JPS59125646A - Manufacture of semiconductor single phase full-wave rectifier element - Google Patents

Abstract

PURPOSE:To simplify the steps of manufacturing a semiconductor single phase full-wave rectifier and to reduce the cost by punching a metal plate to integrally form a plurality of strips formed of a substrate supported to a frame and terminals and positively utilizing the frame as a waste in the steps. CONSTITUTION:Two strips 7 which are formed of a substrate 5 of substrantially square shape and terminals 6 by a method such as punching a metal plate, and two strips 9 which are formed of an L-shaped substrate 8 and terminals 6 are formed integrally with a frame 10, and semiconductor elements 11 are carried on both ends of the substrate 8. The elements on the adjacent different substrates via L-shaped conducting means 12 are connected so as to become the same voltage as the substrate 5 disposed between the elements. The terminals 6 side are bent substantially perpendicularly together with the frame 10 along a boundary A-A', cut to remove the frame 10 of unnecessary part, and a single phase full-wave unit rectifier is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a semiconductor single-phase full-wave rectifying device that is easy to manufacture. Conventionally, this type of semiconductor device has a structure as shown in a top view a and a side view of FIG. After forming an internal element by fixing the element fixing substrate 1, semiconductor element 2, and internal connection lead wire 3 one by one by soldering or welding, the internal connection lead wire 3 in the internal element is formed. Four of them were connected to the external lead-out terminals 4, wired as shown in FIG. 2, and sealed with resin to form a semiconductor single-phase full-wave rectifier unit element.

However, this method is not only cumbersome to manufacture but also increases cost, so it cannot meet the current demand for low-profile devices.

The present invention has been made in view of the above, and uses a method such as punching out a single metal plate to form two leather bands having substantially square substrates and two leather bands having L-shaped substrates into the same shape. After forming the L-shaped substrates integrally with the frame so that they are arranged alternately and facing each other, mounting semiconductor elements on both ends of the L-shaped substrates, and making a predetermined connection using a pair of L-shaped conductive means, Fold the terminal side of the adjacent skin strip along a series of boundaries between the board and the terminal at approximately right angles from the board to the frame, and then remove the unnecessary part of the frame to form a single-phase full-wave rectifier unit element. The object of the present invention is to provide a semiconductor single-phase full-wave rectifier that is easy to manufacture and inexpensive.

The present invention will be explained below using examples and drawings.

FIGS. 3a to 3d are assembly diagrams illustrating an embodiment of the present invention for constructing the single-phase full-wave rectifier circuit shown in FIG. 2. First, as shown in FIG. Two skin strips 9 made up of continuous terminals 6 are integrally formed with the frame 10 so that substrates of the same shape alternate and face each other, and semiconductor elements 11 are provided at both ends of the L-shaped substrate 8.
Equipped with In this case, since a single-phase full-wave rectifier circuit is configured, the polarity of the element is such that the polarity of the two elements located on both sides of the element are different, as shown in the schematic diagrams a and b of Fig. 4. In other words, It is necessary to ensure that elements of the same polarity are adjacent to each other. Next, as shown in FIG. 3 (1), a pair of L-shaped conductive means 12 is used to connect the elements on different adjacent substrates in a predetermined manner so as to have the same potential with each other and with the substrate 5 sandwiched between the elements. .

This L-shaped conductive means 12 is bent in advance to accommodate the difference in height between the element 11 and the substrate 5, as shown in the partial cross-sectional view of FIG.

Furthermore, the internal element configured as shown here is A-A'
Substrates 5.8 and W of adjacent skin bands 7 and 9 represented by
Along a series of boundaries with the jA-child 6, as shown in FIG.

After this, cut the B-B' part and remove the unnecessary part of the frame 1.
By removing 0, a single-phase full-wave rectifier unit element is constructed as shown in d of the same figure, and this is, for example, subjected to surface treatment and then housed in a molded case and sealed with resin, or resin-sealed by injection molding. Completed at the end.

In this way, according to the above embodiment, a single-phase full-wave rectifier unit element is constructed through a series of manufacturing processes, so the soldering process and cutting process per unit element are extremely simplified, allowing for mass production and reducing costs. be done. Furthermore, during the folding process of the leather band, the frame body is bent integrally with the leather band, so there is no irregularity in the bending position and bending angle of each leather band compared to the case where each leather band is folded one by one. But it's extremely streamlined. This is particularly effective when forming a plurality of sets of support bodies in a chain, which will be described later. Further, if a mark is provided in advance at the bending position of the frame, positioning at the time of bending can be facilitated.

FIGS. 6a to 6d show another embodiment of the present invention, in which the soldering process in the above embodiment is simplified. That is, as shown in Figure a, the L-shaped conductive means used in the above embodiment is replaced with a flexible L-shaped conductive means 13 according to this embodiment, and the central part is partially enlarged. As shown in the cross-sectional view, by caulking the substantially square substrate 5 with rivets 14, the element 1 is attached at both ends thereof.
1 is held in pressure contact with the substrate 8. As in the previous embodiment, after bending the terminal side from the board to the frame at a substantially right angle with the A-A' section as a boundary, the board part is immersed in a molten solder bath 15 as shown in FIG. method, or a molten solder bath 15 as shown in d of the same figure.
By the so-called solder bus method in which the substrate portion is slid on the upper surface of the substrate, the element 11, the substrates 5 and 8, and the conductive means 13 are connected by soldering and the caulked portions are fixed. Thereafter, the frame 10, which is an unnecessary part, is removed, thereby constructing a single-phase full-wave rectifying unit element.

According to the second embodiment, the semiconductor element is held in pressure contact with the flexible conductive means, and internal connections are made by the solder dip method or the solder bus method, so the soldering process is short. It is extremely simplified and assembly time is further reduced.

In addition, although the above embodiments have all described the configuration of the unit element, when applying this to actual production, the seventh
As shown in the figure, by forming a plurality of sets of skin bands 16 constituting a semiconductor single-phase full-wave rectifying unit element in a chain on a metal plate 17, a plurality of unit elements can be assembled at the same time to further reduce manufacturing costs. is preferred. In this case, it is highly effective that the frame 18 is included throughout the manufacturing process.

As is clear from the above description, according to the present invention, there is no need to solder or weld individual semiconductor elements one by one using lead wires and then assemble them, as is the case in the past. By punching out metal plates and integrally forming multiple skin strips consisting of circuit boards and terminals, and by actively using frames as waste material in the manufacturing process, we can achieve low cost through a rational and extremely simple process. A low-cost semiconductor single-phase full-wave rectifier is constructed.

[Brief explanation of the drawing]

1a and 1b are plan views and side views for explaining the conventional structure, FIG. 2 is a circuit diagram showing a single-phase full-wave rectifying DfE circuit,
FIGS. 3a to 3d are assembly diagrams for explaining one embodiment of the present invention, FIG. 4 is a schematic diagram showing the polarity of elements on the substrate, and FIG.
The figure is a partial sectional view showing the connection state of elements, and FIG. 6 is for explaining another embodiment of the present invention, a is a plan view, and b
7 is a partially enlarged sectional view, C and d are schematic views, and FIG. 7 is a plan view illustrating still another embodiment of the present invention. 5... Substantially square substrate, 6. Terminal, 7, 9. Leather band, 8.. L-shaped substrate, 10.. Frame, 11. Semiconductor element, 12. L-shaped conductive means. T1 Tsukuwa T2 Kuchiku T3 Kuchihisa Shiko
〆su 4 Kuchihisa T 6 Mihisa et al.C, (

Claims (1)

[Scope of Claims] 1) Two leather strips having substantially square substrates and two leather strips having L-shaped substrates are formed by punching a single metal plate or the like.
Two strips are integrally formed with the frame body so that substrates of the same shape are arranged alternately and facing each other, semiconductor elements are mounted on both ends of the strip-shaped substrate, and predetermined connections are made by a pair of L-shaped conductive means. After doing this, the terminal side is bent from the board along with the frame along a series of boundaries between the board and the terminal on the adjacent skin strip, and then the unnecessary part of the frame is cut off to form a single-phase full wave. A method for manufacturing a semiconductor single-phase full-wave rectifier, characterized in that it constitutes a rectifier unit element. 2. In the method described in claim 1, the L-shaped conductive means is flexible, and the element is attached to the L-shaped substrate by fixing its central portion to the substantially square substrate by caulking or the like. A method for producing a semiconductor single-phase full-wave rectifier, which comprises holding the terminal in pressure contact with the frame, bending the terminal together with the frame in this state, and then internally connecting the substrate portion by a solder dip method, a solder bus method, or the like. 3) A semiconductor unit characterized in that a plurality of sets of skin strips constituting a semiconductor single-phase full-wave rectifying unit element are formed in a chain on a metal plate in the method according to claim 1 or 2. A method for manufacturing a phase full-wave rectifier.