JPS59123393U - Plastic stakes for semiconductor devices - Google Patents

Plastic stakes for semiconductor devices

Info

Publication number
JPS59123393U
JPS59123393U JP1695283U JP1695283U JPS59123393U JP S59123393 U JPS59123393 U JP S59123393U JP 1695283 U JP1695283 U JP 1695283U JP 1695283 U JP1695283 U JP 1695283U JP S59123393 U JPS59123393 U JP S59123393U
Authority
JP
Japan
Prior art keywords
stick
semiconductor device
plastic
semiconductor devices
plastic stakes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1695283U
Other languages
Japanese (ja)
Inventor
織田　裕文
Original Assignee
新日本無線株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新日本無線株式会社 filed Critical 新日本無線株式会社
Priority to JP1695283U priority Critical patent/JPS59123393U/en
Publication of JPS59123393U publication Critical patent/JPS59123393U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のプラスティックスティックの断面図、第
２図は本考案スティックの一実施例を示す断面図である
。 ２・・・半導体素子、３・・・プラスティックスティッ
ク、３１・・・半導体素子２載置用突起、３２・・・半
導体素子位置決め用突起。FIG. 1 is a sectional view of a conventional plastic stick, and FIG. 2 is a sectional view showing an embodiment of the stick of the present invention. 2... Semiconductor element, 3... Plastic stick, 31... Semiconductor element 2 mounting protrusion, 32... Semiconductor element positioning protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を収納するため、内部を空洞にして、プラス
ティックで一体に形成した半導体素子用のスティックに
おいて、前記スティックの外形はほぼ四角形に形成し、
前記スティックの内部の下面には前記半導体素子を載置
する間隔にレール状に突起を二個形成し、前記スティッ
ク内部の上面は前記半導体素子の幅より広い間隔で二個
の突起を形成して内部に収納した前記半導体素子の横方
向の移動を制限する構造としたことを特徴とする半導体
素子用プラスチティックスティック゛。In a stick for a semiconductor device integrally formed of plastic with a hollow interior for storing a semiconductor device, the outside of the stick is formed into a substantially square shape,
Two rail-shaped protrusions are formed on the lower surface of the inside of the stick at an interval on which the semiconductor element is placed, and two protrusions are formed on the upper surface of the inside of the stick at an interval wider than the width of the semiconductor element. A plastic stick for a semiconductor device, characterized in that it has a structure that limits the lateral movement of the semiconductor device housed inside.
JP1695283U 1983-02-08 1983-02-08 Plastic stakes for semiconductor devices Pending JPS59123393U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1695283U JPS59123393U (en) 1983-02-08 1983-02-08 Plastic stakes for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1695283U JPS59123393U (en) 1983-02-08 1983-02-08 Plastic stakes for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS59123393U true JPS59123393U (en) 1984-08-20

Family

ID=30148201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1695283U Pending JPS59123393U (en) 1983-02-08 1983-02-08 Plastic stakes for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS59123393U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069814A (en) * 2012-09-28 2014-04-21 Nichia Chem Ind Ltd Packing method of light-emitting device and packed light-emitting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516440A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Storing jig for semiconductor device
JPS5545280B2 (en) * 1975-06-12 1980-11-17

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5545280B2 (en) * 1975-06-12 1980-11-17
JPS5516440A (en) * 1978-07-24 1980-02-05 Hitachi Ltd Storing jig for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014069814A (en) * 2012-09-28 2014-04-21 Nichia Chem Ind Ltd Packing method of light-emitting device and packed light-emitting device

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