じた数種
の′4極を必要とし、また、それをいちいち交換しなけ
ればならないので作業能率も低−ドするっ と云った多くの欠点並びに問題点を有する。
■Several types of electrodes are required depending on the nature of the processing solution used from degreasing to main plating, and they must be replaced each time. As a result, there are many drawbacks and problems, such as low work efficiency and low power consumption.

(勾 問題点を解決するだめの手段 この発明は、以上の点に鑑みてなされたもので、内面メ
ッキを行う中空物を処理液の容器の一部として使用する
即ち、内部に(極を挿通した中空物の両端を、上記喉極
の両端が液密に突き抜ける蓋によってシールし、その後
、一方の蓋に9 (rj タ開口を入10、他方の蓋の
開口を出口として中空物内部にメッキ液を循環させなが
らメッキ処理を行うことにより、上記■〜■に記した欠
点並びに問題点を解決したものである。
(Means for Solving the Problems) This invention has been made in view of the above points, and uses a hollow object whose inner surface is plated as a part of a processing liquid container. Both ends of the hollow body are sealed with a lid through which both ends of the laryngeal tube pass through in a liquid-tight manner, and then the inside of the hollow body is plated by inserting the 9 (rj) opening into one lid and using the opening in the other lid as an outlet. By performing the plating process while circulating the liquid, the drawbacks and problems described in items (1) to (4) above are solved.

なお、後で述へる■の欠点の解決手段は、経済効果をよ
り一層高め、かつ作業の簡略化を図る上で好捷しいこと
ではあるが、本願の必須要件ではない。
It should be noted that the means for solving the drawback (2) described later is preferable in terms of further increasing the economic effect and simplifying the work, but it is not an essential requirement of the present application.

以−ド、添付図に基いてこの発明の方法を詳しく説明す
る。
The method of the present invention will now be described in detail with reference to the accompanying drawings.

まず、第2図に示すように、内面メッキを行う中草物1
0を、スタンド11等を利用して支持し、その中に41
412を通す。次に、中空物1oの両端に蓋13.1i
を収付けて中空物と蓋との接合部を液密にシールする。
First, as shown in FIG.
0 using a stand 11 etc., and 41 in it.
Pass 412. Next, cover 13.1i is attached to both ends of the hollow object 1o.
to seal the joint between the hollow object and the lid liquid-tight.

また、(櫃12の端部は、缶蓋1d、13に設けた穴1
3a、13a’から液密に外部に突出させ、そこに通′
催用のリード1家14を接続すると共(こ、@櫃12は
、蓋の穴に通すことによって定位置(こ保持する。以上
の作業が完−rしたら、メッキ液槽15内のメッキ液を
循環ポンプ16により中空物10内に循環させ、同時に
嘔、li返12をIm極、中空物10を陰極として所定
時間通通し、中空物内面メッキ層を生1戎させる。
In addition, (the end of the box 12 is connected to the hole 1 provided in the can lid 1d, 13)
3a, 13a' to the outside in a liquid-tight manner.
At the same time as connecting the event lead 1 house 14 (@the box 12 is held in place by passing it through the hole in the lid). is circulated through the hollow body 10 by the circulation pump 16, and at the same time, the liquid is passed through the tube 12 as an Im pole and the hollow body 10 as a cathode for a predetermined period of time, thereby stripping the inner surface plating layer of the hollow body.

このとき、中空物10は、図のように斜め又は垂直に配
し、下側の蓋に設けた開口13bを入口、」二側の蓋の
開口13bを出口としてメッキ液を焦点させるのが望ま
しく、このようにすると、中空物内面に付債したがス気
泡が液の流れと浮力により効果的ζこ1余去される。尤
も、この発明では、中空物を水平に配した場合も、メッ
キ液の流れを速めることによって力゛ス気泡を1余去で
きる。
At this time, it is preferable that the hollow body 10 is arranged diagonally or vertically as shown in the figure, and the plating solution is focused using the opening 13b provided in the lower lid as an inlet and the opening 13b provided in the second lid as an outlet. In this way, the gas bubbles attached to the inner surface of the hollow object are effectively removed by the flow of the liquid and the buoyant force. However, according to the present invention, even if the hollow object is arranged horizontally, the force bubbles can be removed by speeding up the flow of the plating solution.

また、礪41f12は、溶解性のものであってよいがチ
タン材に自機メッキを施した不溶性嘔極を使用すると、
砿解脱1指、屯解酸洗、下地メッキ、水洗等のOF?処
理を行う場合でも、メッキ液槽16を交換するたけで、
喧4’ft、 12の交換は不要となる。
In addition, the groove 41f12 may be a soluble one, but if an insoluble porcelain made of titanium material is plated in-house,
Is it OF such as 1 finger of copper release, pickling, base plating, and water washing? Even when processing, just replacing the plating liquid tank 16
There is no need to replace the 4'ft and 12's.

この゛1極12は、棒状のほか、中空物の断面形状によ
っては板状にすることもあり、また、蓋13゜13の取
付後(こ中空物内部に挿通してよい。
In addition to being rod-shaped, the pole 12 may be plate-shaped depending on the cross-sectional shape of the hollow object, and may be inserted into the hollow object after the lid 13 is attached.

なお、中空物端部の液封は、例えば、F記の如き構造を
採用して行えばよい。
Note that the liquid seal at the end of the hollow object may be achieved by employing, for example, a structure as shown in F.

即ち、中空物10の外周に第2図に示す如きリング17
を止めねじ18を利用して固定し、このリングに中空物
の軸と平行な締付ボルト19を複数水種Jmする。一方
、蓋ia、isには、それぞれリング17.17に対向
するフランジ13C113Cを設け、この7ラシジにボ
ルト19を止してナツト止めすることで蓋i3.i3を
中空物端面に圧接させる。この際、缶蓋と中空物との接
合部にはシールパツキン20を介在し、また、蓋と′這
極12との間にもシール部材21を介在するのが望まし
い。
That is, a ring 17 as shown in FIG.
is fixed using a set screw 18, and a plurality of tightening bolts 19 parallel to the axis of the hollow object are attached to this ring. On the other hand, the lids ia and is are provided with flanges 13C and 113C facing the rings 17 and 17, respectively, and by fixing the bolts 19 to these 7 radii and tightening them with nuts, the lid i3. i3 is pressed against the end face of the hollow object. At this time, it is desirable to interpose a seal packing 20 at the joint between the can lid and the hollow object, and also to interpose a seal member 21 between the lid and the cover 12.

以−ドに、この発明の実施例を挙げる。Examples of the present invention will be described below.

〔実施例」 刺め(こ配した内径50間、長き500龍のステンレス
パイプの両端に液封のための蓋を収付けた。
[Example] A lid for liquid sealing was installed at both ends of a long stainless steel pipe with an inner diameter of 50 mm and a length of 500 mm.

−方、陽極にはチタン財をこ白新メッキを施した不溶性
の(極を使用1〜、メッキ液をFから上へ循環させなが
ら、水洗/嘔解脱脂/水洸/電解酸洸/水洸/ニッケル
F地メッキ/水洸/の後、a流密度3 A / dm2
、通電30分で無光沢硫酸銅メッキを施した。その際、
蓋は最初から最後迄中空物に固定し、陽極も交換しなか
った。
- On the other hand, the anode uses an insoluble (electrode) coated with a new plating of titanium.While circulating the plating solution from F upwards, wash with water/vomit and degrease/suiko/electrolytic acid/suiko. / After nickel F base plating / water droplet /, a flow density 3 A / dm2
, Matte copper sulfate plating was applied by applying electricity for 30 minutes. that time,
The lid was fixed to the hollow object from beginning to end, and the anode was not replaced.

そのとき使用したメッキ液槽は、1001EI1001
EIIX100 で、メッキ液の量は2,5J?であっ
た。また、メッキ処理完了迄の全作業I″i60分であ
った。
The plating liquid tank used at that time was 1001EI1001
Is the amount of plating solution 2.5J for EIIX100? Met. Furthermore, the entire work up to completion of the plating process took 60 minutes.

その結果、表面状態の安定した均一な厚さのメッキ層を
得ることができた。
As a result, a plated layer with a stable surface condition and a uniform thickness could be obtained.

〔比較例〕[Comparative example]

本発明の効果の確認のため、第1図に示す従来法により
、同一材質、同−太さの7R4プに無光沢硫酸銅メッキ
を施した。そのときのメッキ液槽は、100m×100
yaX l’o OOxで、メッキ液は91必要であっ
た。壕だ、全作業時間は120分を要し、しかも得られ
たメッキ層は同一条件の通電で局部的に気泡によるザラ
ツキが生じ、かつ多少の外面側け)′IJ果 以上の通り、この発明によれば、メッキ液を中空物の内
部にのみ流すため、処理液や水洗水が少量で済み、また
、それに付随する設備も小型でよく、しかも、メッキ層
の中空物外面への回り込みも無くなる。
In order to confirm the effects of the present invention, matte copper sulfate plating was applied to 7R4 plates made of the same material and of the same thickness using the conventional method shown in FIG. The plating liquid tank at that time was 100m x 100m.
With yaX l'o OOx, 91 plating solutions were required. The total work time required 120 minutes, and the resulting plating layer was locally roughened due to air bubbles when energized under the same conditions, and the outer surface was slightly roughened. According to , because the plating solution flows only into the inside of the hollow object, only a small amount of processing solution and rinsing water is required, and the accompanying equipment can be small, and the plating layer does not wrap around the outside of the hollow object. .

丑だ、メッキ液を循環させているので、通屯中に発生す
るか゛ス気泡も効果的に除去され、表面処理状態が安定
する。D°ス気泡の除去は、中空物を剥め又は垂直(こ
配した場合一層確実となる。
Moreover, since the plating solution is circulated, any air bubbles generated during plating are effectively removed, and the surface treatment condition is stabilized. Removal of D° gas bubbles will be more reliable if the hollow object is peeled off or placed vertically.

さらに、1揚碌に不溶性の慰極を使用すれば、螺解脱脂
、蝋解配洸、ド地メッキ、本メッキの各作業を連続的に
行っても′@極を交換する必要がなく、1経済性、並び
に作業能率が一層向上する。
Furthermore, if you use an insoluble electrode for each step, there is no need to replace the electrode even if you perform the operations of screw removal, degreasing, waxing, base plating, and main plating continuously. 1.Economy and work efficiency are further improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のメッキ法を概略的(こ示す図、第2図は
本発明のメッキ法を示す図、第3図は第2図JI[−I
If線に沿った断面図である。 10・・・中空物、12・・・1極、13.13・・・
蓋、15・・・メッキ液槽、16・・・循環ポンプ、2
0・・・シールパツキン、21・・・シール部(オ。 特許出願人  任反電気工業株式会社
Fig. 1 schematically shows the conventional plating method (Fig. 2 shows the plating method of the present invention, Fig. 3 shows Fig. 2 JI [-I
FIG. 3 is a cross-sectional view taken along the If line. 10...Hollow object, 12...1 pole, 13.13...
Lid, 15... Plating liquid tank, 16... Circulation pump, 2
0... Seal packing, 21... Seal part (O. Patent applicant: Ninpan Electric Industry Co., Ltd.

Claims (4)

【特許請求の範囲】[Claims] (1)内部に電極を挿通した中空物の両端を、上記電極
の端部が液密にシールされて外部に突き抜ける蓋によっ
て液密番こシールし、その後、内部電極を陽極、中空物
を陰極として通退し、かつ」二記蓋の一方に設けた開口
を入I口、他方の蓋の開口を出口として内部(こメッキ
液を循環させ、中空物内面にメッキ層を形成することを
特徴とする中空物の内面メッキ方法。
(1) Both ends of the hollow object with the electrode inserted inside are liquid-tightly sealed with a lid that penetrates through the ends of the electrode liquid-tightly sealed, and then the internal electrode is used as the anode and the hollow object is used as the cathode. The opening provided in one of the lids is used as an inlet, and the opening in the other lid is used as an outlet to circulate the plating solution, forming a plating layer on the inner surface of the hollow object. A method for plating the inner surface of hollow objects.
(2)  上記缶蓋を、中空物外周に固定したリングに
係留し、中空物端部を液封することを特徴とする特許請
求の範囲第(1)項記載の中空物の内面メッキ方法。
(2) The method for plating the inner surface of a hollow object according to claim (1), characterized in that the can lid is moored to a ring fixed to the outer periphery of the hollow object, and the end of the hollow object is sealed with liquid.
(3)  上記電極に不溶性電極を使用することを特徴
とする特許請求の範囲第(1)項又は第(2)項記載の
中空物の内向メッキ方法。
(3) The inward plating method for a hollow object according to claim (1) or (2), characterized in that an insoluble electrode is used as the electrode.
(4)  上記中空物を斜め又は垂直に配し、その下側
から」二側に向けてメッキ液を流すことを特徴とする特
許請求の範囲第(1)項乃至第(3)項のいずれかに記
載の中空物の内面メッキ方法。
(4) Any one of claims (1) to (3), characterized in that the hollow object is arranged diagonally or vertically, and the plating solution is flowed from the lower side toward the two sides. A method for plating the inner surface of a hollow object as described in Crab.
JP1115883A 1983-01-24 1983-01-24 Plating method for inner surface of hollow body Pending JPS59136494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1115883A JPS59136494A (en) 1983-01-24 1983-01-24 Plating method for inner surface of hollow body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1115883A JPS59136494A (en) 1983-01-24 1983-01-24 Plating method for inner surface of hollow body

Publications (1)

Publication Number Publication Date
JPS59136494A true JPS59136494A (en) 1984-08-06

Family

ID=11770219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1115883A Pending JPS59136494A (en) 1983-01-24 1983-01-24 Plating method for inner surface of hollow body

Country Status (1)

Country Link
JP (1) JPS59136494A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584428A (en) * 1994-02-08 1996-12-17 Sumitomo Metal Industries, Ltd. Process for manufacturing clad pipe
KR100454475B1 (en) * 2002-03-20 2004-10-28 에이테크솔루션(주) Electroless plating method for the cooling line of injection molding
KR100481564B1 (en) * 1999-10-05 2005-04-08 데이꼬꾸 쓰신 고교 가부시키가이샤 Vibration generator
JP2007169771A (en) * 2005-12-19 2007-07-05 Tadamasa Fujimura Method of plating inside wall of narrow tube and narrow tube manufactured by the same plating method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584428A (en) * 1994-02-08 1996-12-17 Sumitomo Metal Industries, Ltd. Process for manufacturing clad pipe
KR100481564B1 (en) * 1999-10-05 2005-04-08 데이꼬꾸 쓰신 고교 가부시키가이샤 Vibration generator
KR100454475B1 (en) * 2002-03-20 2004-10-28 에이테크솔루션(주) Electroless plating method for the cooling line of injection molding
JP2007169771A (en) * 2005-12-19 2007-07-05 Tadamasa Fujimura Method of plating inside wall of narrow tube and narrow tube manufactured by the same plating method

Similar Documents

Publication Publication Date Title
CN107904632B (en) Electroplating equipment
JPS59136494A (en) Plating method for inner surface of hollow body
US3718547A (en) Continuous electrolytic treatment for cleaning and conditioning aluminum surfaces
CN85103365A (en) The aluminum or aluminum alloy method to produce white film on surface
CN213977940U (en) Auxiliary groove for preventing copper plating of conductive roller at lower side of coating film
CN109137052A (en) A kind of electroplanting device and its electro-plating method of comprehensive coating
US3649477A (en) Electroplating large cylindrical tanks
CN200985363Y (en) Electroplating liquid container
JPS59190383A (en) Method and device for high speed partial plating
CN214327939U (en) Pliers pipe processing is with electroplating device
CN104746115B (en) A kind of micro cell local electroplating device
US4039410A (en) Electrocleaning process
CN113235154A (en) Electro-polishing device and process for semiconductor precursor stainless steel container
JP2726700B2 (en) Metal plate surface treatment equipment
CN109183136A (en) A kind of anode construction of large scale Internal hole plating iron reparation and application
KR100929935B1 (en) Method for manufacturing junction box used in flameproof electric wire piping
JPS623240B2 (en)
JP2008248368A (en) Method of recovering nickel from flush waste water after nickel strike plating
CN210657213U (en) Steel strip electrolysis stripping tank
US6197169B1 (en) Apparatus and method for electroplating rotogravure cylinder using ultrasonic energy
RU2201478C2 (en) Method preparing surfaces of articles of stainless steel before nickel-plating
KR890003587B1 (en) Making method of a grounding bar to coated with copper
JP3355813B2 (en) Electropolishing method for iron alloy lead frame
JP3154012B2 (en) Method and apparatus for cleaning carrier bar power supply section of electrodeposition coating line transport mechanism
CN105088296B (en) The electroplating technology of foam metal