JPS59132638U - Conductive foam sheet for fixing integrated circuit boards - Google Patents
Conductive foam sheet for fixing integrated circuit boardsInfo
- Publication number
- JPS59132638U JPS59132638U JP2775283U JP2775283U JPS59132638U JP S59132638 U JPS59132638 U JP S59132638U JP 2775283 U JP2775283 U JP 2775283U JP 2775283 U JP2775283 U JP 2775283U JP S59132638 U JPS59132638 U JP S59132638U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- foam sheet
- conductive foam
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の斜視図、第２図は第１図の
■−■線における断面図、第３図は集積回路板の正面図
である。
１・・・導電性発泡シート、２・・・集積回路板、３・
・・端子ピン、４・・・凹部。FIG. 1 is a perspective view of an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line 1--2 in FIG. 1, and FIG. 3 is a front view of an integrated circuit board. 1... Conductive foam sheet, 2... Integrated circuit board, 3...
...Terminal pin, 4...recess.
Claims (1)
し、この凹部の底面に集積回路板の端子ピンを差込んで
集積回路板を固定するようにした導電性発泡シートであ
って、導電性発泡シートの厚さをａ、凹部の深さをｂ１
集積回路板の厚さをＣ１集積回路板より突出した端子ピ
ンの長さをｄとした場合に ａ ≧ｃ＋ｄ ａ−ｄ≧ｂ≧Ｃ の条件を満足して成ることを特徴とする集積回路板固定
用導電性発泡シート。[Claims for Utility Model Registration] A conductive device that has a recess large enough to accommodate an integrated circuit board on its surface, and that terminal pins of the integrated circuit board are inserted into the bottom of the recess to fix the integrated circuit board. The conductive foam sheet has a thickness of a and a depth of the concave portion of b1.
An integrated circuit board characterized by satisfying the following conditions: a≧c+d a−d≧b≧C, where the thickness of the integrated circuit board is d and the length of a terminal pin protruding from the C1 integrated circuit board is d. Conductive foam sheet for fixing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775283U JPS59132638U (en) | 1983-02-25 | 1983-02-25 | Conductive foam sheet for fixing integrated circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2775283U JPS59132638U (en) | 1983-02-25 | 1983-02-25 | Conductive foam sheet for fixing integrated circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132638U true JPS59132638U (en) | 1984-09-05 |
Family
ID=30158634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2775283U Pending JPS59132638U (en) | 1983-02-25 | 1983-02-25 | Conductive foam sheet for fixing integrated circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132638U (en) |
-
1983
- 1983-02-25 JP JP2775283U patent/JPS59132638U/en active Pending
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