JPS59117199U - Taping body of semiconductor device - Google Patents
Taping body of semiconductor deviceInfo
- Publication number
- JPS59117199U JPS59117199U JP1137083U JP1137083U JPS59117199U JP S59117199 U JPS59117199 U JP S59117199U JP 1137083 U JP1137083 U JP 1137083U JP 1137083 U JP1137083 U JP 1137083U JP S59117199 U JPS59117199 U JP S59117199U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- taping
- taping body
- recorded
- electronic filing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来の半導体装置のテーピング体を示す正面
図、第２図は、本考案の一実施例を示す図、第３図は半
導体装置の形状が異なる場合に適用した本考案に係る他
の実施例を示す図である。
１・・・・・・半導体装置、２・・・・・・台紙、３・
・間外部リード、４・・・・・・粘着テープ、５・・・
・・・層間紙、６・・藺導電性材料。FIG. 1 is a front view showing a taping body of a conventional semiconductor device, FIG. 2 is a view showing an embodiment of the present invention, and FIG. 3 is a diagram showing the present invention applied to cases where semiconductor devices have different shapes. It is a figure which shows another Example. 1... Semiconductor device, 2... Mount, 3.
・Inter-external lead, 4...Adhesive tape, 5...
... interlayer paper, 6... conductive material.
Claims (1)
の少なくとも一部に導電性材料を用いたことを特徴とす
る半導体装置のテーピング体。A taping body for a semiconductor device, characterized in that a conductive material is used for at least a part of the taping material used for taping the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137083U JPS59117199U (en) | 1983-01-28 | 1983-01-28 | Taping body of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137083U JPS59117199U (en) | 1983-01-28 | 1983-01-28 | Taping body of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117199U true JPS59117199U (en) | 1984-08-07 |
Family
ID=30142798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1137083U Pending JPS59117199U (en) | 1983-01-28 | 1983-01-28 | Taping body of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117199U (en) |
-
1983
- 1983-01-28 JP JP1137083U patent/JPS59117199U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (en) | semiconductor equipment | |
| JPS59117199U (en) | Taping body of semiconductor device | |
| JPS5858342U (en) | hybrid integrated circuit | |
| JPS6117751U (en) | Tape carrier semiconductor device | |
| JPS58123576U (en) | Lead wire for circuit element airtight package | |
| JPS58120661U (en) | semiconductor equipment | |
| JPS6045446U (en) | semiconductor equipment | |
| JPS59161803U (en) | Electrode lead wire fixing device for electrocardiograph | |
| JPS593600U (en) | taped electronic components | |
| JPS58187156U (en) | integrated circuit container | |
| JPS5974744U (en) | Shape of leads in semiconductor devices for taping | |
| JPS59107152U (en) | Lead frame for semiconductor devices | |
| JPS59169047U (en) | integrated circuit elements | |
| JPS616289U (en) | Socket for semiconductor device | |
| JPS59185851U (en) | Semiconductor integrated circuit device | |
| JPS5874395U (en) | taping parts | |
| JPS58182427U (en) | Envelopes for semiconductor devices | |
| JPS5874329U (en) | chip electronic components | |
| JPS59173349U (en) | semiconductor equipment | |
| JPS6112299U (en) | Tape for taping semiconductor devices | |
| JPS59151280U (en) | display device | |
| JPS5811813U (en) | flat insulated wire | |
| JPS58166099U (en) | electronic components | |
| JPS6059598U (en) | IC magazine | |
| JPS60137760U (en) | Cable winding paper reel |