JPS59132694A - Method of assembling electronic part - Google Patents
Method of assembling electronic partInfo
- Publication number
- JPS59132694A JPS59132694A JP658183A JP658183A JPS59132694A JP S59132694 A JPS59132694 A JP S59132694A JP 658183 A JP658183 A JP 658183A JP 658183 A JP658183 A JP 658183A JP S59132694 A JPS59132694 A JP S59132694A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- case
- electronic components
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、電子部品の組立方法に係り、特に多数個取り
方式における電子部品の組立方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for assembling electronic components, and particularly to a method for assembling electronic components using a multi-piece assembly method.
この多数個取り方式は、量産性に優れているという特長
を有している。第1図ないし第6図は、従来のこの種の
組立方法を説明するための図である。This multi-piece manufacturing method has the advantage of being excellent in mass production. 1 to 6 are diagrams for explaining a conventional assembly method of this type.
第1図に示すように比較的広い平板状の基板素体1から
、所定形状のプリント基板2を多数個(この実施例では
4個)打ち抜き、再び平板状の基板累年lに戻す。図中
の3は、プリント基板2を打ち抜いたときの切込み線で
ある。As shown in FIG. 1, a large number of printed circuit boards 2 (four in this embodiment) of a predetermined shape are punched out from a relatively wide flat board body 1, and the board is returned to a flat board shape. 3 in the figure is a cut line when the printed circuit board 2 is punched out.
次に第2図に示すように、例えば抵抗体やコンデンサな
どの電子部品4の端子部5を各プリント基板1にそれぞ
れ挿入し、各端子部5を半田付け6する(第3図参照)
。そして各プリント基板2を基板素体1から個別に分離
しく第4図参照)、そのプリント基板2を第5図に示す
ように逆にしてケース7内に挿入する。8はケース7の
内面に欠設された基板受けで、これによってプリント基
板2の位置決めがなされる。しかるのち第6図に示すよ
うに、プリント基板2の外周部とケース7の内周部とを
半田付け9して、プリント基板2を固定することにより
′成子部品の組立てを完了する。Next, as shown in FIG. 2, the terminal portions 5 of electronic components 4 such as resistors and capacitors are inserted into each printed circuit board 1, and each terminal portion 5 is soldered 6 (see FIG. 3).
. Then, each printed circuit board 2 is individually separated from the circuit board body 1 (see FIG. 4), and the printed circuit board 2 is inverted as shown in FIG. 5 and inserted into the case 7. Reference numeral 8 denotes a board holder cut out from the inner surface of the case 7, by which the printed circuit board 2 is positioned. Thereafter, as shown in FIG. 6, the outer periphery of the printed circuit board 2 and the inner periphery of the case 7 are soldered 9 to fix the printed circuit board 2, thereby completing the assembly of the components.
この多数個取り方式は量産性に優れているが、従来の方
法では工数が多く、作業能率の点で問題がある。Although this multi-piece manufacturing method is excellent in mass production, the conventional method requires a large number of man-hours and has problems in terms of work efficiency.
本発明の目的は、このような従来技術の欠点を解消し、
作業性が良く、生産コストの安価な電子部品の組立方法
を提供するにある。The purpose of the present invention is to eliminate such drawbacks of the prior art,
To provide a method for assembling electronic components with good workability and low production cost.
次に本発明の実施例を第7図ないし第12図を用いて説
明する。第7図は平板状の基板素体11の平面図で、こ
の基板素体11は一つの枠部12と、複数(本実施例で
は4枚)のプリント基板13とから構成されている 前
記枠部12とプリント基板13との間ならびにプリント
基板13どうじの間には、幅狭の連結部14を残して、
区切りのための貫通部15が形成されている。図示して
いないがプリント基板13には、後述の電子部品16を
挿入するための透孔ならびに電子回路を構成するための
導電パターンがそれぞれ設けられている。Next, an embodiment of the present invention will be described using FIGS. 7 to 12. FIG. 7 is a plan view of a flat board body 11, which is composed of one frame 12 and a plurality of (four in this embodiment) printed circuit boards 13. A narrow connecting portion 14 is left between the portion 12 and the printed circuit board 13 and between the printed circuit boards 13,
A penetrating portion 15 for separation is formed. Although not shown, the printed circuit board 13 is provided with a through hole for inserting an electronic component 16 (described later) and a conductive pattern for forming an electronic circuit.
なお、前記連結部14の中間部分には、枠部12をプリ
ント基板13との分離ならびにプリント基板13どうじ
の分離を容易にするため、ミシン目あるいはV溝などの
分離ライン17が設けである。Incidentally, a separation line 17 such as a perforation or a V-groove is provided in the intermediate portion of the connecting portion 14 in order to facilitate separation of the frame portion 12 from the printed circuit board 13 and the separation of the printed circuit boards 13 from each other.
第9図に示すように抵抗体やコンデンサなどの電子部品
16の端子部18が各プリント基板130所に個所にそ
れぞれ挿入され、ついで各プリント基板13にケース1
9が被せられる(第10図参照)。As shown in FIG. 9, terminal portions 18 of electronic components 16 such as resistors and capacitors are inserted into each printed circuit board 130, and then each printed circuit board 13 is inserted into the case 1.
9 is covered (see Figure 10).
ケース19に対向する側壁の間隔は、プリント基板13
の対向する側線の間隔とほぼ一致しており、これによっ
てプリント基板13に対するケース190前後ならびに
左右方向の位置規制がなされる、。The distance between the side walls facing the case 19 is the same as that of the printed circuit board 13.
This substantially coincides with the distance between the opposing side lines of the case 190, thereby regulating the position of the case 190 in the front and back as well as in the left and right directions with respect to the printed circuit board 13.
また嬉8図に示すように側壁には前記基板素体11の連
結部14と対向する位置に切込み20が形成されており
、切込み20の上端面21が連結部14の上面に当接す
ることで、プリント基板13に対するケース19の挿入
寸法が規制される。Further, as shown in FIG. 8, a notch 20 is formed in the side wall at a position facing the connecting portion 14 of the substrate element 11, and the upper end surface 21 of the notch 20 comes into contact with the upper surface of the connecting portion 14. , the insertion dimension of the case 19 into the printed circuit board 13 is regulated.
ケース19を挿入したのち、第11図に示すように電子
部品16の端子部18とプリント基板13との間、なら
びにケース19の内周部とプリント基板13の外周部と
の間を半田付け22し、しかるのちケース付きのプリン
ト基板13を基板素体11から個別に分離して(第12
図参照)電子部品の組立てを完了する。After inserting the case 19, as shown in FIG. Then, the printed circuit board 13 with the case is individually separated from the circuit board body 11 (12th
(See figure) Complete assembly of electronic components.
本発明は阿述のような構成になっており、この組立方法
によれば従来の方法よりも半田付は工程が少なくてすみ
、作業性が良好で、生産コストの安価な電子部品の組立
方法な提供することができる。The present invention has the configuration as described above, and this assembly method requires fewer soldering steps than the conventional method, has good workability, and is a method of assembling electronic components with low production costs. can be provided.
第1図ないし第6図は従来の電子部品の組立方法を説明
するためのもので、第1図は基板素体の平面図、第2図
、第3図、第4i;!!1、第5図、第6図は各組立工
程を説明するためのd子部品の断面図、第7図ないし第
12図は本発明の実施例に係る電子部品の組立方法を説
明するためのもので、第7図は基板Aく体の平面図、給
8図はケースの斜視図、第9図、第10図、第11図、
第12図は各組立工姻ヲ説明するための′4電子品のt
i面図である。
11・・・・・・基板素体、13・・・・・・プリント
基板、14・・・・・・連結部、15・・・・・・貫通
部、16・・・・・・電子部品、18・・・・・・端子
部、19・・・・・・ケース、22・・・・・・半田付
け。Figures 1 to 6 are for explaining the conventional method of assembling electronic components, with Figure 1 being a plan view of the substrate body, Figures 2, 3, and 4i;! ! 1, FIG. 5, and FIG. 6 are cross-sectional views of d-child components for explaining each assembly process, and FIGS. 7 to 12 are cross-sectional views for explaining the assembly method of electronic components according to the embodiment of the present invention. Figure 7 is a plan view of the board A, Figure 8 is a perspective view of the case, Figures 9, 10, 11,
Figure 12 shows the t of '4 electronic parts to explain each assembly process.
It is an i-side view. 11... Board element body, 13... Printed circuit board, 14... Connection part, 15... Penetration part, 16... Electronic component , 18... terminal section, 19... case, 22... soldering.
Claims (1)
ケース端挿入用の貫通部を有する基板素体の各プリント
基板にそれぞれ成子部品を装着し、次に各プリント基板
の前記貫通部にケースの端部を挿入してケースで前記′
成子部品を覆い、ついで電子部品の端子部とプリント基
板の間、ならびにケースの内周部とプリント基板の外周
部との間を半田付けし、しかるのちケース付きのプリン
ト基板を基板素体から個別に分離することを特徴とする
電子部品の組立方法。A component is attached to each printed circuit board of a board element body in which a plurality of printed circuit boards are arranged in series and each printed circuit board has a through part for inserting the case end on the outer periphery, and then a case is inserted into the through part of each printed circuit board. Insert the end of the above in the case′
Cover the parts, then solder between the terminals of the electronic components and the printed circuit board, as well as between the inner periphery of the case and the outer periphery of the printed circuit board, and then separate the printed circuit board with the case from the board body. A method for assembling electronic components, characterized by separating them into two parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP658183A JPS59132694A (en) | 1983-01-20 | 1983-01-20 | Method of assembling electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP658183A JPS59132694A (en) | 1983-01-20 | 1983-01-20 | Method of assembling electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59132694A true JPS59132694A (en) | 1984-07-30 |
JPH0115157B2 JPH0115157B2 (en) | 1989-03-15 |
Family
ID=11642289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP658183A Granted JPS59132694A (en) | 1983-01-20 | 1983-01-20 | Method of assembling electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59132694A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129962A (en) * | 1974-03-18 | 1975-10-14 | ||
JPS5337859A (en) * | 1976-09-18 | 1978-04-07 | Ricoh Kk | Method of producing printed circuit board |
JPS5441468A (en) * | 1977-09-07 | 1979-04-02 | Nippon Electric Co | Method of inserting parts into printed board |
JPS5466470A (en) * | 1977-11-04 | 1979-05-29 | Mitsubishi Electric Corp | Method of dividing printed circuit substrate |
JPS5689277U (en) * | 1979-12-11 | 1981-07-16 | ||
JPS56147500A (en) * | 1980-04-18 | 1981-11-16 | Mitsumi Electric Co Ltd | Board circuit device and method of manufacturing same |
-
1983
- 1983-01-20 JP JP658183A patent/JPS59132694A/en active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50129962A (en) * | 1974-03-18 | 1975-10-14 | ||
JPS5337859A (en) * | 1976-09-18 | 1978-04-07 | Ricoh Kk | Method of producing printed circuit board |
JPS5441468A (en) * | 1977-09-07 | 1979-04-02 | Nippon Electric Co | Method of inserting parts into printed board |
JPS5466470A (en) * | 1977-11-04 | 1979-05-29 | Mitsubishi Electric Corp | Method of dividing printed circuit substrate |
JPS5689277U (en) * | 1979-12-11 | 1981-07-16 | ||
JPS56147500A (en) * | 1980-04-18 | 1981-11-16 | Mitsumi Electric Co Ltd | Board circuit device and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
JPH0115157B2 (en) | 1989-03-15 |
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