JPS59117176U - Printed board unit for high-density mounting - Google Patents
Printed board unit for high-density mountingInfo
- Publication number
- JPS59117176U JPS59117176U JP1080983U JP1080983U JPS59117176U JP S59117176 U JPS59117176 U JP S59117176U JP 1080983 U JP1080983 U JP 1080983U JP 1080983 U JP1080983 U JP 1080983U JP S59117176 U JPS59117176 U JP S59117176U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- board unit
- density mounting
- reinforcing plate
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図と第２図はプリント板へチップ部品を取り付けた
従来の実施例、第３図はこの考案による実施例の構成図
、第４図はこの考案による実施例の部品実装図、第５図
と第６図は２ら折り部分６６の組立断面図例。
１・・・・・・プリント板、２・・・・・・チップ部品
、３・・・・・・プリント板、４・５・・・・・・チッ
プ部品、６・・・・・・フレキシブルプリント板、７・
・・・・・補強板、８・・・・・ゼス、２１・・・２６
・・・・・・チップ部品、６１・・・・・・カバーレイ
、６２・・・・・・導体、６３・・・・・・フィルム材
、６４・・・・・・導体、６５・・・・・・カバーレイ
、６６・・・・・・２つ折り部分。1 and 2 are conventional embodiments in which chip components are attached to a printed board, FIG. 3 is a configuration diagram of an embodiment according to this invention, FIG. 4 is a component mounting diagram of an embodiment according to this invention, and FIG. This figure and FIG. 6 are examples of assembled cross-sectional views of the bifold portion 66. 1... Printed board, 2... Chip parts, 3... Printed board, 4, 5... Chip parts, 6... Flexible. Printed board, 7.
...Reinforcement plate, 8...Zess, 21...26
... Chip parts, 61 ... Coverlay, 62 ... Conductor, 63 ... Film material, 64 ... Conductor, 65 ... ...coverlay, 66...bifold part.
Claims (1)
を２つ折りにし、前記プリント板で前記補強板を挾むよ
うにして保持することを特徴とする高密度実装用プリン
ト板ユニット。[Claims for Utility Model Registration] A flexible printed board on which components are mounted on one side, and a reinforcing plate for the printed board, the printed board is folded in half so that the component mounting surface is on the outside, and the A printed board unit for high-density mounting, characterized in that the reinforcing plate is held between printed boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080983U JPS59117176U (en) | 1983-01-28 | 1983-01-28 | Printed board unit for high-density mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1080983U JPS59117176U (en) | 1983-01-28 | 1983-01-28 | Printed board unit for high-density mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117176U true JPS59117176U (en) | 1984-08-07 |
Family
ID=30142244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1080983U Pending JPS59117176U (en) | 1983-01-28 | 1983-01-28 | Printed board unit for high-density mounting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117176U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117266U (en) * | 1984-12-29 | 1986-07-24 | ||
| JPS62259499A (en) * | 1985-11-22 | 1987-11-11 | 三菱鉱業セメント株式会社 | Ceramic laminated board which has conductor layer at its endsurfaces and in ts inside |
-
1983
- 1983-01-28 JP JP1080983U patent/JPS59117176U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117266U (en) * | 1984-12-29 | 1986-07-24 | ||
| JPS62259499A (en) * | 1985-11-22 | 1987-11-11 | 三菱鉱業セメント株式会社 | Ceramic laminated board which has conductor layer at its endsurfaces and in ts inside |
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