JPS5913072A - Sputtering device - Google Patents

Abstract

PURPOSE:To reduce the size of a sputtering device in the stage of forming sputtered thin layers on both surface of a film-like substrate, by providing sputtering sources for forming the sputtered thin films and work rolls to two upper and lower stages. CONSTITUTION:A film-like substrate P wound on a takeup reel is fed in a reverse direction with plural work rolls 13, 14, 15, 16 and is taken up on a feed reel 12 in a vacuum vessel 1. All the work rolls in this case are heated to remove impure gas contained in the substrate P in contact with said work rolls. While an inert gas such as Ar is fed into the vessel 1, the substrate P is fed through the cooled work rolls 13-16 from the reel 12 and is taken up on the reel 17, so that sputtered thin films are formed on both surfaces of the substrate P with plural sputtering sources 21-28. The work rolls 13, 14 and 15, 16, as well as the sputtering devices 21-24 and 25-28 for sputtering the films on both surfaces of the substrate P in this stage are disposed dividedly to the upper and lower stages of the vessel, whereby the entire part of the device is made smaller in size.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a sputtering apparatus that continuously forms sputtered thin films as functional thin films on both sides of a film-like substrate.

[Background technology of the invention and its problems]

In recent years, magnetic recording media in which the recording medium layer is formed of a sputtered thin film have appeared. Sputtered thin films are usually produced by performing glow discharge in a low-pressure inert gas, causing the cations generated by this discharge to collide with the target, and by this collision, the metal particles ejected from the target by fC are transferred to a predetermined support substrate. It is formed by attaching it to the surface of. Therefore, if a material with high magnetic recording properties is selected as the target, a good recording medium layer can be formed.

Incidentally, recently, there has been a desire for the emergence of a magnetic recording medium having a recording medium layer formed of a sputtered thin film on both sides of a film-like substrate, and several proposals have been made for sputtering apparatuses capable of producing magnetic recording media. .

The uniformity of the magnetic properties of the magnetic recording medium layer formed by sputtering depends on the inert gas pressure during sputtering, the distance between the substrate and the target, the sputtering speed, the substrate temperature, etc. It is important to keep the distance between the targets and the substrate temperature constant. Taking these points into consideration, it is advantageous to use a method in which the film-like substrate is held by work rolls in order to continuously form sputtered thin films on both sides of the film-like substrate.

That is, the film-like substrate is cooled by a refrigerant flowing through the inside and is transferred along the outer circumferential surface of the work roll that is rotationally driven, and the portion of the film-like substrate that is in contact with the outer circumferential surface of the work roll. A sputtered thin film is continuously formed on the surface of the sputtered film. In this way, the time during which the film-like substrate is in contact with the work roll can be extended, which allows the substrate to be cooled well, and the distance between the substrate and the target can always be kept constant by the work roll. In this way, when sputtering is performed while the film-like substrate is placed along the outer peripheral surface of the work roll and sputtered thin films are formed on both sides of the film-like substrate, it is possible to form the sputtered thin films on both sides at the same time. First, it is necessary to adopt an order in which a sputtered thin film is first formed on one of the surfaces, and then a sputtered thin film is formed on the other surface with a temporal shift.

In this case, when forming a sputtered thin film on the other surface, since the sputtered thin film has already been formed on one surface, the sputtered thin film that has already been formed is transferred to the step of forming the sputtered thin film on the other surface. There is a risk that it may be easily scratched. Generally, when a sputter source is energized, impurities are emitted from the sputter source, and these impurities,
There is a risk that objects may adhere to the surface of the substrate. Furthermore, there is a risk that the deposits attached to the substrate may fall onto the sputtering source and disturb the sputtering conditions. Furthermore, when sputtering thin films are formed on both sides, the entire apparatus becomes larger than when forming only on one side, but it is desirable to make the apparatus as small as possible from the viewpoint of the exhaust system. ! Naturally, an improvement in sputtering speed is also required.

[Purpose of the invention]

The present invention can satisfy the above-mentioned needs, and thus,
It is an object of the present invention to provide a sputtering IT capable of continuously forming high-quality sputtered thin films on both sides of a film-like substrate at a high speed, and also capable of reducing the size of the entire apparatus.

[Summary of the Invention] The sputtering apparatus according to the present invention includes a work roll that is involved in the step of forming a sputtered thin film on one surface of a film-like substrate, and a work roll that is involved in the step of forming the sputtered thin film on the other surface of the film-like substrate. The work rolls are arranged in a two-tier configuration with their axes parallel to each other on the upper stage, and each sputter source facing the outer peripheral surface of each work is aligned with a horizontal line drawn through the axes of the corresponding work rolls. P below and at an angle with respect to the vertical line drawn through the axis line, and furthermore, after passing the film-like substrate through the outer circumferential surface of the work roll located at the lower stage during sputtering execution. It is characterized by the provision of a mechanism that guides the work roll through the outer circumferential surface of the work roll located in the upper stage and guides it from the lower side to the upper side using a folded brass rod.

〔Effect of the invention〕

With the above configuration, each work roll, supply reel, and take-up reel can be arranged in a nearly circular arrangement, so the entire apparatus can be downsized, and the exhaust system can be downsized.

6. Also, with the above configuration, a sputtered thin film is first formed on the lower surface of the film-like substrate rod on the lower side, and then it is folded back so that the sputtered thin film becomes the upper surface and transferred to the upper work roll. A sputtered thin film is formed on the lower surface of the upper stage, and eventually sputtered thin films are formed on both sides. When transferring from the lower stage to the upper stage, it is necessary to pass through a relay roll such as a free roll, but the position of this relay roll is inevitably on the side where the sputtered thin film is not formed. Therefore, it is possible to minimize damage to the sputtered thin film already formed by the relay roll and to minimize ink stains, and products of higher quality can be manufactured. In addition, with the above configuration, the part of the base that faces the sputter source is always located diagonally above the sputter source, in other words, the sputter source is located diagonally below the facing surface of the base, so that the sputter It is possible to prevent impurities emitted from the source from adhering to the substrate side, and also to prevent various foreign substances from adhering to the sputtering source, and from this point of view as well, it is possible to form a sputtered thin film of good quality. In addition, since the sputtering source is provided at an angle with respect to the vertical line drawn through the axis of the work roll, two or more sputters can be produced on one work roll without sacrificing the above-mentioned advantages. The sources can be installed facing each other. Therefore, it is possible to increase the sputtering speed.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. This example is an example in which the present invention is applied to an apparatus for forming magnetic recording medium layers on both sides of a polymer film.

In FIG. 1, reference numeral 1 in the figure is a vacuum container made of metal material, for example, and this vacuum container l consists of a cylindrical part 2 arranged so that its axis line crosses the direction of gravity, and this cylindrical part 2
Lid bodies 3a and Jb (however, 3
b is not shown. ). Furthermore, an exhaust port 4 communicating with an exhaust system (not shown) and a gas inlet 5 communicating with an inert gas supply system (not shown) are formed in the cylindrical portion 2. Note that the lid body 3b is formed in a structure that can be selectively opened and closed.

In the vacuum vessel 1, the film-like substrate P is guided in a U-shaped path from bottom to top, perpendicular to the axis of the cylindrical portion 2. A guide mechanism 11 for guiding the vehicle is provided. This guide mechanism 11 includes a supply reel 12 disposed below an imaginary line that divides the vacuum container 1 into upper and lower halves from the left to the right in the figure.
and work rolls 13, 14, work rolls 15, 16 and take-up rolls 17 which are arranged above the imaginary line dividing the upper and lower halves from right to left in the figure, and which are arranged between these, respectively. It consists of a free roll 18. These free rolls 18, work rolls 13°14
．． 15.16, the supply reel 12 and the take-up reel 17 are placed 6C so that their axes are parallel to the axis of the cylindrical portion 20. And supply reel 12
Unwound from 79-film-like substrate p-ray, workpiece four-wheel 13.14°15,
J' 6 is guided along the outer circumferential surface of each work roll in the order of 6 and folded back at the position of the lowest surface of each work roll, and is finally guided to be wound onto the take-up reel 17.

Drive shafts (not shown) are connected to the supply reel 12 and the take-up reel 17, respectively, and these drive shafts are connected to the lid 3a with the lid 3m insulated from each other. It passes airtightly and rotatably through the shaft and is connected to the rotating shafts of DC shunt type motors 12a and 17m, respectively indicated by numerals in FIG. 2. Further, the work rolls 13, 14, 15, and 16 are each formed into a double cylindrical shape, and these work rolls 13, 14, 15, and 16 have the following features:
Each of the drive shafts formed in a double cylindrical shape is connected in a state where the corresponding nine shafts are in communication with each other. Each drive shaft formed in a double cylindrical shape connects the attached body 3m to the lid body 31.
A direct current 10-shunt type motor 10, shown with a numeral in FIG.
It is connected to a rotating shaft of a*16m. Note that the portions of each of the drive shafts that are formed into a double cylindrical shape and located outside the vacuum vessel 1 are heated through the space that exists in the center of the drive shaft to the space that exists in the center of the work roll. A rotary joint mechanism is provided for feeding a medium and discharging the heat medium to the outside through an outer space within the work roll and an outer space within the drive shaft, and these rotary joint mechanisms are connected to a hot liquid source and a hot liquid source, respectively. It is adapted to be selectively connected to a source of cryogenic liquid.

In the vacuum container 1, each work roll 1B,
A total of eight sputtering sources 21, 22, . . . , 28 are arranged on the outer peripheral surfaces of the sputtering devices 14, 15, and 16, two each facing each other. These sputtering sources 21.22. ...28, a ring-shaped anode is arranged concentrically on the outside of each disc-shaped target, insulated from the target, and one pole surface 'a' is in contact with the back surface of the target. It is formed into a magnetron-shaped flat structure with permanent magnets arranged as shown in the figure.

Each sputtering source 21. j12...28 is based on the outer peripheral surface of each work rule 13, 14, 15, 16, below the horizontal break that passes through the axial center line of each work roll, and with a vertical line that passes through the above axial center line. The opening angle θ between this perpendicular line and the axis of the target is in the range of 30 to 60 degrees, and the targets are arranged so as to face each other from obliquely below. In this embodiment, the sputtering source is 21.22°25.
The target of sputter source 26 is made of permalloy, and the targets of sputter source 23, 24, 27, and 28 are made of Co-C.
It is made of r alloy. And each sputter source 21,
22. . . . 28 targets and anodes are each independently connected to an output end of a DC power source (not shown) via lead wires (not shown) provided to hermetically penetrate the lid 3a.

On the other hand, between the supply reel 12 and the work roll 13,
Between work rolls 13 and 14, between work rules 14 and 15, between work rolls 15 and 16, and between work rolls 16 and take-up reel 17, the tension of the film-like substrate P traveling between these is detected. Tension detectors 31, 32.
...Force 35 is installed. These external detectors 31°32,
... is configured to convert tension into mechanical displacement, for example, and output the amount of displacement as an electrical signal. Also, on the left side of the figure of work rolls 13 and 16,
Pinch rollers 37 and 38 are provided that selectively press and contact each workpiece wheel in conjunction with forward and reverse rotation operations.

Therefore, each motor has a length of 28.13 m.

14a, . . . 17m are servo control circuits 41, 42, . . . , as shown in FIG. ... 46 independently. This circuit 41.42. ...46 controls the speed of the motor so that the deviation between the set speed signal introduced as an input signal and the actual speed signal obtained by the DC generator 48 connected to the motor is always zero. It is configured as follows. Each of the servo control circuits 41, 42.・・・
A set speed signal is introduced into the input terminal of 4613- via the speed setter 51, forward/reverse switch 52, and speed correctors 53, 54, and 55.56°57.

The speed correctors 53, 54, 55, and 56.57 each include a circuit 611 that calculates the deviation between the tension signal zo given by the tension setting device 61 and the tension signal z1 obtained by each tension detector, and this circuit. and a circuit 63 for correcting the set speed signal given from the speed setter 51 using the deviation signal obtained in step 62. That is, when zl is smaller than zo, the set speed signal is increased by an amount corresponding to the difference between the two, and in the opposite case, the set speed signal is decreased.

Further, the circuit 63 switches the polarity of the increase/decrease signal valve in response to the forward/reverse rotation switch 52. Thus, in the case of this embodiment, the supply reel, A/12, each work roll 13, 14, 15° 16 and the take-up reel 17
The state in which the film-like substrate P is driven to rotate as shown by the solid line arrow in FIG. A signal corresponding to the low speed setting signal is directly introduced from the signal source 64 to @151a@168
Servo control circuits 43 and 44 that control 017m.

45. In 46, a signal passed through a speed compensator into which the output of a tension detector located immediately before the position of the work roll and take-up reel driven by the motor is introduced is introduced as a set speed signal. There is. In a reversed state, these relationships are switched.

Therefore, as shown in FIG.
A switch 66 is provided which is switched in conjunction with the switching operation, and FIG. 2 shows the normal rotation state. Reference numeral 68 in the figure indicates a signal source that provides a low speed signal to the servo control circuit 46 during the reverse rotation state. Also, 70.71 in Figure 1
72 indicates a holder for holding a sputtering source, 72 indicates a partition plate, and 73 indicates a mask for regulating the area where a thin film is formed by sputtering. Further, the pinch roller 37 is controlled to come into pressure contact with the work roll 13 only during forward rotation in response to the switching operation of the forward/reverse rotation switch 52, and the pinch roller 38 is controlled to contact the work roll 16 only during reverse rotation. Controlled to suppress contact.

Next, an example of use will be described in which a two-layer sputtered thin film consisting of a permalloy layer and a Co--Cr layer is formed on both sides of a film-like substrate P using the apparatus configured as described above.

First, open the lid 3b of the Makabe container 1 and remove the film-like substrate P.
The winding reel 17 is set as shown in FIG. As shown in each free roll 18, tension detectors 35, 34, 3
! I.

32.31 and each work roll 16.15°14.1
3, the free end is wound around the supply reel 12, adjusted so that a predetermined tension is applied, and the lid body 3b- is closed. Next, the exhaust system is activated to exhaust the inside of the vacuum container 1 to a sufficiently low pressure. Next, each work rule 1B, 14, 15.
The high-temperature liquid is passed through each work roll 1B, 14.15.16 through the double cylindrical drive shaft of 16, thereby increasing the surface temperature of each work roll 13°14.1g, 16. Maintain at a fixed high temperature. next,
The forward rotation/reverse rotation switch 52 is switched to the reverse rotation side. As a result of this switching, each switch 66 is switched to a state opposite to that shown in FIG. Further, the pinch ruler 38 presses against the work roll 16 via the film-like substrate P. next,
The tension setting device 61 outputs a predetermined tension signal Zot-, and the speed setting device 51 outputs a predetermined set speed signal. In this state, each servo control circuit 41, 42.・
...Give starting command 8t to 46.

When the starting command 8 is given in this way, each servo control circuit 41, 42, 43...46 is activated, and the 17-motors 12m, 13a*14m...17m start rotating all at once. That is, the motor 17m is connected to the signal source 68
The motor 16m rotates at a low speed determined by the output signal of the speed setting device 52, and the motor 16m rotates at a speed corresponding to the set speed signal of the speed setting device 52.
2m, the set speed signal of the speed setter 52 is converted to the speed corrector 56.
It rotates at a speed corresponding to the signal corrected by 55.54.53. For this reason, the take-up reel 17, the work roll 16
, 15.14.13 and the supply reel 12 rotate in the opposite direction to the direction indicated by the solid arrow in FIG. It will be done. In this case, each work roll 1
B, 14, 15, 16 is kept at a high temperature by the high-temperature liquid as described above, so the film-like base P that comes into contact with it is also heated, and as a result, the film-like base P
The impure gas adhering to the gas is released. That is, the film-like substrate P is pretreated by the above-described operation.

18- Note that the reason why the take-up reel 17t is rotated at a low speed is to prevent the take-up reel 17 from spinning too much due to inertia. It is desirable that the output signal gradually increases as the output signal decreases. After performing the pre-processing as described above, each servo controller M4
．． 42. . . . 46 is stopped, and thereby the take-up reel 17 and each work roll 16.15 are stopped.
．． 14.13 and the supply reel 120 rotations are stopped to complete the pretreatment process. By this pretreatment step, most of the gas added to the film-like substrate P is transferred to the exhaust system and removed.

, then the flow of hot liquid in each 95-roll 13, 14, 15° 16 is stopped, followed by each work roll 1
3.14.15. ．． For example, a low temperature liquid of -15° C. is passed through the inside of the device 16. By flowing this low temperature liquid, the surfaces of each work rail 13, 14, 15, 16 are cooled to a sufficiently low temperature.

Next, the forward/reverse rotation switch 52t is operated to switch to the forward rotation side. This switching causes each switch 66 to switch to the state shown in FIG. 2. In addition, a speed setting device 51 and a tension setting device 6
Set each output of 1 to a desired value.

In this state, each servo controller 41, 42. ...Gives start command 8 to 46. As a result, the supply reel 12, the work rolls 13, 14, 15, 16, and the take-up reel 17 start rotating in the direction shown by the solid arrow in FIG. 171111
Start transitioning to . Next 1. For example, At gas is continuously introduced from the gas inlet 5, and in this state, the inside of the deep container is heated to ``, for example, 3 to 7 x 10 degrees'', Torr.
The exhaust system and the Ar gas supply system were adjusted so that the pressure was as high as 100 volts, and then a DC voltage of several hundred volts was applied between the anodes of the sputtering sources 21, 22, . . . , and the target.

This application generates a goo discharge between the anode and the target, which causes the well-known ! Based on this, the metal particles that make up the target are knocked out.

Part 81 of these metal particles that were knocked out! The front surface of the target is attached to the surface of the film-like substrate P that advances along the outer peripheral surface of the work roll.

As mentioned above, the sputter source 21. , 22 are made of permalloy, and the sputter source 23 is made of permalloy.
．． Target No. 24 is made of a Co-Cr alloy. Therefore, while the film-like substrate P passes along the outer peripheral surface of the work roll 213.1.4 located at the lower stage, a permalloy layer is formed on one surface of the film-like substrate P.

A two-layer sputtered thin film layer consisting of a Co-Cy layer and a Co-Cy layer is formed. Then, the film-like substrate P is located at the upper stage. When traveling along the outer circumferential surface of the work roll 15, 16, the surface on which the thin film layer of filter batter has already been formed is guided into a relationship in which it contacts the outer circumferential surface of the roll 1,5,16. Ru. 4 Therefore, 1. When passing through these 7 sections 21-, a two-layered sputtered thin film layer consisting of a permalloy layer and a Co7Cr layer is formed on the other surface of the film-like substrate P, and eventually the take-up reel At 17, a film-like substrate P on which sputtered thin films of a two-layer structure are formed is wound up on both sides. Then, when sputtering is performed as described above, the film-like substrate P tends to be heated by this sputtering, but
This heat is applied to each work roll l J,, 14°15.16
The cryogenic liquid flowing through the inner pipes of each work row is transmitted through the pipes. Therefore, the film-like substrate P will not suffer any thermal surface damage. Furthermore, in the event that the film-like substrate P is elongated due to the above-mentioned heat, the following operation is performed. That is, as described above, the film-like substrate P
When the material elongates, this elongation manifests itself as a decrease in the magnetic force applied to the substrate as it progresses between the work rolls. For example, if the tension of the substrate traveling between the work rolls 14 and 15 decreases 1, this decrease is detected and detected by the tension detector 33. In this way, as the output of the tension detector 33 decreases, the output of the speed corrector 550 circuit 62 shown in FIG. 2 increases, and as a result, the output of the circuit 63 also increases. Therefore, since the servo controller 440 input increases, the motor 15a
The rotational speed of the work roll 15 increases, and accordingly, the rotation speed of the work roll 15 increases.
The rotation speed of increases. Therefore, the winding of the work roll 15 is accelerated by the amount that the tension is reduced, so the tension increases again, and as a result, the rotational speed of the work roll 15 and the progress along the outer circumferential surface of the work roll 15 are increased. The rotational speed of the work roll 15 is controlled so that the relative speed difference with the advancing speed of the film-like substrate P is approximately zero. Such control also applies to other work roles 14.16
The same procedure is applied to the winding wheel 17 as well. Therefore, the film-like substrate P is attached to each work roll 14.
The slip between 15 and 16 will always be very small. For this reason, in particular, work roll 1
5. When moving along the outer circumferential surface of 16, there is no risk of getting wet. Further, the cooling performance does not deteriorate, which tends to occur when slip increases.

In this case, especially during sputtering, the film-like substrate P is guided along a path that folds back from the bottom to the top from the lower stage side to the upper stage side, so that each element can be arranged in a nearly circular arrangement. Therefore, not only can the entire system be made smaller, but also the exhaust system can be made smaller. Further, the relay free roll 18 located between the upper and lower stages does not come into contact with the Subap Wi. Therefore, the sputtered thin film that has already been formed will not be damaged by the relay free roll. Also, sputter sources 21, 22, 23.・・・
28 is located obliquely below the surface of the substrate that they face, so impurities from the sputtering source will not fall onto the substrate side, and no foreign matter will adhere to the sputtering source. Therefore, a high quality sputtered thin film can be formed on both sides. In addition, since the sputtering sources are arranged in the above relationship, the above-mentioned advantage t? As shown in the embodiments, two or more spatter sources can be opposed to one work roll without the need for sputtering. You will get it.

In the above-described embodiment, the so-called book force control device is composed of a plurality of tension detectors and a plurality of speed correction stages that correct the set speed of each work rotation drive motor based on the outputs of these detectors. However, it is not limited to this. That is, the current of the motor that drives each work roll may be detected by a detector, and the speed of each motor may be corrected according to these detections and the output of the detector.

Further, when the amount of elongation of the film-like substrate is known in advance, a difference may be set in advance in the set speeds of the respective motors. Further, a heavy weight loader may be provided between each work roll to apply a constant load to the film-like substrate moving between the work rolls. Furthermore, during pretreatment, a voltage is applied between each workpiece-25~, the roll and, for example, a vacuum vessel to generate plasma near each workpiece roll, and the surface of the film-like substrate is activated by this plasma,- This may be used to improve degassing and adhesion. In this case, a shutter may be provided between the sputtering source and the film-like substrate to prevent impurities from adhering to the sputtering source. Furthermore, although the above-mentioned embodiment is an example in which the present invention is applied to a sputtered thin film forming device having a two-layer structure, it is of course applicable to a device forming a single-layer structure. Additionally, means for cooling each mass may be provided.

[Brief explanation of drawings]

FIG. 1 is a schematic vertical sectional view of the main parts of a sputtering apparatus according to an embodiment of the present invention, and FIG. 2 is a control circuit diagram of the apparatus. 1... Vacuum vessel, 12... Supply reel , 17...
Take-up reel, 13.14.15.16... Work roll, 18... Free roll, 21.22.23゜j1
4.25, 26.27.28...Sputter source, 26-31.32.33.34.35...Tension detector, 53
．． 54.55.56.57...Speed compensator, P...
Film-like substrate. Applicant's representative Patent attorney Takehiko Suzue Procedural Amendment, 8ゎ57.9. 108 Commissioner of the Japan Patent Office Aio Wakasugi 1, Indication of the case, Patent Application No. 1987-119551 2, Name of the invention, Sno volume tsuttering device 3, Person making the amendment Relationship with the case Patent applicant Tokuyo Seisakusho Co., Ltd. 105 Tel. 03 (502) 3181 (Major representative) 6. Power of attorney to be amended, full text of the specification 7. Contents of the amendment (11 One power of attorney is amended as shown in the attached sheet. (2) Engraving of the specification (Contents C 2 Changes) (None). Commissioner of the Japan Patent Office Kazuo Wakasugi 1. Indication of the case Japanese Patent Application No. 1987-119551 2, Name of the invention Snow Yattering Device 3, Person making the amendment Relationship with the case Holding applicant 6, Subject of the amendment Specification 7, Contents of the amendment (page 11 of the 11th specification (written specification attached to the written amendment submitted on September 10, 1982; the same shall apply hereinafter))
In line 7, the phrase “each in a disc shape” is changed to “each in a disk shape,”
For example, in the shape of a disk.'' (In the 21 specification, page 20, line 16, r 3 ~ 7 x 10 Torr J is corrected to 3 "3 ~ 7 x 10 Torr". 2-

Claims (1)

[Claims] The film-like substrate unwound from the supply reel is transferred sequentially along the outer circumferential surface of a plurality of work rolls, and then wound up on the take-up reel. In the delta battering apparatus, sputtering thin films are formed on both sides of the film-like substrate using sputtering sources provided opposite to the outer peripheral surfaces of the respective work rolls, in which one of the film-like substrates is The work rolls involved in the process of forming a sputtered thin film on one surface are arranged in a lower stage, and the work rolls involved in the process of forming a sputtered thin film on the other surface are arranged in a two-stage configuration with their axes parallel to each other, and the work rolls involved in the process of forming a sputtered thin film on the other surface are arranged in two stages. Each sputtering source facing the outer peripheral surface of each work roll is positioned below a horizontal layer drawn through the axis of the corresponding work roll and inclined with respect to a vertical line drawn entirely through the axis. Furthermore, when performing sputtering, the film-like substrate tube is advanced from the lower side to the upper side by passing through the outer peripheral surface of the work roll located at the lower stage and then through the outer peripheral surface of the work roll located at the upper stage. A sputtering device characterized by being provided with a mechanism for guiding along a folding path.