JPS5912940A - Antistatic manuscript-supporting plastic board - Google Patents

Abstract

PURPOSE:To obtain titled board of high antistatic potential and wear resistance, by coating on a plastic board a curable resin composition containing a specific silicon compound, a polydimethyl siloxy group- and polyethylene oxide unit- contg. nonionic surface active agent, etc., followed by curing. CONSTITUTION:The objective board can be obtained by coating on a plastic board a curable resin composition containing (A) (i) a silicon compound of formula I (R<1> is epoxy-contg. organic group; R<2> is H, 1-6C hydrocarbon, or vinyl; R<3> is 1-5C hydrocarbon alkoxyalkyl, or 1-4C acyl; a is 1-3; b is 0-2; a+b<= 3) and/or its hydrolyzate, or (ii) the component (i) and a powdered metallic oxide of a size 1-100mmu, or (iii) the component (i) and a compound of formula II (M is an element belonging to the IV-group, except carbon; R<4> is 1-10C hydrocarbon; m is 1-20), or (iv) the component (ii) and the compound of the formula II and (B) (i) a polydimethylsiloxy group- and polyethylene oxide unit-contg. nonionic surface active agent and/or (ii) a perfluoroalkyl group- and polyethylene oxide unit-contg. one, followed by curing.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plastic document support plate having good antistatic properties. Examples of the above plastic include PMMA and polycarbonate.

Polystyrene, polyolefin, 0R-39, PET
Commonly used polymer materials such as

The document support plate is, for example, a transparent plate that is in direct contact with a document in order to support the document as a subject in an information device such as a copying machine or a facsimile machine.

In such a document support plate, charging and attracting dust increases the amount of information to be transmitted, and does not have a very good effect.

Furthermore, even if the charged document support plate attracts the document itself by electrostatic force, it will have a very negative effect on the operability. This is a particularly big drawback when a mechanism is used to automatically feed out the original. This is particularly problematic when plastic is used for this support plate.

Generally speaking, methods for reducing the static charge that impairs the functionality of plastic products include applying a surfactant such as polyhydric alcohol fatty acid ester to the surface as an antistatic agent, or impregnating the inside of the base of plastic ivy. is used.

However, the method of applying an antistatic agent has drawbacks such as the surface becoming sticky and the effect not lasting as it is removed during use, and is not very effective.

On the other hand, the method of impregnating an antistatic agent into a plastic substrate has the disadvantage that the plastic substrate may change color or blooming may occur due to poor compatibility.

Recently, scratch-resistant protective coatings have begun to be applied to improve the fragility of plastic products, which is another major drawback, but many of these coatings are also highly electrostatic. .

As a result of intensive research, the present inventors found the following components A and B.
It has been found that all the drawbacks of the antistatic methods used hitherto can be improved by coating a curable resin composition containing the above-mentioned antistatic method with a cured coating film.

That is, these components A and B are A, the following a or b or C or d or ea, the following (a) b, the following (a) and (b), C1 the following (a) and (c) d, the following (a) and (b) and (c) e. Seven or two silicon compounds selected from the following (c) and (d) (i) silicon compounds having a structure that can be represented by the following general formula (1). and/or a hydrolyzate thereof.

21 Rla-8i -(OR3) 44-1) (/
) (In the formula, R1 is an organic group having an epoxy group, R2 is hydrogen, a hydrocarbon group or vinyl group having a carbon number of /~S, and R3 is a hydrocarbon group having a carbon number of /~S.

an alkoxyalkyl group or an acyl group having carbon number/~l,
(a is /~J, b is O-1, and a+b≦3) (b) Seven or more types selected from metal oxide fine powders having a particle size of /~100 mμ.

(c) Seven or more compounds selected from compounds having a structure represented by the following general formula (2) and/
or its hydrolyzate.

R404-M-0↓R4(J). "R4 (In the formula, M is one or more selected from group O elements other than carbon, and R' is a hydrocarbon group having carbon number/~10 m
is/~, an integer of 20) (d) 1 selected from silicon compounds having a structure that can be represented by the following general formula (3)
Species or species and/or hydrolysates thereof.

R5nSi (OR6)4-n (3) (wherein,
R5 is an organic atomic group having no hydrogen atom or epoxy group,
R6 is a hydrocarbon group having a carbon number of 10 to 10, an alfukidialkyl group, an acyl group, n is an integer of 3 to 3) B, the following a and/or b a, a nonionic group containing a polydimethylsiloxy unit and a polyethylene oxide unit One or more surfactants selected from surfactants.

b, seven or more nonionic surfactants containing a per-70-roalkyl group and a polyethylene oxide unit;

Examples of the silicon compound having a structure represented by the general formula (1) in (a) include the following.

A specific example of a silicon compound having a glycidoxy group is glycidoxymethyltrimethoxysilane.

Glycidoxymethyltriethoxysilane.

β-glycidoxyethyltrimethoxysilane.

β-glycidoxyethyltriethoxysilane.

r-glycidoxypropyltrimethoxysilane.

r-glycidoxypropyltriethoxysilane.

r-glycidoxypropyl tri(methoxyethoxy)
Silane.

r-glycidoxypropyltriacetoxysilane.

δ-Glycidoxybutyltrimethoxysilane.

δ-Glycidoxybutyltriethoxysilane.

Glycidoxymethyldimethoxysilane.

Glycidoxymethyl(methyl)dimethoxysilane.

Glycidoxymethyl(ethyl)dimethoxysilane.

Glycidoxymethyl(phenyl)dimethoxysilane.

Glycidoxymethyl(vinyl)dimethoxysilane.

Glycidoxymethyl(dimethyl)methoxysilane.

β-Glycidoxyethyl(methyl)dimethoxysilane.

β-glycidoxyethyl(ethyl)dimethoxysilane.

β-glycidoxyethyl(dimethyl)methoxysilane.

r-glycidoxypropyl(methyl)dimethoxysilane.

r-glycidoxypropyl(ethyl)dimethoxysilane.

r-glycidoxypropyl(dimethyl)methoxysilane.

δ-glycidoxybutyl(methyl)dimethoxysilane.

δ-glycidoxybutyl(ethyl)dimethoxysilane.

δ-glycidoxybutyl(dimethyl)methoxysilane.

A specific example of a silicon compound having moss or three glycidoxy groups is bis(glycidoxymethyl)dimethoxysilane.

Bis(glycidoxymethyl)jethoxysilane.

Bis(glycidoxyethyl)dimethoxysilane.

Bis(glycidoxypropyl)jethoxysilane.

Tris(glycidoxymethyl)methoxysilane.

Tris(glycidoxymethyl)ethoxysilane.

Tris(glycidoxyethyl)methoxysilane.

Tris(glycidoxyethyl)ethoxysilane.

Tris(glycidoxypropyl)methoxysilane.

Tris(glycidoxypropyl)ethoxysilane.

Specific examples of silicon compounds having glycidyl groups include: Glycidylmethyltrimethoxysilane.

Glycidylmethyltriethoxysilane.

β-glycidylethyltrimethoxysilane.

β-Glycidylethyltriethoxysilane.

r-glycidylprobyltrimethoxysilane.

r-glycidylpropyltriethoxysilane.

r-glycidylprobyltri(methoxyethoxy)silane.

r-glycidylpropyltriacetoxysilane.

These may be used alone or in combination of two or more.

(b) Metal oxide fine powder with a particle size of ~100 mμ is:
It is a colloidal solution in which ultrafine particles of the above particle size, such as silica, alumina, titania, and zirconia, are dispersed in a dispersion medium, such as water or an alcohol-based dispersion medium, and is produced by a well-known method.Silica sol, and alumina sol are commercially available. Among these, silica sol is most preferred.

Furthermore, examples of the compound (c) having a structure that can be represented by general formula (2) include those described below.

That is, M shown in the general formula (k) is 7 or 2 or more selected from group O elements other than carbon,
Preferably, silicon or titanium is used. Such compounds when M is silicon include: tetramethoxysilane, tetraethoxysilane.

Tetrapropoxysilane, Tetraisopropoxysilane, Tetrabutoxysilane, Tetraisobutoxysilane,
Tetra t-butoxysilane, tetrahexyloxysilane, tetraethoxysilane.

Alkyl silicates such as tetraoctyloxysilane, hexaethoxydisiloxane, hexapropoxydisiloxane, hexaisopropoxydisiloxane, hexabutoxydisiloxane, hexamethoxydisiloxane, hexaisobutoxydisiloxane, hexat-butoxydisiloxane.

Hexahexyloxydisiloxane, hexapentyloxydisiloxane, octamethoxytrisiloxane, octaethoxytrisiloxane, octapropoxytrisiloxane, octaisopropoxytrisiloxane, octabutoxytrisiloxane.

Examples include alkoxysiloxanes such as octaisobutoxytrisiloxane, octat-butoxytrisiloxane, octahexyloxytrisiloxane, octapentyloxytrisiloxane, octaoctyloxytrisiloxane, and octaoctyloxytrisiloxane. When M is titanium, tetrabutyl titanate, tetraisopropyl titanate, tetrakis(,2-
Examples include alkoxytitaniums such as ethylhexyl) titanate and alkoxytitanium polymers that are condensates thereof. Among these, it is most preferable to use alkyl silicates.

Examples of the silicon compound having the structure represented by the general formula (3) (d) include the following compounds. i.e. dimethoxymethylsilane.

trimethoxysilane, dimethylethoxysilane.

Methoxytrimethylsilane, dimethoxydimethylsilane, methyltrimethoxysilane, chloromethyldimethylethoxysilane, ethoxychloromethyldimethylsilane,
trimethoxyvinylsilane.

Chloromethyldimethylethoxysilane, ethoxytrimethylsilane, jetoxymethylsilane, ethyltrimethoxysilane, dimethylethoxyethynylsilane, diacetoxydimethylsilane, dimethoxymethyl-3,3,3
-) Lifluoropropylsilane, 3.3.3-trifluoropropyltrimethoxysilane, ethoxydimethylvinylsilane, 3-chloropropyldimethoxymethylsilane,
Chloromethyljethoxymethylsilane, 3-chloropropyltrimethoxysilane, jetoxydimethylsilane,
Dimethoxy-3-mercaptopropylmethylsilane, triethoxysilane, 3-mercaptopropyltrimethoxysilane, propoxytrimethylsilane, 3-aminopropyltrimethoxysilane, diacetoxymethylvinylsilane, methyltriacetoxysilane, jetoxymethylvinylsilane, chloromethyl triethoxysilane, t
-butoxytrimethylsilane, /-methylpropoxytrimethylsilane, isobutoxytrimethylsilane, butoxytrimethylsilane, butyltrimethoxysilane, methyltriethoxysilane, 3-aminopropyldimethylethoxysilane, 3-(N-methylaminopropyl)trimethylsilane, Methoxysilane.

Vinyltriacetoxysilane, ethyltriacetoxysilane, trifluoroacetoxypropyltrimethoxysilane, jetoxydivinylsilane, ethyltriethoxysilane, dimethylisobutoxyvinylsilane, acetoxytriethylsilane.

Triethoxyvinylsilane, isopentyloxytrimethylsilane, jetoxydiethylsilane, ethyltriethoxysilane, Komelkabutethyltriethoxysilane, 3-aminopropyljethoxymethylsilane, 3-(
J-aminoethylaminopropyl)dimethoxymethylsilane, 3-(J-aminoethylaminopropyl)trimethoxysilane, chloromethyldimethylphenoxysilane.

p-chlorophenyltrimethoxysilane, phenoxytrimethylsilane, dimethoxymethylphenylsilane, phenyltrimethoxysilane, 1-cyclohexenyloxytrimethylsilane, chloromethylcyclohexyloxydimethylsilane, --cyanoethyltriethoxysilane,
Cyclohexyloxytrimethylsilane, dimethylisopentyloxyvinylsilane, allyltriethoxysilane,
3-allylthiopropyltrimethoxysilane, 3-chloropropyltriethoxysilane, 3-allylaminopropyltrimethoxysilane, propyltriethoxysilane, hexyltrimethoxysilane.

3-aminopropyltriethoxysilane, ○,○l-diethyl S-(,2-trimethoxysilylethyl)dithiophosphate, benzyloxychloromethyldimethylsilane, dimethylethoxyphenylsilane, benzyloxytrimethylsilane, 3-methacryloxypropyl Trimethoxinelan, dimethoxymethyl-cobiperidinoethylsilane, 3-mol 7 olinoprobyl trimethoxy'disilane, ○, ○/-゛diethyl-2-dimethylethoxysilyl vinyl dithiophosphate, dimethoxymethyl-3-
Piperazinopropylsilane, 3-piperazinopropyltrimethoxysilane, N-(3-)ethoxysilylbrobyl)ureamethoxytribropylsilane, , 2-
(J-aminoethylthioethyl)triethoxysilane,
Methyltris(,2-methoxyethoxy)silane, dimethoxy-3-(-monoethoxyethylthiopropyl)methylsilane, methyltriisopropoxysilane, methyltripropoxysilane, 3-[,2-(J-aminoethylaminoethylamino) ) Propyltriethoxysilane, diacetoxymethylphenylsilane, chloromethyldimethyl-cophenylethoxysilane, benzyldimethylethoxysilane, jetoxymethylphenylsilane,
Dimethoxymethyl-3-piperidinopropylsilane, tris-(-1methoxyethoxy)vinylsilane, J-(
3-acetoxypropylthio)propyldimethoxymethylsilane, triisopropoxyvinylsilane, 3-piperidinopropyltrimethoxysilane, 2-ethylhexyloxytrimethylsilane, octyloxytrimethylsilane, pentyltriethoxysilane, p-chlorophenyltrimethylsilane Ethoxysilane, FJNyltriethoxysilane, 3
-7enylaminopropyltrimethoxysilane 1.2-
Aminoethylamine/methylbenzyloxydimethylsilane, N-(3-jethoxymethylsilylprobyl)succinimide, dimethoxymethyl-3-(&-methylpiperidinobrovir)silane, 3-(+2-methylpiperidino) proyl)trimethoxysilane, o,o'-diethyl 5-
(2-triethoxysilylethyl) dithiophosphate, benzyltriethoxysilane, o-triethoxysilylconorbornene, dimethoxydiphenylsilane,
Octyltriethoxysilane, diphenylethoxymethylsilane, R-N-α-7enethyl-N'-trimethoxysilylpropyl urea, 5-N-α-7enethyl-N
/ ) Rimethoxysilylzolopyl urea, dimethoxymethyl, ? -(3-phenoxypropylthiopropyl)silane, phenyltris(2-methoxyethoxy)silane, decyloxytrimethylsilane, tripentyloxysilane, diacetoxydiphenylsilane.

Diphenylethoxyvinylsilane, jetoxydiphenylsilane, N-(3-triethoxysilylbrothyl)
-p-nitrobenzamito, his(he/-dimethyl-coprovinyloxy)methylphenylsilane, jetoxydodecylmethylsilane, dodecyltriethquinsilane, triphenoxyvinylsilane, ethoxytriphenylsilane, octadecyltriethquinsilane, jetoxy Examples include methyloctadecylsilane.

Although (a), (c) and (d) may be used as they are, it is preferable to use them as hydrolysates.

These hydrolyses are obtained by hydrolyzing in the presence of an acid in a mixed solvent such as water and alcohol, as is well known, and the alkoxy groups, acyloxy groups, etc. in these compounds are This includes those in which part or all of the hydroxyl groups are substituted with hydroxyl groups, and those in which the substituted hydroxyl groups are partially naturally condensed with each other. When these are used after being hydrolyzed, each component may be hydrolyzed separately before use, or they may be mixed in advance and then hydrolyzed before use. Although these components may be used in combination, better results are often obtained if they are mixed in advance.

(B) may be added before or after the other components are hydrolyzed, but it often gives better results when added before the hydrolysis.

The above components (b) and (c) are added to component (a) to increase the hardness and durability of the film. When using (a) and (b) above as component A, the amount of component (a) is the same as (i) and (b).
It is preferably 20% by weight or more, more preferably 50% by weight or more based on the total amount of (b). In addition, (a) when using (a) and (c) above as component A
The preferred amount of the component is 20% of the total of (a) and (c).
It is at least % by weight, more preferably at least % by weight SO. Similarly, when using the above components (a), (b), and (c) as component A, the preferred amounts of component (a) are (a), (b),
It is 20% by weight or more, more preferably 50% by weight or more based on the total amount of (c). (a) When the amount of the component is too small, the desired antistatic performance cannot be obtained. Component A
When using (c) and (d) above, (c)
When the amount of the component is too small, the antistatic performance deteriorates, and when the amount is too large, the film becomes brittle. Therefore, the preferred range of the amount of component (C) is based on the combination of component (C) and component (D).
0% by weight, more preferably 30% by weight. Weight%.

The munonionic surfactant containing polydimethylsiloxy units and polyethylene oxide units, which is component a of component B, is a commonly used silicone surfactant, preferably a block copolymer, e.g. Nippon Unicar Co., Ltd. NU (E Silicon Y-7006
It is something like (product name). In addition, the nonionic surfactant containing a perfluoroalkyl group and a polyethylene oxide unit, which is component b of component B, is a nonionic type of ordinary fluorine surfactants, such as FO- 113/ is preferable.

A small amount of B is sufficient, and 0.07 to 3% by weight, more preferably 0.03 to 3% by weight based on the entire composition.
Weight%. Since these also serve as a leveling agent, there is no need to add a leveling agent to the resin composition.

In addition to the above A and B, a curing catalyst may be added if necessary.

That is, examples of curing catalysts for the curable resin composition include perchloric acid, hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, sulfonic acid, p-toluenesulfonic acid, boron trifluoride, and complexes thereof with electron donors. S nCr 14 + Z nC113.

FeCl3+ A7C13,5bO15+ Ti014
Lewis acids such as and their complexes. Acetic acid) IJum, naphthene! zinc.

Organic acid metal salts such as cobalt naphthenate, octylic acid, zinc, and tin octylate. Borofluoride metal salts such as zinc borofluoride and tin borofluoride. Boric acid organic esters such as ethyl borate and methyl borate.

Alkali such as sodium hydroxide and potassium hydroxide. Titanate esters such as tetrabutoxytitanium and tetraisoprop white boxytitanium. chromium acetylacetonate,
Metal acetylacetonates such as titanyl acetylacetonate, aluminum acetylacetonate, kobal, doacetylacetonate, and nickel acetylacetonate. Examples include amines such as n-butylamine, di-n-butylamine, tri-n-butylamine, guanidine, biguanide, and imidazole.

The amount of these curing catalysts added is 0.0! based on the solid content of the curable resin composition! ;-10% by weight, more preferably 0.
/-! ;% by weight.

Examples of solvents that may be included in the curable resin composition include alcohols, ketones, esters, ethers, cellosolves, halides, carboxylic acids, aromatic compounds, etc. Seven of these solvents may be included in the curable resin composition. Alternatively, it can be used as a mixed solvent of two or more kinds. Especially methanol,
ethanol.

Lower alcohols such as propa/-luain propatool and butanol. Cellosolves such as methyl cellosolve, ethyl heptarosolve, butyl cellosolve.

Lower alkyl carboxylic acids such as formic acid, acetic acid, and propionic acid. Aromatic compounds such as toluene and xylene.

It is preferable to use esters such as ethyl acetate and butyl acetate alone or as a mixed solvent.

Further, small amounts of antioxidants, ultraviolet absorbers, etc. can also be added.

The curable resin composition is coated on one or both sides by a commonly used coating method such as a dipping method, a spraying method, a roller coating method, or a flow coating method. C) By baking and curing at the following temperature for 20 minutes to j hours, it not only has antistatic properties but also
It is possible to obtain a plastic document support plate with excellent abrasion resistance, adhesion, and durability of the coating film.

Plastic substrates to which the present invention can be applied include polycarbonate, polymethyl methacrylate, polystyrene, polyester, and polyvinyl chloride. If adhesion is a particular problem, a primer treatment can provide a coating film with sufficiently effective adhesion.

The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited by these Examples.

Note that parts and percentages in the examples each represent 9% by weight.

The charging characteristics were evaluated as follows.The sample piece to be measured was washed with water and then cleaned with acetone.
It was left in a constant temperature and humidity room with 0% R, H, day and night, then loaded into a Honest meter manufactured by Hachinohe Shokai, and a voltage of 10 KV was applied for 30 seconds. Add 74 parts of ethylene glycol monoethyl ether (ioo parts of silane) and add 0.0 parts of silane without stirring. Add 9 parts of IN hydrochloric acid aqueous solution Otsu,
After continuing stirring for another 5 hours, the mixture was left to mature day and night. To this were added silicone block copolymer Y-7001° manufactured by Nippon Unicar ■, 11 parts of O, and Lt parts of ammonium perchlorate, and further diethylene glycol monoethyl ether'&JJu was added to make the total amount 66 parts of S.

The composition thus obtained was dip-coated on both sides of a flat plate made of poly(diethylene glycol bisallyl carbonate) with a thickness of jmm, H) cm x socm used for a document support plate for a copying machine, and then heated at / / O'C for 30 minutes. Burnt.

The half-life of the sample piece obtained is 0. was in seconds.

Example 2 r-glycidoxypropyltrimethoxysilane q,ti
q, p m, colloidal silica (Snowtex-C manufactured by Nissan Chemical Industries ■, solid content 20%) 33. ．． Mix 2 parts and 0 parts of 8-N aqueous hydrochloric acid solution and heat at 0°C for 5 minutes.
After refluxing for a period of time, the solvent of tag m is distilled at a temperature of 0 to 90°.
It was collected at C. The resulting solution contained 1/% r-glycidoxypropyltrimethoxysilane hydrolyzate and IO% colloidal silica calculated as SiO2.

A hydrolyzed solution of r-glycidoxypropyltrimethoxysilane containing the colloidal silica thus obtained /'l/, 0 parts, ethyl cellosolve/lI 9 parts, and ammonium perchlorate 0.7! 0.29 parts of 70 Lard FC-4/3/manufactured by Jujutsu 3M was added to prepare a paint. The above coating material was applied to a plate of diethylene glycol bisallyl carbonate polymer (trade name: CR-39) which had been washed in advance, and was cured by heating and drying in a hot air drying oven at 20'C/hour. Next, the half-life of the sample piece thus obtained was measured and found to be 0.7 seconds.

Example 3 79 parts of ethylene glycol monoethyl ether was added to methyltrimethoxysilane qoom, and the mixture was stirred in a cooling F. 10 parts of IN aqueous hydrochloric acid solution was added, and stirring was continued for an additional 7 hours. The resulting solution contained 3j% of hydrolyzate of methyltrimethoxysilane, calculated as CH35i01.5. To this was added 522 parts of ethyl silicate, and the mixture was further stirred under cooling for 7 hours, and 3 parts of ammonium perchlorate, 1 part of silicone block copolymer Y-700 manufactured by Nippon Unicar, and 3 parts of ethylene glycol monoethyl ether were added. did. The cured fi 41 fat composition thus obtained was applied onto a poly(diethylene glycol bisallyl carbonate) plate, and
It was cured by heating for 7 hours at 'C. When the half-life of this sample piece was measured, it was 0.13 seconds.

Example 1 9 g of r-glycidoxyprobyltrimethquine silane. 9
2 parts of ethyl silica), 1 ott, 0 parts of ethylene glycol monoethyl ether and 33.75 parts of ethylene glycol monoethyl ether were mixed well, and 0.0 parts was mixed without stirring. IN's HGI! , II9
．． 63 parts were dropped. To this ammonium perchlorate/, O
0.11 part of silicone bronc copolymer Y-700t manufactured by Nippon Unicar was added to prepare a paint. The above coating material was applied to a previously washed diethylene glycol bisallyl carbonate polymer (trade name: OR-,...?Wa) flat plate and cured by heating and drying in a hot air drying oven at 20 DEG C. for 1 hour. Next, the half-life of the sample piece thus obtained was measured and found to be 7.0 seconds.

Comparative Example To 410 parts of methyltrimethoxysilane was added ethylene glyfur monoethyl ether/9 st, t, while stirring under cooling. Iqo parts of IN aqueous hydrochloric acid solution was added, and stirring was continued for an additional 7 hours. The resulting solution was CH35i01.
It contained 35% hydrolyzate of methyltrimethoxysilane calculated as 5. To this, add 5.2 parts of colloidal silica (20% solid content of Snowtech Soo C2 manufactured by Nichichi Kagaku Kogyo ■), 3.3 parts of ammonium perchlorate, and 3 parts of silicone block copolymer manufactured by Nippon Unicar ■. Then, 11 parts of ethylene glyfur monoethyl ether was added. This was applied on a poly(diethylene glycol bisallyl carbonate) board and
It was heated and dried for 7 hours to harden it. Next, when an attempt was made to measure the half-life of the sample piece obtained in this manner, the charge was not reduced by half even after 70 minutes had passed, so the measurement was discontinued.

Claims (1)

[Scope of Claims] 1. A plastic document support plate having antistatic properties, the surface of which is coated with a curable resin composition containing the following A and B and cured. A, below a, b, c, d or e a, below (a) b, below (a) and (b) C1 below (a) and (c) d, below (a), (b) and (c) ) e, one or more silicon compounds selected from the following (c) and (d) (i) having a structure that can be represented by the following general formula (1) and/or a hydrolyzate thereof. 2b ■ Rla -Si -(OR3) 4-a-b (
/ ) (in the formula, R1 is an organic group having an epoxy group, R2 is hydrogen, a hydrocarbon group having carbon number/-4 or a vinyl group, R
3 is a hydrocarbon group having carbon number/~S. an alkoxyalkyl group or an acyl group having carbon number/~l,
a is 1-3. b is 0-j and a+'b≦3. ) (b) One or more types selected from metal oxide fine powders having a particle size of /~toomμ. (c) Seven or more compounds selected from compounds having a structure represented by the following general formula (2) and/
or its hydrolyzate. R4 R40-; M-0-R4 (co) R4 (In the formula, M is 7 or 2 or more selected from group O elements other than carbon, and R4 is a hydrocarbon group having carbon number/~10 9m
is an integer of 20) (d) Seven or more silicon compounds having a structure represented by the following general formula (3) and/or a hydrolyzate thereof. R5nSi<0R6) 4-4 (3) (wherein, R5 is a hydrogen atom or an organic atomic group not having an epoxy group + R6 is a hydrocarbon group, alkoxyalkyl group, or acyl group with carbon number /~IO, n is / (Integer of ~3) B, 7 or more types selected from the following a and/or b a, nonionic surfactants containing polydimethylsiloxy units and polyethylene oxide units. b. Seven or more nonionic surfactants containing a per-70-roalkyl group and a polyethylene oxide unit. 2. The document support plate according to claim 5, wherein M in the general formula (2) is silicon and/or titanium. 3. The manuscript support plate according to claim 1, wherein R1 in the general formula (1) is an atomic group containing a glycidoxy group. 4. Claim O1gA (wherein R
7r R8 is a carbon/~da hydrocarbon group, S is an integer of /~l, t is an integer of θ~3) 50, a silicon compound having a structure that can be represented by the above general formula (3) is methyltrial A document support plate according to claim 5, which is fukijisilane. 6. The document support plate according to claim 5, wherein the compound having a structure represented by the general formula (7) is an alkyl silicate. 7. The document support plate according to claim 1, which is a silicon compound glycidoxypropyltrimethoxysilane having a structure represented by the general formula (4'). 8. The document support plate according to claim 5, wherein the metal oxide fine powder is silica fine powder.