JPS5911937Y2 - Electronic component transport device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component transport device, and particularly to an electronic component transport device having lead wires made of magnetic material such as iron or nickel.

Conventionally, when manufacturing electronic components such as semiconductors, capacitors, and resistors, the electronic components are transported within and between each manufacturing facility by placing them on a chain or belt conveyor. Since the devices are moved around, vibrations may cause them to fall during transportation, or lead wires may cross, causing inconveniences.

For example, in the case of glass-sealed diodes, lead wires are placed on a tray on a chain and transported, but if they fall off due to vibration or are placed diagonally, the lead wires may get stuck between the chains and become bent. However, it had the disadvantage of being narrowed by the drive gear.

In addition, the input of manufacturing equipment was restricted due to operational problems during transportation, resulting in poor efficiency.

The present invention was developed in view of the above-mentioned drawbacks, and its purpose is to improve the component transport mechanism and to provide an electronic component transport device that transports components in an aligned state and prevents dropping or bending of leads. It's on offer.

In order to achieve this purpose, the electronic component transport device according to the present invention uses a guide frame that forms a component transport path, and a plurality of electromagnets are attached to both sides of the guide frame. By energizing a corresponding pair of electromagnets on either side with an intermittent power supply, a moving magnetic field is created in the passage within the guide frame.

Therefore, each electronic component to be transported is attracted to the side wall of the guide frame, and is transported in an aligned state without vibration or pitch deviation occurring due to the moving magnetic field.

In addition, this device can be built into each device, and can also be easily joined into blocks to make it longer or shorter.

Also, the index can be freely set by changing the excitation power source.

Hereinafter, embodiments of the present invention will be described in detail in comparison with conventional examples.

In the figure, 1 is a glass-sealed diode in which a diode element is sealed in a glass tube 2.

On both sides of the glass tube 2, ferromagnetic lead wires 3 made of dumet wires having a copper-coated iron-nickel core wire extend.

The lead wire 3 is sealed with glass with the element clamped thereon, and then lead plating is applied.

Next, characteristics selection, product name stamping, inspection, packaging, etc. are carried out in accordance with diode characteristic standards, and the diode 1 is completed.

By the way, in order to transport the diode component 1 within and between manufacturing facilities during these glass sealing, lead plating, characteristic selection, and product name stamping processes, conventionally, the lead wires 3 on both sides of the diode 1 are connected as shown in FIG. A large number of trays 4 are placed on a chain 5 and transported mechanically, but due to vibrations during transport, the diode 1 may come off the chain 5 or be placed diagonally, causing damage to the inside of the equipment. The workpiece catcher 6 and the gear 7 used to transfer the wires between the equipment were not properly chucked, resulting in machining errors and bending of the lead.

FIG. 3 shows the electronic component transport equipment according to the present invention, and 8 is a marking machine for the diode 1.

The diode 1 stamped with the product name by the stamping machine 8 is led out to the electronic component transport device 10 according to the present invention by the chute 9.

As shown in FIG. 4, this conveying device 10 includes parallel guide frames 12.
It is composed of 3.

On both sides of this guide frame 12.13, a series of electromagnetic coils 14, 15 are disposed facing each other along the conveyance direction, and each electromagnetic coil 14.15 is provided with a ferromagnetic iron core 16, 17. are attached to form electromagnets 18 and 19, respectively.

The electromagnets 18 and 19 arranged opposite each other are connected to the guide frame 12 so that a parallel magnetic field is generated in the conveyance path 11 of the diode 1.
．． Electromagnetic coils 14 and 15 arranged opposite to each other are connected to the guide frame 13, and the electromagnet 18 of the guide frame 12 is configured as a north pole, and the electromagnet 19 of one guide frame 13 is configured as a south pole.

FIG. 5 is an improved version of FIG. 4, and is intended to provide a strong parallel magnetic field in the transport path 11 of the diode 1.

In this conveying device 20, iron cores 18, 19 are attached to each electromagnetic coil 14, 15 of the conveying device 10 in FIG.
One U-shaped iron core 21 is replaced with an integrated U-shaped iron core 21.
It is shaped by a letter-shaped electromagnet 22.

The parallel guide frames 12 and 13 that form the conveyance path 11 of the diode 1 surround these U-shaped electromagnets 22 and are integrated as the exterior of the conveyance device 20, and are made by bending and shaping a non-magnetic stainless steel plate. It is shaped like this.

Since this device uses the U-shaped electromagnet 22 in this way, for example, the electromagnetic coils 14 and 15 are connected so that the guide frame 12 side is the north pole and the guide frame 13 side is the south pole, and the conveyance path of the diode 1 is connected. 11, a strong parallel magnetic field is obtained.

A series of electromagnetic coils 14 of the component transport devices 10 and 20
Although not shown, and 15 are connected to a DC power source that supplies an excitation current to each coil, and this excitation current creates a constant parallel magnetic field on the conveyance path.

Furthermore, a DC pulse power source is connected to these coils 14, 15, and this power source supplies different excitation currents in the transport direction, superimposing them on the parallel magnetic field to obtain a moving magnetic field.

In this structure, the operation of the present apparatus will be described in detail. First, the diode 1 is led out from the marking machine 8 via the chute 9 to the electronic component conveying apparatus 10.

Since the lead wire 3 of this diode 1 is a magnetic material, the parallel magnetic field of the conveyance path 11 of the device 10 causes
They are attracted to the electromagnet 19 (N pole) of the guide frame 12 and the electromagnet 19 (S pole) of the guide frame 13 and are aligned.

The magnetic force of this parallel magnetic field is strong enough to hold the diode 1 in space, and the diode 1 is attracted with the tip of the lead wire 3 in contact with or not in contact with the guide frame 12 or the guide frame 13.

Next, in this state, a DC pulse power source is applied to the electromagnetic coils 14.15 arranged in large numbers on the guide frame 12.13.
A variable excitation current is applied in the transport direction, and the diode 1
Since a moving magnetic field is generated in the transport direction in the transport path 11, the diodes 1 are attracted by this moving magnetic field and move in the direction of the arrow shown in the figure in an aligned state.

FIG. 6 shows another embodiment of the present invention in which the moving magnetic field of the conveying device 10 or 20 is easily obtained.

In the figure, the position of the transport device and the strength of the parallel magnetic field applied corresponding to each position are shown.

In other words, during the first half cycle, the conveying device has a parallel magnetic field that gradually increases between A and C, as shown in A, and a parallel magnetic field that gradually increases between D and F.
A magnetic field that gradually increases at regular intervals and a constant magnetic field are alternately arranged and applied, including a constant parallel magnetic field between them and a parallel magnetic field that gradually increases between G and ①.

In the next half cycle, as shown at the top, a constant parallel magnetic field is applied between A and C, a parallel magnetic field that gradually increases between D and F, and a constant parallel magnetic field is applied between G and I.

In this way, the magnetic field is reversed every half cycle, so when diode 1 is led out to point A, diode 1 reaches point C in half a cycle due to the gradually increasing magnetic field between A and C.

This diode reaches point F in the next half cycle with a progressively increasing magnetic field between D and F.

In this way, according to this embodiment, the range where the strength of the parallel magnetic field is gradually increased at regular intervals and the range where the magnetic field is constant are arranged alternately,
By reversing and applying these every half cycle,
The same effect as the above-mentioned moving magnetic field can be obtained.

In this case, compared to the above-mentioned method of obtaining a moving magnetic field by varying the current, the power supply device is simpler because the method is reversed.

Since the present invention is structured as described above, the electronic components are smoothly aligned and transported, and there is no possibility of them falling off due to vibration or crossing each other diagonally.

Furthermore, the index can be freely set by adjusting the moving magnetic field.

Furthermore, since this device uses moving parallel magnetic fields,
By dividing the conveying device into blocks of a certain length, the length can be freely increased or decreased, and it can be used for conveying parts within each piece of equipment or between pieces of equipment.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a glass-sealed diode, FIG. 2 is a diagram illustrating the transport state of a glass-sealed diode using a conventional component transport device, and FIG. 3 is a perspective view of a component transport device according to the present invention. Figure 4 is a sectional view of the main part seen from line I■-I■ in Figure 3.
FIG. 5 is a diagram corresponding to FIG. 4 in another embodiment of the present invention, and FIG. 6 is a diagram illustrating a moving magnetic field applied to the conveying device in another embodiment of the present invention. 1...Electronic components (glass sealed diode), 3...
Magnetic lead wire, 10.20...Electronic component transport device,
11... Conveyance path, 12.13... Guide frame,
18,19.22...Electromagnet.

Claims (1)

[Scope of utility model registration request] It is equipped with a guide frame that forms a conveyance path for electronic components having magnetic material lead wires, and a plurality of electromagnets arranged on both sides of this guide frame, and the opposing electromagnets of the guide frame are paired and variable for each pair. 1. An electronic component conveyance device, characterized in that the electronic component is moved by being excited by a power source to form a moving magnetic field in the conveyance path within the guide frame.