JPS59132195A - Method of producing porcelain printed circuit board - Google Patents
Method of producing porcelain printed circuit boardInfo
- Publication number
- JPS59132195A JPS59132195A JP600583A JP600583A JPS59132195A JP S59132195 A JPS59132195 A JP S59132195A JP 600583 A JP600583 A JP 600583A JP 600583 A JP600583 A JP 600583A JP S59132195 A JPS59132195 A JP S59132195A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- primer
- enamel
- producing
- enameled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明はほうろう印刷配線板の製造方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an enameled printed wiring board.
最近、自動車等の各種分野にほうろう印刷配線板が使わ
れるようになってきた。Recently, enamel printed wiring boards have come to be used in various fields such as automobiles.
このほうろう印刷配線板は、金属板にほうろう層を形成
し、１このほうろう層表面に導電ペーストや抵抗ペース
トを任意のパターンに印刷したものであり、従来の紙フ
ェノール積層板や紙エポキシ積層板を利用した印刷配線
板に比べてソリがなく放熱性が良いという長所があり、
また、セラミック基板に比べて加工が容易で大型の基板
の製造が可能である等の長所を有している。This enamel printed wiring board is made by forming an enamel layer on a metal plate, and printing conductive paste or resistive paste on the surface of this enamel layer in an arbitrary pattern. Compared to the printed wiring board used, it has the advantage of no warping and better heat dissipation.
Additionally, it has advantages over ceramic substrates, such as easier processing and the ability to manufacture large-sized substrates.
ところで、はうろう板−に印刷するのにガラスバインダ
ーや有機バインダーを含んだ導体ペーストや抵抗ベニス
トを用いている。そして前者の場合にはペーストを印刷
後に１００〜１５０℃程度の温度の雰囲気中に数１０分
間放置して乾燥し、さらに６００℃以上の高温雰囲気中
において数１０分間焼成する必要があり、乾燥・焼成に
時間がかかり、また要するエネルギーが大きく、価格的
にも非常に高くなる欠点があった。また、後者の場合に
は、前者よりも低温・短時間で乾燥及び焼成が可能であ
るが、ペーストの耐熱性が低くかつ密着性が悪いという
欠点があり、特に基板面を接点が摺動するような場合に
は印刷配線が容易に剥離するという欠点があった。By the way, conductive paste or resistive paste containing a glass binder or an organic binder is used for printing on a floating board. In the former case, after printing the paste, it is necessary to dry it by leaving it in an atmosphere at a temperature of about 100 to 150 degrees Celsius for several tens of minutes, and then to bake it in a high temperature atmosphere of 600 degrees Celsius or more for several tens of minutes, which requires drying and drying. The drawbacks were that firing took a long time, required a large amount of energy, and was very expensive. In addition, in the latter case, it is possible to dry and bake at a lower temperature and in a shorter time than the former, but the disadvantage is that the paste has low heat resistance and poor adhesion, and in particular, the contacts may slide on the substrate surface. In such cases, there is a drawback that the printed wiring easily peels off.
本発明は、以上の欠点を改良し、製造時間を短縮でき安
価でかつ印刷配線の密着性の良好なほうろう印刷配線板
の製造方法の提供を目的とするものである。The object of the present invention is to improve the above-mentioned drawbacks and provide a method for manufacturing an enameled printed wiring board that can shorten the manufacturing time, is inexpensive, and has good adhesion of printed wiring.
本発明は、上記の目的を達成づるために、はうろう形成
後の基板にプライマー処理を施し、その後、有機バイン
ダー系ペーストを任意のパターンに印刷することを特徴
とするほうろう印刷配線板の製造方法を提供するもので
ある。In order to achieve the above-mentioned object, the present invention produces an enameled printed wiring board, which is characterized in that a substrate after forming the enamel is subjected to a primer treatment, and then an organic binder paste is printed in an arbitrary pattern. The present invention provides a method.
以下、本発明を実施例に基づいて説明する。Hereinafter, the present invention will be explained based on examples.
先づ、鉄板やアルミ板等の金属板の表面にほうろう層を
形成してほうろう板を形成する。次に、このほうろう板
をシリコンゴム系やＮＢＲフェノール系、エポキシ樹脂
系等のプライマーの溶液中に浸漬しほうろう層の表面に
プライマ一層を形成する。そして、プライマ一層の表面
に有機バインダー系の導電性あるいは抵抗性のペースト
を任意のパターンにスクリーン印刷する。有機バインダ
ー系ペース１〜をプライマ一層の表面に印刷した後、温
度１００〜２０４０℃の雰囲気中に１０分間放置して乾
燥しさらに温度４００℃の雰囲気中で１０分間放置して
焼成し、印刷配線を形成する。First, an enamel layer is formed on the surface of a metal plate such as an iron plate or an aluminum plate to form an enamel plate. Next, this enamel plate is immersed in a solution of a primer such as silicone rubber, NBR phenol, or epoxy resin to form a single layer of primer on the surface of the enamel layer. Then, an organic binder-based conductive or resistive paste is screen printed in an arbitrary pattern on the surface of the primer layer. After printing organic binder paste 1~ on the surface of one layer of primer, leave it in an atmosphere at a temperature of 100 to 2040°C for 10 minutes to dry, and then leave it in an atmosphere at a temperature of 400°C for 10 minutes to bake it to form printed wiring. form.
ターなわら、本発明によれば、はうろう層の表面にプラ
イマ一層を設（プ、この上に有機バインダー系ペースト
を印、刷して印刷配線としているので、印刷配線の密着
性が良く、接点が摺動しても容易に剥れることはない。However, according to the present invention, a single layer of primer is provided on the surface of the waxy layer, and an organic binder paste is printed on this to form the printed wiring, so the adhesion of the printed wiring is good. , the contacts will not peel off easily even if they slide.
また、ペーストとして有機バインダー系のものを用いて
いるので、乾燥や焼成が低温・短時間で処理でき、必要
なエネルギーが少なくてすむので、安価に製造できる。In addition, since an organic binder is used as the paste, drying and baking can be performed at low temperatures and in a short time, and less energy is required, so it can be manufactured at low cost.
以上の通り、本発明によれば、印刷配線の密着性が良好
で、安価でかつ製造時間を短縮できるほうろう印刷配線
板の製造方法が得られる。As described above, according to the present invention, it is possible to obtain a method for producing an enameled printed wiring board that has good adhesion of printed wiring, is inexpensive, and can shorten the manufacturing time.
特許出願人 日立コンデンサ株式会社Patent applicant: Hitachi Capacitor Co., Ltd.
Claims (3)
の表面に任意の印刷配線を設けたほうろう印刷配線の製
造方法において、はうろう層を形成後の基板にプライマ
ー処理を施し、その後、有機パインター季ペーストを任
意のパターンに印刷して印刷配線とすることを特徴とす
るほうろう印刷配線板の製造方法。(1) In a method for producing enamel printed wiring in which an enamel layer is formed on a metal plate and arbitrary printed wiring is provided on the surface of the enamel layer, the substrate after the enamel layer is formed is subjected to a primer treatment, A method for producing an enameled printed wiring board, which comprises: thereafter printing the organic painter's paste in an arbitrary pattern to form printed wiring.
囲第１項記載のほうろう印刷配線板の製造方法。(2) The method for producing an enameled printed wiring board according to claim 1, wherein the primer is silicone rubber based.
の範囲第１項記載のほうろう印刷配線板の製造方法。(3) The method for manufacturing an enameled printed wiring board according to claim 1, wherein the primer is NBR phenol-based.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600583A JPS59132195A (en) | 1983-01-18 | 1983-01-18 | Method of producing porcelain printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP600583A JPS59132195A (en) | 1983-01-18 | 1983-01-18 | Method of producing porcelain printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59132195A true JPS59132195A (en) | 1984-07-30 |
Family
ID=11626617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP600583A Pending JPS59132195A (en) | 1983-01-18 | 1983-01-18 | Method of producing porcelain printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132195A (en) |
-
1983
- 1983-01-18 JP JP600583A patent/JPS59132195A/en active Pending
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